Westinghouse Electric Corporation

William M Alvino

Timothy J Fuller

Luciano C Scala

Edward Jean Lahoda

David C Phillips

David C Grant

William A Byers

Robert D Burack

Leonard E Edelman

Louis A Cargnel

Lawrence W Frost

Martin P Seidel

Ram S Raghava

Janet L Hammill

A borated aqueous solution from a nuclear reactor coolant system dilute chemical-decontamination process or from an equipment washing process which has been contaminated with radioactive metals or heavy metals including cobalt, nickel, chromium, iron, manganese, lead or mercury and with a chelating agent, detergent or soap is treated with an oxidizing agent to oxidize the chelating agent, detergent or soap and to precipitate the contaminant metals. The contaminant metals are then separated from the solution by centrifugal filtration, micromembrane belt filtration or magnetic separation. Advantageously, a very small volume of precipitate may then be buried and the decontaminated solution may be recycled or further treated and released for other uses.

Method of treating a contaminated aqueous solution

Disclosed is an emulsion having a discontinuous phase which comprises at least two compounds of different structural formula selected from the group consisting of solvent-soluble polymers, oligomers, and monomers dissolved in an organic solvent, and a discontinuous phase which comprises an organic non-solvent for the compounds. A method of coating a conductor with a polymeric alloy is also disclosed. The conductor is immersed in the emulsion and a direct current is applied between the conductor and the emulsion sufficient to cause the discontinuous phase of the emulsion to migrate to the conductor and deposit on it. The conductor is removed from the emulsion and is dried and the deposit is cured.

Emulsions for electrodepositing polymeric alloys and copolymers

Disclosed is a method of making an adhesive comprising forming a first composition of a polyesterether glycol having the general formula ##STR1## where R.sub.1 and R.sub.2 are each independently selected from alkylidene from C.sub.1 to C.sub.10, and n is about 1 to about 5 about 0.01 to about 1% by weight (based on the weight of the polyesterether glycol) of a catalyst, and sufficient solvent for said adhesive to have at least 50% solids, forming a second composition of about 0.85 to about 0.95 mole % of a diisocyanate and about 0.15 to about 0.05 mole % of a polyisocyanate, and mixing the first and second compositions together. The adhesive is applied to a first substrate, the solvent is evaporated, and a second substrate is pressed against the adhesive on the first substrate to form a flexible laminate.

Adhesive, bonding method employing same, and product produced thereby

Disclosed is a method of making a laminate by electrophoretically coating a flat mat made from a material selected from graphite, carbon, and mixtures thereof with an electrophoretable polymer in a non-aqueous system. The polymer is cured and the mat is impregnated with a thermosetable impregnating resin. The impregnating resin is B-staged to form a prepreg and several prepregs are stacked and cured under heat and pressure to form the laminate. Also disclosed is a laminate made by this method.

Reinforced composites made by electro-phoretically coating graphite or

Disclosed is a method of electrophoretically depositing a coating of polysulfones or polyethersulfones on a conductive substrate. An amine-free solution is formed in an organic solvent of the polysulfones or polyethersulfones. An emulsion is formed by combining the solution with an organic non-solvent for the polymer which contains up to about 0.6 parts by weight of an organic nitrogen containing base per parts by weight of the polymer. A direct current is applied between a conductive substrate and the emulsion which results in the deposition of the polymer on the substrate.

Electrophoretic deposition of sulfone-containing polymers

Disclosed is an electrodepositable emulsion which comprises a soluble un-ionized polymer containing an amic acid or amide linking group, a non-electrolyzable organic solvent for the polymer and a non-electrolyzable organic non-solvent for the polymer. The weight ratio of the solvent to the non-solvent is about 0.1 to about 0.5 and the polymer is about 0.4 to about 5% by weight of the weight of the solvent. No amine or surface active agent is used. A workpiece is coated with the polymer by placing it into the emulsion about one-half to about two inches away from the cathode. Constant dc voltage is applied between the cathode and the workpiece until a coating of a desired thickness has been deposited on the workpiece. The workpiece is then removed, dried, and cured.

Amine-free and surfactant-free electrodeposition of polyesters, polyamic

Disclosed is a method of making a non-aqueous emulsion from which a polymer can be electrodeposited. A mixture is prepared of about 50 to about 150 parts by weight of a non-aqueous organic, non-electrolizable, non-solvent for the polymer with about 0.8 to about 1.2 parts by weight of a nitrogen-containing base which can be a tertiary amine, an imidazole, or mixture of a tertiary amine and an imidazole. To the mixture is added a solution of 1 part by weight of the polymer which can be a polyamic acid, a polyamide imide, a polyimide, a polyparabanic acid, a polysulfone, or a mixture of these polymers. The polymer is in a non-aqueous, organic, non-electrolizable aprotic solvent such as N-methyl-2-pyrrolidone.

Method of preparing electrophorettable polymer emulsions

Aqueous emulsions of epoxy resins, which can be used to treat glass cloth used in the preparation of printed circuit board laminates, are produced by combining an epoxy resin and a flame retardant phenol, such as tetrabromobisphenol A, with a selected nonionic surface active agent, such as an alkylaryl polyether alcohol, monomethylol dicyandiamide curing agent and, if needed, a catalyst.

Flame-resistant aqueous epoxy impregnating compositions containing

A resin impregnated, B-staged sheet material free of crystal formations, useful for metal clad and unclad laminate production, is made by impregnating a sheet containing a resin comprising epoxy resin and an amount of curing agent effective to cure the epoxy resin to the C-stage, where the curing agent consists essentially of the reaction product of dicyandiamide and an aminophylic reagent selected from the group consisting of aldehydes, alkyl monoglycidyl ethers having the formula: ##STR1## where R=an alkyl group having from 1 to 4 carbon atoms, styrene oxide, ethylene oxide, propylene oxide, acetic anhydride, benzoyl chloride, acetyl chloride, and mixtures thereof, and then heating the impregnated sheet until the resin is in the B-stage.

Moisture resistant laminates impregnated with an impregnating

An adhesive composition free of free-radical catalysts is disclosed comprising hydroxy terminated 1,2-polybutadiene, a diisocyanate, and either styrene, vinyl toluene, or a mixture thereof. The adhesive composition is A-staged whence a free-radical catalyst is added. A material such as a film or fibrous reinforcement is coated with the composition and the composition is B-staged. The coated material can be cured during lamination with copper in a heated nip roll.

Adhesive

Amide-imide polymers formable in deep section and prepared by the condensation reaction of at least one of a diacid halide or a polyanhydride or equivalent, and a diamine containing at least one imide linkage. Soluble amide-imide polymers having the general formula: ##STR1## where n is an integer greater than 10 and preferably greater than 20. A novel amine having the general structural formula: ##STR2## wherein: A is selected from the group consisting of --R'-- and ##STR3## R is a trivalent organic radical in which the two valences included in the imide ring are attached to adjacent carbon atoms and the third valence is attached to a different carbon atom,

Amide-imide polymers

A solution is prepared of about 30 to about 60 mole percent of a mono-ester of a tricarboxylic anhydride or a diester of a tetracarboxylic acid and about 40 to about 70 mole percent of a dianhydride. An aromatic diisocyanate is added and the solution heated until the viscosity no longer increases. The precursor can be precipitated by the addition of a non-solvent, collected, and re-dissolved in a solvent. The solution of the precursor can be applied to a sheet and cured to form a polyimide or polyamide-imide film, or it can be applied to a wire and cured to form a polyimide or polyamide-imide wire enamel.

Polyimide and polyamide-imide precursors prepared from esters,

Monomers having both an amine group and an anhydride or two carboxylic acid or salt groups are electropolymerized in solution. In an alcohol solvent the polymer forms as a coating on the anode, and in an aprotic solvent the polymer remains in solution. The polymer is cured to form a polyimide.

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Penn Hills, PA, United States of America

William M Alvino