International Business Machines Corporation

William Lafer

Donald G McBride

James V Ellerson

Keith A Snyder

Charles E Gazdik

Richard B Hammer

Eugene P Skarvinko

Robert J Clementi

William A Donson

Joel V Munson

Roy L Lovesky

A process for providing circuit lines on a substrate having a non-planar surface is provided. The process includes applying a layer of photoresist material to the substrate, selectively screen printing on non-planar areas of the substrate a screen-printable coating, photoprocessing the layer of photoresist material, and providing electrical conductive pattern on the substrate.

Providing circuit lines on a substrate

A method is disclosed for making circuitized, flexible film substrates in a continuous tape format using a transfer technique. The tape is made with window-like openings having a relatively thin layer of polyimide spanning the openings. The relatively thin layer of polyimide is transferred to the tape from a metal carrier foil, preferably by using a special adhesive system. After the polyimide is transferred to the tape, the polyimide spanning the window-like openings in the tape is circuitized to form individual, circuitized, flexible film substrates which may be handled in the tape format for further processing. Preferably, the tape includes perforations for engaging sprockets of automated manufacturing equipment, or the like.

Flexible film semiconductor chip carrier

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Chenango Bridge, NY, United States of America

William Lafer