Other

Tyco Electronics Power Systems, Inc.

Zierick Manufacturing Corporation

William L Woods

Thang Danh Truong

Robert Joseph Roessler

Janos Legrady

Matthew Anthony Wilkowski

Robert James Catalano

Yi Teh Shih

Galliano Ricardo Busletta

Paul Joseph Offer, Jr

Raymond W Pilukaitis

Jon P Martin

Clifton L Lindsey

Richard D Lytle

There is provided electrical contact for circuit boards. Each leg of the pin section has a deformable segment that can expand or contract along the direction of the leg to alleviate stress created by relative movement of printed circuit boards and/or off-board components interconnected thereby. The deformable segments have members that project in opposing directions relative to the direction of the leg, so that the segments are symmetrical. In one embodiment, each leg has a deformable segment having a outwardly curved shape. In another embodiment, each leg has a deformable segment in the shape of a rectangular frame. The deformable segments define at least one opening where the two legs of the pin section are not overlapping, which breaks the capillary flow of solder between the legs. The amount of solder that flows into the electrical contact is selectively controlled by the selected placement of the deformable segments.

Compliant surface mount electrical contacts for circuit boards and method of making and using same

A magnetic device is provided that may be employed with surface mount technology. In an advantageous embodiment, the magnetic device includes a magnetic core having a magnetic core half and a springable winding positioned about at least a portion of the magnetic core half. The springable winding includes a terminus biased against the magnetic core half.

Magnetic device having a springable winding

The present invention provides a method for soldering components to a printed wiring board. In one embodiment, the method comprises applying a substantially lead-free solder to the printed wiring board, placing an electronic component having lead-free terminals on the solder, and heating the printed wiring board in a substantially oxygen-free atmosphere to a temperature sufficient to reflow the solder. In an alternative embodiment, the method may further comprise applying a tin-based solder. In a particularly advantageous embodiment, the method includes applying a solder alloy of tin and a metal selected from the group consisting of: silver, antimony, copper, and gold.

Lead-free solder process for printed wiring boards

Growing community of inventors

Kaufman, TX, United States of America

William L Woods