Heaters Engineering, Inc.

William L Lock

Dennis L DuBois

A heater apparatus includes a substrate, a resistive film formed on a first portion of the substrate, and first and second conductive leads formed on the substrate engaging the resistive film. First and second electrodes are coupled to the first and second conductive leads, respectively. The heater apparatus also includes an overmolded body made of an insulating material formed on the substrate to encapsulate the resistive film, the first and second conductive leads, and a portion of the first and second electrodes in an insulating material. The substrate is formed to include first and second apertures in close proximity to the first and second conductive leads, respectively. The first and second electrodes each include a tab portion extending through the first and second apertures, respectively. The tab portions are deformed so that the tab portion of the first electrode engages the first conductive lead and the tab portion of the second electrode engages the second conductive lead. The apparatus further includes a resistive film formed on a second portion of the substrate, and third and fourth conductive leads formed on the substrate engaging the resistive film on the second portion of the substrate. An electrical component is electrically coupled to the third and fourth conductive leads. The overmolded body is configured to surround at least a portion of the electrical component in insulating material to couple the electrical component to the heating apparatus.

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North Webster, IN, United States of America

William L Lock