Trw Limited

Other

Northrop Grumman Systems Corporation

William L Jones

Dean Tran

Edward A Rezek

Eric R Anderson

Barry Ross Allen

Harvey N Rogers, Jr

Ronald A DePace

Harvey Newell Rogers

Rahul Dixit

George J Vendura, Jr

Salim Akbany

Fred R Smith, Jr

Roosevelt Johnson

Juan C Carillo

Bradford L Nelson

An apparatus, system, and method for the secure attachment and restraint of a pipe end within a fitting is disclosed. The invention includes a mechanical restraint apparatus that is integral and monolithic with the flange of a bell of a spigot-and-bell joint architecture, along with one or more internally disposed grooves within the bell that receive a circumferential gasket, in order to maintain a seal about the pipe end when it is inserted into the bell. The inventive apparatus combines features of mechanical connections and push-on connections.

Mechanically restrained push-on pipe connection

A relatively simple and inexpensive process for plating precious alloyed metals, such as AuSn, AuSnIn, AgSn, AuIn and AgIn. Anodes are formed from each of the metal components in the alloy and disposed in a conducting solution. The mass of each metal components is determined by Faraday's law. The target is also disposed in the conducting solution. Plating current is independently applied to each anode. The plating is conducted under an ultraviolet light sources to optimize the process. The plating alloys can be used for various purposes including attaching a semiconductor die to a substrate. Since the process does not involve exposure of the semiconductor die to a relatively high temperature for a relatively long time, the process does not pose a risk of contamination of the semiconductor by the adhesive or wax used to hold the die in place on the carrier during processing. Moreover, unlike earlier known processes which utilize epoxy, the precious alloyed metals do not wet the entire die but only the metal contact areas, thus avoiding potential short circuit to the die.

Precious alloyed metal solder plating process

A resonant photodetector assembly ( ) which uses multiple reflections of light within a photodetector ( ) to convert input light into an electrical signal. The photodetector ( ) includes a combination of generally planar semiconductor layers including a photodetector active layer ( ) where light is converted into an electrical output. The photodetector ( ) further includes a first outer electrical contact layer ( ) and a second outer electrical contact layer ( ). A waveguide ( ) is positioned on the photodetector ( ) and has a waveguide active layer ( ) positioned between a pair of waveguide cladding layers ( ), a first end ( ) for receiving input light and a second end ( ) for reflecting the light. A reflector ( ) is positioned on the second end ( ) of the waveguide ( ) at an angle relative to a line parallel to the substrate ( ), where the reflector ( ) reflects the light received by the first end ( ) of the waveguide active layer ( ) towards the photodetector ( ). A reflector ( ) is positioned on the second outer layer ( ) of the photodetector ( ) and provides a reflective surface for reflecting the light within the photodetector ( ).

Resonant photodetector

A solar cell comprises a superstrate formed from a material that is transparent to light, a first layer formed of delta doped silicon, a plurality of layers formed from semiconductor materials, each characterized by multi-quantum wells and multiple band gaps, a first semiconductor layer having a band gap energy state that is the smallest, the last semiconductor layer having-a band gap that is the largest, and the intermediate semiconductor layers having band gaps transitioning from the smallest to the largest, a second layer overlying the semiconductor layers and formed of delta doped silicon, an n-cap layer formed on the second delta doped layer, and a metal layer formed on the n-cap layer and serving to reflect light into the semiconductor.

Solar cell having multi-quantum well layers transitioning from small to large band gaps and method of manufacture therefor

A resonant photodetector assembly (,) which uses multiple reflections of light within a photodetector (,) to convert input light into an electrical signal. The photodetector (,) includes a combination of generally planar semiconductor layers including a photodetector active layer (,) where light is converted into an electrical output. The photodetector (,) further includes a first outer electrical contact layer (,) and a second outer electrical contact layer (,). A waveguide (,) is positioned on the photodetector (,) and has a waveguide active layer (,) positioned between a pair of waveguide cladding layers (,), a first end (,) for receiving input light and a second end (,) for reflecting the light. A reflector (,) is positioned on the second end (,) of the waveguide (,) at an angle relative to a line parallel to the substrate (,), where the reflector (,) reflects the light received by the first end (,) of the waveguide active layer (,) towards the photodetector (,). A reflector (,) is positioned on the second outer layer (,) of the photodetector (,) and provides a reflective surface for reflecting the light within the photodetector (,).

A cord or cable lock for preventing a cord or cable from being accidentally pulled out of a socket of a musical instrument, due to tugs on the cable or cord, is disclosed. The cable lock is in the form of a strip which is curled or curved at one end to give a J-shaped profile to the cable lock. Near the end distal from the curved portion, the cable lock has a hole which allows the cable lock to be mounted to a musical instrument using a screw. The curved portion of the cable lock surrounds the cable and frictionally grips the cable to keep tugs on the cable from being transmitted to a plug at the end of the cable. Thus the plug is prevented from being pulled out of the socket in the musical instrument.

Musical instrument cable lock

A micromirror device (,) is provided with a rotatable optical component (,) for use in a digital image processing application. The micromirror device (,) includes a semiconductor wafer (,), having a recess (,) formed therein, and a platform (,) with the optical component (,) deposited thereon that is movably coupled to the side surface of the recess (,). A first magnetic field source (,) is disposed around the periphery of the optical component (,) on the platform (,) and a second magnetic field source (,) is disposed proximate to this first magnetic field source (,), such that these magnetic field sources are selectively activatable to generate an electromagnetic field for rotating the platform (,). More specifically, the second magnetic field source (,) is disposed on the angular side surfaces of the recess (,) or adjacent to the recess (,) on a top surface of the wafer (,). A magnetic strip (,) may optionally be disposed on the bottom surface of the recess (,) for concentrating the electromagnetic field.

Electromagnetic force controlled micromirror array

A photosensitive photoresist material which is effective for use as an ion etch barrier layer after patterning. The photoresist composition includes the reaction product of a compound having the general formula R.sub.1 --COO--(CH.sub.2).sub.n --O--R.sub.2 and a silylating agent.

Chemically treated photoresist for withstanding ion bombarded processing

An active load applied to the gate transmission line termination of distributed power devices reduces the low frequency noise power appearing at the output of the device. The active load, including at least one active device such as a field effect transistor, operates by transforming the input impedance of a low noise amplifier to the desired load impedance. The active load is connected to one end of an input transmission line having a plurality of impedances connected in electrical series. An input terminal is connected to the opposite end. An output transmission line, also having a plurality of impedances connected in series, has an output terminal at one end and a terminating output impedance at the other. A plurality of active devices are connected to junction points between the series connected impedances of the input and output lines.

Active load applications for distributed circuits

A portable door secure system which consists of an elongate shank with a foot component coupled to a lower end of the shank for engaging a floor in front of a door and a yoke component coupled to an upper end of the shank for engaging an underside of a door knob on the door. The shank can be positioned at an angle between the door knob and the floor, to jam the door closed to prevent the door from being opened inwardly toward the side on which the device resides. The device disassembles into a very small compact light weight set of components so that it may easily be carried by a user typically a hotel or motel patron.

Growing community of inventors

Inglewood, CA, United States of America

William L Jones