Lambda Technologies, Inc.

The University of North Carolina at Chapel Hill

William L Geisler

Richard S Garard

Zakaryae Fathi

Iftikhar Ahmad

Howard M Reisner

Joseph M Wander

Systems and methods for neutralizing pathogen-contaminated mail pieces via variable frequency microwave processing are provided. Mail pieces are initially screened to identify suspicious characteristics or indications of potentially harmful contents. Mail pieces are swept with variable frequency microwaves selected to neutralize pathogens contained within each mail piece without harming the mail piece or other contents thereof. The temperature of each mail piece may be monitored during microwave processing to identify mail pieces containing potentially harmful substances and/or devices. Mail pieces can be irradiated via additional forms of radiation to neutralize pathogenic material on outside surfaces thereof.

Systems and methods for processing pathogen-contaminated mail pieces

In-situ and post-cure methods of joining optical fibers and optoelectronic components are provided. An in situ method of joining an optical fiber to an optoelectronic component includes positioning an optical fiber and optoelectronic component in adjacent relationship such that light signals can pass therebetween, applying a curable resin having adhesive properties to an interface of the optical fiber and the optoelectronic component, aligning the optical fiber and optoelectronic component relative to each other such that signal strength of light signals passing between the optical fiber and the optoelectronic component is substantially maximized, and irradiating the interface with non-ionizing radiation in RF/microwave energy to rapidly cure the resin. A post-cure method of joining an optical fiber to an optoelectronic component includes positioning an optical fiber and optoelectronic component in adjacent relationship such that light signals can pass therebetween, applying a curable resin having adhesive properties to an interface of the optical fiber and the optoelectronic component, aligning the optical fiber and optoelectronic component relative to each other such that the signal strength of light signals passing between the optical fiber and the optoelectronic component is substantially maximized, and irradiating the interface with microwave energy to partially cure the resin. The joined components are then transferred to a curing oven to fully cure the adhesive resin.

Methods and apparatus of joining optically coupled optoelectronic and fiber optic components using electromagnetic radiation

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Lake Oswego, OR, United States of America

William L Geisler