Keithley Instruments, Inc.

Mesatronic S.a.

William Knauer

Wayne C Goeke

James A Niemann

Martin J Rice

Vincent Reynaud

William F Merkel

Carl Scharrer

Robert R Close

Dave Rose

Robert Bennett

Warren Kumley

Eric Saint-Etienne

A DC-AC probe card for testing a DUT includes: a plurality of probe needles, each probe needle having a distal end for contacting said DUT; and a plurality of connection pathways operable to connect test instrumentation to the probe needles, wherein each connection pathway provides both a desired characteristic impedance for AC measurements and a guarded pathway for DC measurements between respective test instrument connections and probe needles.

DC-AC probe card topology

Provided is printed circuit board for minimizing dielectric losses experienced by a low-current portion of an electric circuit. The printed circuit board includes a first substrate supporting an electrically-conductive material patterned to form a conductive pathway between electric circuit components, and a surface-mount guard pad provided on a substantially-planar exposed surface of the first substrate and covering at least an area of the exposed surface including a footprint of the low-current portion on the first substrate. A second substrate is also provided with one or more electrically conductive pads that are surface mounted to the guard pad to couple the second substrate to the guard pad. The second substrate also supports a signal trace included in the low-current region for conducting a low-current signal.

Ultra-low current printed circuit board

Provided is a relay that includes first and second contacts that are selectively connectable for closing an electric circuit. A coil wound around the contacts along a longitudinal axis can generate a magnetic field that connects the contacts in one of an energized or de-energized state and disconnects the contacts in the other of the energized or de-energized state. A first electrically conductive shield is provided adjacent to a first end of the relay and electrically connected to the first contact, and a second electrically conductive shield, the second electrically conductive shield being electrically connected to the second contact. The first electrically conductive shield extends at least partially around the first contact and the second electrically conductive shield extends at least partially around the second contact. The second electrically conductive shield is substantially coaxial with the first electrically conductive shield and separated a distance apart from the first electrically conductive shield along the longitudinal axis.

Dual shielded relay

A probe system for connecting a measurement apparatus to a DUT includes an AC probe having an AC shield conductor and an AC probe conductor shielded by the AC shield; a first DC probe having a first DC probe conductor and a first guard conductor for guarding the first DC probe conductor when a virtual version of a voltage on the first DC probe conductor is applied to the first guard conductor; a second DC probe having a second DC probe conductor and a second guard conductor for guarding the second DC probe conductor when a virtual version of a voltage on the second DC probe conductor is applied to the second guard conductor; a first capacitive connection between the AC shield conductor and the first guard conductor; a second capacitive connection between the AC shield conductor and the second guard conductor; a third capacitive connection between the first guard conductor and the first DC probe conductor; and a fourth capacitive connection between the second guard conductor and the second DC probe conductor, each DC probe guard conductor having a virtual version of a DC voltage present on the respective DC probe conductor for DC measurements on the DUT by the measurement apparatus and the DC probe conductors providing an AC ground conductor for AC measurements on the DUT by the measurement apparatus.

AC low current probe card

A test head for testing a DUT includes a probe card having a plurality of DUT probes, the probes being in contact with the DUT during the testing; an instrument carrier, the instrument carrier being located above the DUT during the testing; and a SMU mounted on the carrier for each of the probes, each SMU being operably connectable to a respective probe, wherein the carrier is moved with respect to the probe card to permit replacement of the probe card.

Instrument per pin test head

A spatial transformer includes an insulating substrate; a plurality of test terminal assemblies on the substrate; and a plurality of contact surfaces on the transformer, each providing an interconnection point for electrical connection between a respective test terminal assembly and a device under test. Each test terminal assembly has a center conductor trace on an upper substrate surface; a lower substrate guard trace beneath the center conductor trace; and a pair of upper substrate guard traces adjacent to opposite sides of the center conductor trace, the guard traces being electrically interconnected. The guard traces in combination with the center conductor trace provide a desired characteristic impedance for an RF signal applied therebetween or a guarded DC connection for a DC signal applied to the center conductor trace and a DC guard applied to the guard traces.

Spatial transformer for RF and low current interconnect

A bias tee for connecting a measurement device to a DUT, where the measurement device has a guard output, includes a DC port; a HF port; and a measurement port. The HF input port is guarded with the guard output during operation of the bias tee.

Measurement bias tee

A RF test interconnection system for connecting a measurement device to a device under test includes, a probe card having a probe extending from a first side of the card for making electrical contact with the device under test and a coaxial connector extending from a second side of the card, a test head having a test head coaxial connector that will mate with the probe card coaxial connector when the probe card and the test head are urged together, and a de-mating device attached to either the probe card or the test head for urging the probe card and the test head apart by applying a separating force therebetween. The probe card and the test card coaxial connectors are electrically connected when the test head and the probe card are urged together by a connection force and electrically disconnected when the connection force is removed.

High frequency RF interconnect for semiconductor automatic test equipment

A semiconductor probe card is provided with low dielectric absorption feed-through contacts to isolate test lines from printed circuit board leakage effects.

Semiconductor probe card for low current measurements

A matrix of three pole, high speed, low current relays for connecting test equipment to a device under test is provided with improved interconnect buses. The relays are mounted in rows and columns with their three pairs of leads extending vertically. An input interconnect bar having three conductors extends horizontally along each row of relays, each conductor being connected to a respective one of each pair of leads. A bottom interconnect bar having three buses extends perpendicular to the top interconnect bars along each column of relays, each bus being connected to a respective one of the leads. The ends of the leads are aligned at a 45.degree. angle with respect to the interconnects. The interconnect bars are enclosed in shielding guard tubes and are removable to permit replacement of the relays.

Relay matrix switching assembly

A reed relay is provided with two shields. The shields are fabricated from copper foil and insulated from each other by polyester tape or film. One shield is connected to one lead of a switching element and the other shield is connected to another lead of a switching element. The shields are wrapped around the switching element in an overlapping manner. The dual shield configuration reduces leakage and interference to improve performance, particularly in low current applications.

Growing community of inventors

Chagrin Falls, OH, United States of America

William Knauer