Optical Communication Products, Inc.

Optical Communications Products, Inc.

William Kit Dean

Blake Jonathan Mynatt

Jason Yorks

Mark Stiehl

Dale Isaacson

Kevin Malone

Richard J Adams

Lance Thompson

Tess Abidi

Robert A Arnold

George W Jarriel, Jr

Dennis King

Christine Mollenkopf

Bob Arnold

A fiber optic module that includes a packaged integrated circuit chip mounted on a top surface of a printed circuit or other mounting board is disclosed. The integrated circuit chip is electrically coupled to an optical subassembly (OSA) mounted along an edge of the printed circuit board and capable of emitting or receiving light traveling parallel to the printed circuit board. The packaged IC chip is electrically coupled to the OSA through at least one microwave via extending through the board and a conductive trace formed on the opposed bottom surface of the board.

Fiber optic module packaging architecture for integrated circuit and optical subassembly integration

An optically transparent, hermetic coating is locally formed on die and other components already assembled in an existing nonhermetic structure. The local hermetic sealing of an OSA includes providing an OSA having at least one exposed optoelectronic component, and providing a paralene source. The method provides for positioning a mask between the paralene source and the OSA, the mask including an opening aligned with a first region of the OSA. The first region includes at least one of the exposed optoelectronic components. The paralene source is then caused to generate paralene such that a permanent paralene coating is deposited through the opening and on the first region of the OSA. The permanent paralene coating essentially hermetically seals the first region. The permanent paralene coating is chosen to be transparent to the wavelength of light emitted and/or used in the optical sub-assembly.

Method and apparatus for hermetic sealing of assembled die

A multilayer ceramic carrier for an optical element includes a terraced cavity for retaining a vertically receiving or vertically emitting optical element. The multilayer ceramic carrier includes conductive traces interposed between the ceramic layers and which extend into the terraced cavity along the trenches formed in the cavity. A vertical cavity surface emitting laser or vertically receiving optical element is wire bonded to the conductive traces which extend into the cavity. In one embodiment, the terraced cavity of the multilayer ceramic carrier includes a VCSEL and photodetector therein, the photodetector capable of monitoring the output optical power of the VCSEL. The method for forming the multilayer ceramic carrier includes forming a plurality of layers of ceramic tape, joining the layers, then co-firing the stacked layers. The multilayer ceramic carrier is joined to a plastic optical housing which includes an aperture for securing an optical fiber. The fiber launch direction is generally orthogonal to the optical surface of the vertically emitting or vertically receiving optical element secured within the ceramic carrier. The optical subassembly comprising the plastic optical housing and ceramic carrier is mounted on the surface of a printed circuit board or adjacent the edge of a printed circuit board, such that the light emitted or detected by the optical element, preferably travels along a fiber launch direction parallel to the surface of the printed circuit board. The optical assembly may be joined to the printed circuit board using various connectors capable of carrying an electrical signal.

High speed optical subassembly with ceramic carrier

A sealing feature for a multiple-piece housing for optoelectronic devices. The housing provides EMI shielding and axial stain suppression for optical fibers coupled to optoelectronic devices retained within the housing. In an exemplary embodiment, the scaling feature includes a corrugated channel having a cross-sectional area that varies along the longitudinal direction of said channel and the channel retains a gasket having a substantially constant cross-sectional area. The corrugated channel, which receives the gasket, includes varying wide and narrow sections. The sealing feature provides for sufficient compression throughout the gasket and a tight, EMI-shielding seal formed between the pieces of the housing.

Optical subassembly enclosure

A housing for optoelectronic devices provides EMI shielding and axial strain suppression for optical fibers coupled to optoelectronic devices retained within the housing. The housing includes an internal septum for EMI shielding and a grounding scheme including relief features of the conductive housing coupled to internal grounding strips. The housing provides a first exemplary engaging/locking feature including an orthogonal tongue and a groove that receives the tongue, and a second exemplary engaging/locking feature that includes a groove having an intermittently varying cross-sectional area and that retains a gasket of constant cross-sectional area. Arms extend from tho housing and retain an optical fiber that is secured to the arm by an adhesive such that axial strain is not exerted at the point of optical coupling and a high optical coupling efficiency is maintained. In an exemplary embodiment, the housing includes an opening through a bottom surface, the opening bounded by beveled edges to aid in blind alignment of the housing over components formed on a mounting surface. The bottom of the housing includes a recessed portion that retains a gasket. The recessed portion receives a gasket of constant thickness and includes a gap of varying thickness that provides for sufficient compression throughout the gasket and a tight, EMI-shielding seal formed between the housing and the mounting surface.

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Golden, CO, United States of America

William Kit Dean