Texas Instruments Corporation

William Kevin Dennis

Anthony M Chiu

Masood Murtuza

Joshua Malone

Edward Carl Fisher

Paul Joseph Hundt

Jeffrey W Marsh

Jack C Smith

Robert N McLellan

Seth Andrian Miller

Lea Adams

The present invention provides, in one aspect, a method of manufacturing a MEMS assembly. In one embodiment, the method includes mounting a MEMS device, such as a MEMS mirror array, on an assembly substrate. The method further includes coupling an assembly lid to the assembly substrate and over the MEMS device to create an interior of the MEMS assembly housing the MEMS device, whereby the coupling maintains an opening to the interior of the MEMS assembly. Furthermore, the method includes lubricating/passivating the MEMS device through the opening. In addition, a MEMS assembly constructed according to a process of the present invention is also disclosed.

Method for lubricating MEMS components

A light transparent package (,) for an erasable integrated circuit (,), and a method for fabricating it are disclosed. The package (,) encapsulates a leadframe (,) that carries the circuit (,). The circuit (,) is an erasable integrated circuit, including an erasable programmable read only memory device. A light transparent window material (,) immiscible in molding compound (,) is emplaced conformally on a surface (,) of the circuit (,). The window material (,) is a gel, polymer preform, or other suitable conformal window forming material adherable to both the circuit (,) and to other components of the assembly, and is transparent to light, particularly ultraviolet light, following a curing process. The molding compound (,) and window material (,) are cured in situ in a cavity (,) of a mold (,). The cavity (,) has at least one contact surface (,) that compresses the window material,to form a flattened surface (,) between the window material,and the contact surface (,) of the cavity (,). The molding compound (,), which is immiscible in the window material (,), is inserted into the cavity (,) to form the package (,) around the circuit (,) after curing. The molding compound (,) surrounds the circuit (,), a portion of the leadframe (,), and the window material (,), but does not dispose itself on the flattened surface (,). The flattened surface (,) forms the exposed window surface (,) of the light transparent window (,) in the protective package (,) after curing.

Method for making light transparent package for integrated circuit

A semiconductor package (80) is provided that serves to support a semiconductor chip (12). A radial slot (54) is formed in an inner ring (26). Cross-slots (64) and (66) are formed in a corner member (38) of polyimide film (22). The slots (54), (64) and (66) serve to allow independent expansion of various portions of the polyimide film (22) and prevent breakage of contact leads (14), (16), (18) and (20) due to the differences in the thermal coefficient of expansion of the semiconductor material and the polyimide film material.

Tape automated bonding package for a semiconductor chip employing corner

A method of fabricating a semiconductor device comprising the steps of providing an encapsulated semiconductor device bonded to a lead frame, providing a support ring formed of a material which softens when subjected to one of ultrasonic energy or formed of a material which softens when subjected to heat insufficient to cause sufficient expansion of said lead frame relative to said support ring to cause buckling of the leads of said lead frame, preferably thermoplastic and preferably polyphenylene sulfide, disposing leads of said lead frame over said support ring and causing said leads to embed in said support ring by applying ultrasonic energy to said support ring or by applying heat to said support ring insufficient to cause sufficient expansion of said lead frame relative to said support ring to cause buckling of the leads of said lead frame. The lead frame is preferably formed of gold plated copper, solder plate or tin plate.

Method of fabricating an ultrasonically welded plastic support ring

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Garland, TX, United States of America

William Kevin Dennis