Dow Corning Corporation

Dow Silicones Corporation

Dow Global Technolgoies LLC

William Kenneth Weidner

Brandon W Swatowski

John Donald Blizzard

Mark Jon Loboda

Kai Su

Steven A Snow

Ludmil M Zambov

Maynard G Hyer

James Steven Tonge

Chad Martin Amb

Francesca Iacopi

Dale L Jarzabkowski

Stephane Malhouitre

Herman Meynen

Steven Snow

A method for producing an optical waveguide by: (a) depositing a first composition: (i) a polysiloxane comprising epoxy and alkenyl groups with refractive index no greater than 1.50, (ii) a compound comprising at least one epoxy group and refractive index no greater than 1.49, and (iii) a polysiloxane having refractive index at least 1.50; (iv) a photo acid generator; (v) a hydrosilylation catalyst, (vi) an inhibitor for hydrosilylation; (b) curing by exposure to ultraviolet light; (c) removing the uncured portion to produce a patterned core layer; (d) after a time from 20 to 300 hours depositing a second composition comprising: (i) a polysiloxane comprising epoxy groups with refractive index no greater than 1.49, and (ii) a compound comprising at least two epoxy groups with a refractive index no greater than 1.49 and an alcohol having refractive index no more than 1.45 (iii) at least one photo acid generator.

Method for optical waveguide fabrication

A method for producing an optical waveguide by: (a) depositing a first composition comprising: (i) a polysiloxane comprising epoxy and alkenyl groups, and (ii) a compound comprising an epoxy group, having molecular weight no greater than 1000 and a refractive index of at least 1.47 and (iii) a photo acid generator; and (iv) a hydrosilation catalyst (b) curing the first composition by exposure to ultraviolet light; (c) removing at least a part of the uncured portion of the first composition to produce a final patterned core layer; (d) depositing on the final patterned core layer a second composition comprising: (i) a polysiloxane comprising epoxy groups and alkenyl groups, and (ii) a compound comprising an epoxy group and a silicon-hydrogen bond, having molecular weight no greater than 1000 and a refractive index no greater than 1.45; (iii) a photo acid generator (e) heating at a temperature from 20 to 150&#xb0; C. for 0.1 to 120 minutes; and (f) curing by exposure to ultraviolet light.

Method for optical waveguide fabrication using polysiloxane, epoxy, photo acid generator, and hydrosilation catalyst

A method of preparing an optical connector located within a gap between a first optical assembly and a second optical assembly is provided. The optical connector includes a contrast layer having at least one cured bridge portion and at least one uncured portion formed from a first composition having a first refractive index (RI). The method comprises applying a second composition having a second refractive index (RI) on the contrast layer to form a second layer and mixing at least a portion of the second layer with the at least one uncured portion of the contrast layer to form at least one intermixed portion having a third refractive index (RI), wherein R|&#x3e;R|&#x3e;RI, and then curing the intermixed portion and optional second layer such that each one of the at least one cured bridge portions is surrounded by an intermixed portion and optional second layer.

Method of preparing an optical connector and optical devices comprising the optical connector prepared thereby

A flexible barrier film has a thickness of from greater than zero to less than 5,000 nanometers and a water vapor transmission rate of no more than 1&#xd7;10g/m/day at 22&#xb0; C. and 47% relative humidity. The flexible barrier film is formed from a composition, which comprises a multi-functional acrylate. The composition further comprises the reaction product of an alkoxy-functional organometallic compound and an alkoxy-functional organosilicon compound. A method of forming the flexible barrier film includes the steps of disposing the composition on a substrate and curing the composition to form the flexible barrier film. The flexible barrier film may be utilized in organic electronic devices.

Flexible barrier film, method of forming same, and organic electronic device including same

An adhesive flexible barrier film comprises a substrate and a barrier layer disposed on the substrate. The barrier layer is formed from a barrier composition comprising an organosilicon compound. The adhesive flexible barrier film also comprises an adhesive layer disposed on the barrier layer and formed from an adhesive composition. A method of forming the adhesive flexible barrier film comprises the steps of disposing the barrier composition on the substrate to form the barrier layer, disposing the adhesive composition on the barrier layer to form the adhesive layer, and curing the barrier layer and the adhesive layer. The adhesive flexible barrier film may be utilized in organic electronic devices.

Adhesive flexible barrier film, method of forming same, and organic electronic device including same

Coated substrates containing at least one barrier layer comprising hydrogenated silicon oxycarbide having a density of at least 1.6 g/cmand at least one barrier layer selected from aluminum, aluminum oxide, aluminum nitride, aluminum oxynitride, titanium, titanium oxide, titanium nitride, and titanium oxynitride.

Coated substrates and methods for their preparation

Coated substrates containing a barrier layer comprising hydrogenated silicon oxycarbide having a density of at least 1.6 g/cmand methods of preparing the coated substrates.

A sealing dielectric layer is applied between a porous dielectric layer and a metal diffusion barrier layer. The sealing dielectric layer closes the pores on the surface and sidewalls of the porous dielectric layer. This invention allows the use of a thin metal diffusion barrier layer without creating pinholes in the metal diffusion barrier layer. The sealing dielectric layer is a CVD deposited film having the composition Si C :H .

Growing community of inventors

Bay City, MI, United States of America

William Kenneth Weidner