Apple Inc.

William K Smith

Brett W Degner

Kristopher P Laurent

Christopher J Stringer

Daniele De Iuliis

Markus Peter Diebel

Sung-Ho Tan

David H Narajowski

Michael E Leclerc

Anthony Joseph Aiello

Daniel Ray Bloom

Jesse T Dybenko

Eric R Prather

Albert Wang

Nicholas R Trincia

Arash Naghib Lahouti

Wegene H Tadele

Motohide Hatanaka

David H Narajowsky

This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

Headphones

Aspects of the subject technology relate to a system including a reference device, a measurement device and a processor. The measurement device provides a three-dimensional (3-D) point map corresponding to first positions of a plurality of selected points on a torso of a user. The processor determines a shape of the torso based on the 3-D point map. The measurement device is sequentially placed on the plurality of selected points, and the 3-D point map represents the first positions of the plurality of selected points relative to a second position associated with a location in 3-D space of the reference device.

Body volume/shape determination using handheld devices

Low spring-rate band

A thermal management system that includes a fan assembly, a heat exchanger, and an insulating box is described. The fan assembly can have two impellers and a housing that includes two scroll portions. An internal portion of the scroll wall can be truncated. A motor housing can be connected to the fan housing via multiple struts. The struts can be oriented angularly with a tangential component and can slope inward to increase the effective inlet area. The heat exchanger can be formed of a fin stack that has a curved body that defines an airflow path that turns radially from the inlet to the exhaust. The heat exchanger can have an inlet that is smaller than the exhaust. The heat exchanger can be connected to one or more heat pipes. The insulating box can have a grid that directs air to certain specific directions.

Thermal management components for electronic devices

Growing community of inventors

San Francisco, CA, United States of America

William K Smith