3Pardata, Inc.

Other

Sun Microsystems, Inc.

William Joshua Price

Drew George Doblar

A disk enclosure includes a first enclosure controller powered by a first voltage circuit and coupled to a first I2C bus, a second enclosure controller powered by a second voltage circuit and coupled to a second I2C bus, and a switch coupled between the first and the second I2C buses. The first switch de-couples the first and the second I2C buses when the voltage output of the second voltage circuit falls below a predetermined threshold.

Isolation of I2C buses in a multiple power domain environment using switches

A disk enclosure includes a first plurality of I2C elements powered by a first power domain and a second plurality of I2C devices powered by a second power domain. The first plurality of I2C elements are coupled via a first I2C bus and the second plurality of I2C elements are coupled via a second I2C bus. An enclosure controller has a third I2C bus selectively coupled via a multiplexer to the first or the second I2C bus.

Disk enclosure with multiplexers for connecting 12C buses in multiple power domains

A disk enclosure includes a first group of one or more power sources that powers a first group of elements in a first power domain and a second group of power sources that powers a second group of elements in a second domain. The disk enclosure also includes a first voltage circuit and a second voltage circuit that are each powered by the first group of power sources and the second group of power sources. The first voltage circuit powers a third group of elements while the second voltage circuit powers a fourth group of elements.

Disk enclosure with multiple power domains

A test breakout board using blind vias to eliminate stubs. The test breakout board includes a printed circuit board (PCB), having a first set of contact pads on one side and a second set of contact pads which are directly opposite the first set of contact pads on it's other side. Each pad in the first set of contact pads is connected to a corresponding pad in the second set of contact pads through a pair of blind vias, a pair of signal traces and a through-hole via. Each of the through-hole vias is connected to a corresponding contact pin in a test connector. The test connector provides an interface to test equipment such as a logic analyzer or an oscilloscope. The test breakout board may include a test socket for holding a device-under-test (DUT), such as a microprocessor or an application specific integrated circuit (ASIC) chip. Additionally, the breakout board may also include an electrical interface adapter, which mechanically resembles the DUT. The interface adapter provides the interface between the test breakout board and a system motherboard. In a further embodiment, a test breakout board is connected to a system motherboard. The motherboard includes an additional test socket, which can hold a DUT, or in this case, the test breakout board electrical interface adapter. The electrical interface adapter provides a signal path from the system motherboard, through the breakout board, to the DUT.

Breakout board using blind vias to eliminate stubs

This device involves a game of skill and coordination, the object of which is to push a coin across a board containing a maze of holes and obstacles and into a coin box at the other end of the board, with the aid of only one hand-held game tool similar to a knitting needle.

Growing community of inventors

Boulder Creek, CA, United States of America

William Joshua Price