International Business Machines Corporation

Globalfoundries Inc.

Globalfoundries U.S. 2 LLC

William Joseph Murphy

Anthony K Stamper

Jeffrey C Maling

Jeffrey P Gambino

Christopher Vincent Jahnes

Eric Jeffrey White

Cameron E Luce

Michael T Brigham

Zhong-Xiang He

Douglas Duane Coolbaugh

Edward Crandal Cooney, Iii

Ebenezer E Eshun

Jonathan Daniel Chapple-Sokol

Daniel Scott Vanslette

David Craig Strippe

Terence B Hook

Edmund Juris Sprogis

Thomas L McDevitt

George A Dunbar, Iii

Robert Mark Rassel

Tom C Lee

James Spiros Nakos

Prabhat Tiwari

Kirk David Peterson

Timothy Dooling Sullivan

Randy William Mann

David C Thomas

Marc Waine Cantell

Steven P Barkyoumb

Lawrence Alfred Clevenger

Jed Hickory Rankin

Cyril Cabral, Jr

John Maxwell Cohn

Jerome Brett Lasky

Vidhya Ramachandran

Matthew J Rutten

Matthew D Moon

Shawn A Adderly

Keith Edward Downes

Stephen Bruce Brodsky

Thai Doan

Brian M Czabaj

Daniel A Delibac

James V Hart, Iii

Ronald J Line

Anthony J Telensky

Daniel C Edelstein

William R Tonti

John J Ellis-Monaghan

Steven H Voldman

Steven M Shank

Qizhi Liu

Timothy Joseph Dalton

Mark David Jaffe

Xiao Hu Liu

Yun-Yu Wang

Kwong Hon Wong

Anil Kumar Chinthakindi

Robert Michael Geffken

Anthony Gene Domenicucci

Bruce Walter Porth

Roger W Cheek

Erick G Walton

Kunal Vaed

Russell T Herrin

Felix Patrick Anderson

Matthew J Farinelli

Cathryn Jeanne Christiansen

Jason Paul Gill

Max L Lifson

Tina Jane Wagner

Gary L Milo

Dinh Dang

Paul William Pastel

John G Twombly

Gobinda Das

Christa Regina Willets

Samuel McKnight

Barbara Ann Waterhouse

Frederic Beaulieu

Mark D Dupuis

Chung-Ping Eng

Jessica Anne Levy

Adreanne Kelly

Steven J Duda

Brett A Philips

Steven S Williams

David H Yao

Jeffrey N Seward

Charles R Abry

Stephen P Cole

Jonanthan D Chapple-Sokol

James E Beecher

Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.

Micro-electro-mechanical system (MEMS) structures and design structures

Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both metal material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.

Systems and methods are provided for implementing a crystal oscillator to monitor and control semiconductor fabrication processes. More specifically, a method is provided for that includes performing at least one semiconductor fabrication process on a material of an integrated circuit (IC) disposed within a processing chamber. The method further includes monitoring by at least one electronic oscillator disposed within the processing chamber for the presence or absence of a predetermined substance generated by the at least one semiconductor fabrication process. The method further includes controlling the at least one semiconductor fabrication process based on the presence or absence of the predetermined substance detected by the at least one electronic oscillator.

Crystal oscillator and the use thereof in semiconductor fabrication

Micro-Electro-Mechanical System (MEMS) structures and design structures

Method for forming micro-electro-mechanical system (MEMS) beam structure

Approaches for providing a liner at a via-to-wire interface are provided. A method includes: forming a via opening that exposes an upper surface of a copper wire; forming a titanium liner on the upper surface of the wire; forming a tungsten liner on the titanium liner; and forming a via on the second liner in the via opening.

Titanium tungsten liner used with copper interconnects

Planar cavity Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structure are provided. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity having a planar surface using a reverse damascene process.

Planar cavity MEMS and related structures, methods of manufacture and design structures

Substrates (wafers) with uniform backside roughness and methods of manufacture are disclosed. The method includes forming a material on a backside of a wafer. The method further includes patterning the material to expose portions of the backside of the wafer. The method further includes roughening the backside of the wafer through the patterned material to form a uniform roughness.

Uniform roughness on backside of a wafer

Embodiments of the present invention provide a method for achieving uniform capacitance between a semiconductor wafer and an electrostatic chuck. In certain embodiments, the method comprises the step of forming a layer on a first side of the semiconductor wafer, wherein the layer has a specified resistivity. The method further comprises placing the semiconductor wafer on the electrostatic chuck, wherein the layer contacts the electrostatic chuck. The method further comprises applying a radio frequency signal to the electrostatic chuck, and processing a second side of the semiconductor wafer.

Achieving uniform capacitance between an electrostatic chuck and a semiconductor wafer

An encapsulated sensors and methods of manufacture are disclosed herein. The method includes forming an amorphous or polycrystalline material in contact with a layer of seed material. The method further includes forming an expansion space for the amorphous or polycrystalline material. The method further includes forming an encapsulation structure about the amorphous or polycrystalline material. The method further includes crystallizing the amorphous or polycrystalline material by a thermal anneal process such that the amorphous or polycrystalline material expands within the expansion space.

Encapsulated sensors

Growing community of inventors

North Ferrisburgh, VT, United States of America

William Joseph Murphy