Medtronic, Inc.

Other

William John Taylor

Joseph F Lessar

Brad Conrad Tischendorf

Lynn M Seifried

Douglas J Weiss

Robert E Kraska

Andrew J Ries

John E Kast

Joyce Yamamoto

William D Wolf

John D Wright

Gary F LaBree

James D Reinke

John Louis Sommer

Kenneth C Gardeski

Rajesh V Iyer

Gordon Orvis Munns

Thomas P Miltich

Andrew Jason Thom

Larry Earl Tyler

Shawn D Knowles

Daniel J Koch

Joseph M D'Sa

Louis E Halperin

Jeffrey O York

Gregory John Haubrich

Christian S Nielsen

John Daniel Norton

William G Howard

Mark D Breyen

Anthony W Rorvick

Joachim Hossick-Schott

Rogier Receveur

Kurt J Casby

Michael B Hintz

Michael A Schugt

David P Haas

Simon E Goldman

David Nghiem

Mark Edward Viste

Len D Twetan

Jennifer P Miller

John C Olson

Michael E Nowak

Tim T Bomstad

Charles N Wilson

Ian Courtney

Peter D Yurek

Mel V Garofalo

Wayne T Rheaume

Weiss J Douglas

Roger L Hubing

A component of an implantable medical device comprises a body comprising at least one external surface, the body comprising at least one of titanium, titanium-based alloys, and composites thereof, and a corrosion-resistant surface region at the at least one external surface, the corrosion-resistant surface region comprising at least one of titanium nitride, dititanium nitride, and a solid solution of nitrogen dissolved in the body, wherein the corrosion-resistant surface region is formed by thermal nitridation of the body.

Thermal nitriding process for components of implantable medical devices

Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.

Multi-electrode implantable systems and assemblies therefor

A hermetically sealed microelectromechanical system (MEMS) package for an implantable medical device is presented. The MEMS comprises a first substrate that includes an aperture. A feedthrough assembly is coupled to the aperture, the feedthrough assembly comprises a conductive element housed in a glass insulator member. A second substrate is coupled to the first substrate.

Feedthrough for microelectromechanical system

Multi-electrode implantable systems and assemblies thereof

A feedthrough assembly includes a ferrule, an insulating structure, at least one terminal pin and a glass seal that fixedly secures the insulating structure within the ferrule. The insulating structure has a top portion, a bottom portion, and an inner diameter portion. The inner diameter portion defines at least one aperture extending from the top portion to the bottom portion of the insulating structure. The at least one terminal pin extends through the at least one aperture. The glass seal comprises about 30% BO, about 30% to about 40% of a member selected from the group consisting of CaO, MgO, SrO, and combinations thereof, with the proviso that the individual amounts of CaO and MgO are each not greater than about 20%, about 5% LaO, about 10% SiO, and about 15% AlO, wherein all percentages are mole percentages.

Feedthrough assembly including a ferrule, an insulating structure and a glass

An electrical interconnect structure for an implantable medical device includes a feedthrough that has a pin extending therefrom. The pin defines a first end and a middle portion. A bonding surface is formed at the first end of the pin, and the bonding surface has a surface area greater than a cross-sectional area of the pin at its middle portion.

Electrical interconnection structures and method

An implantable medical device is provided including a housing, an external circuit element extending outwardly from the housing, an internal circuit enclosed by the housing, a feedthrough array disposed along the housing having at least one filtered feedthrough and at least one unfiltered feedthrough, wherein the unfiltered feedthrough is adapted for connection to the outwardly extending circuit element; and including means for minimizing electromagnetic coupling between the filtered feedthrough and the unfiltered feedthrough.

Method and apparatus for minimizing EMI coupling in a feedthrough array having at least one unfiltered feedthrough

Methods and apparatuses are provided for an electrical device that employs a feedthrough including a hermetic seal that seals an interior region of the electrical device. The electrical device includes an electrical contact disposed within the interior region of the electrical device, and a wire terminal that includes an encircled portion that is encircled by the feedthrough, and a first end that electrically connects with said electrical contact. When the electrical device is constructed, the first end of the wire terminal is coated with a conductive metal that is more resistant to oxidation than the wire terminal. The first end of the wire terminal is secured to the electrical contact using a mechanical device such as a crimping connector or a spring connector.

Feedthrough apparatus with noble metal-coated leads

A hermetically sealed microelectromechanical system (MEMS) package for an implantable medical device is presented. The MEMS comprises a first substrate that includes an aperture. A feedthrough assembly is coupled to the aperture; the feedthrough assembly comprises a conductive element housed in a glass insulating member. A second substrate is coupled to the first substrate.

Insulator for feedthrough

An improved multi-polar feedthrough assembly employs a particular metallic ferrule material for improved dimensional stability during initial fabrication and sustained hermetic operation. In one aspect, the disclosure relates to implantable medical devices (IMDs) including an IMD enclosure fabricated with grade 2 titanium and having a ferrule material fabricated with grade 4 titanium or grade 5 titanium. In one form, the multi-polar feedthrough assembly includes a filtered feedthrough array (e.g., employing capacitive filters coupled to the electrically conductive pins or serpentine conductors of the array). According to another aspect, the improved multi-polar feedthrough assembly incorporates additional pins, thus increasing the footprint of the assembly, and the additional pins provide analog electrical communication between operative circuitry inside an IMD and analog components external to the IMD.

Multi-polar feedthrough array for analog communication with implantable medical device circuitry

A feedthrough arrangement includes a titanium alloy terminal for conducting electrical current between a first environment within a housing and a second environment outside of the housing. An insulating member is positioned around a portion of the terminal. A sleeve member is positioned around the insulating member. The terminal, insulating member, and insulating member all being in sealing engagement therewith to environmentally isolate the first and second environments.

Titanium alloy-pin battery feedthrough for an implantable medical device

A capacitor structure comprises a shallow drawn encasement having first and second major sides and a peripheral wall coupled to the first and second sides. A cathode is disposed within the encasement proximate the first and second major sides, the cathode having a cathode lead. A central anode a having an anode lead is disposed within the encasement, and a bipolar, insulative feedthrough extends through the encasement through which electrical coupling may be made to the anode lead and the cathode lead.

Electrolytic capacitor for use in an implantable medical device

A body implanted device including a container having an opening through which extends an electrical feedthrough. The feedthrough includes a terminal of bio-stable material. A glass insulator is positioned around the terminal. The glass insulator is chosen from a CABAL-12 type composition or variation thereof. The terminal is comprised of a material which has thermal expansion characteristics compatible with the glass seal. For glass seals having a thermal expansion in the range of 6.8 to 8.0.times.10.sup.-6 in/in/.degree. C. the terminal is comprised of a thin layer of titanium metallurgically clad over niobium or tantalum. For glass seals having a thermal expansion in the range of 8.0 to 9.0.times.10.sup.-6 in/in/.degree. C. the terminal is comprised of platinum, platinum-iridium or alloys of either, or of pure titanium.

Body implanted device with electrical feedthrough

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Anoka, MN, United States of America

William John Taylor