Other

Accretech Usa, Inc.

William Jefferson Stone, Iii

Lukas Haenichen

Vladimir Volovich

Edmond Arzumau Abrahamians

Igor Kravtsov

Herbert Wayne Owens, Jr

Yakov Keyfes

An adjustment apparatus for adjusting the angular tilt of a first component of a magnetic circuit relative to an alignment axis of a second component of the circuit uses at least one pair of spacers each of which has a thickness that changes continuously around its periphery. The spacers are arranged between the circuit components and, as a relative rotation between the spacers is changed, the combined thickness of the two spacers increases in one area, while decreasing in another. This results in a tilting of a top surface of the spacer pair relative to a bottom surface, and a corresponding change in a relative tilt of the first component relative to the second component. The spacers may be ring-shaped or disc-shaped, and allow for precise alignment of the magnetic circuit without the need for shims between the components.

Relative tilt angle adjustment system for magnetic components

An apparatus and method is provided for polishing work pieces such as semiconductor wafers. The apparatus includes a variable number of independent heads, platensand polishing units. This polishing apparatus belongs to a group of polishing machines with wafers attached to the same headsthrough all polishing steps without undesirable reloading from one headto another between polishing steps. Each independent headis automatically coupled to and decoupled from any of the polishing unitsto optimize throughput and provide flexibility in accommodating different polishing processes. A head transfer subsystemprovides an independent means of transfer for each head, thus an infinite number of contemporaneous or overlapping polishing cycles can be completed on multiple wafers resulting in maximum processing throughput.

Polishing machine and method

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Ferndale, WA, United States of America

William Jefferson Stone, Iii