M/a -com, Inc.

Tyco Electronics Corporation

The Whitaker Corporation

William James Palmteer

Richard J Koba

Philip Beucler

Thomas Yuan

A package for a light emitting diode (LED) including an electrically insulating substrate layer, a non-conductive layer disposed on the electrically insulating substrate layer, and a reflector layer disposed on the non-conductive layer. The electrically insulating layer includes metallized portions for coupling a light emitting diode thereto.

Surface mount package for a high power light emitting diode

An improved leadframe-based CSP and a method of forming the leadframe-based CSP are provided. The leadframe-based CSP includes a leadframe including a die attach pad and a plurality of wire bonding pads, at least one aperture disposed in the die attach pad, at least one die on the die attach pad, at least one bonding wire for electrically connecting the die and the wire bonding pads, and a mold compound for encapsulating the die and the bonding wire to form a chip package, wherein the mold compound is formed in the aperture.

Leadframe-based chip scale package

A solder-coated article is described. The article comprises (1) a dielectric core having a largest dimension ranging from 1 to 1000 microns; (2) a solderable metal layer over the core; and (3) a solder layer over the metal layer. Preferably, the dielectric core is a spherical core of ceramic or glass material that ranges from 25 to 200 microns in diameter. Copper and nickel are preferred materials for the solderable metal layer. The solder is preferably selected from a solder comprising lead and tin and a solder comprising lead and indium, more preferably a 63% Sn-37% Pb solder, a 95% Pb-5% Sn solder, or a 50% Pb-50% In solder. Also described are modified substrates and (solder bonded assemblies) that can be created using such solder-coated articles, as well as a procedure for making the same.

Solder-coated articles useful for substrate attachment

A printed circuit board (PCB) is provided for mounting an electronic package thereon. The PCB includes a center pad centrally located in the PCB, a plurality of input/output (I/O) pins peripherally located in the PCB, and at least one slot formed in the center pad for providing escape areas into which contaminants can escape from solder joints associated with mounting of the electronic package onto the PCB.

Growing community of inventors

North Andover, MA, United States of America

William James Palmteer