International Business Machines Corporation

William James Anderl

Phillip V Mann

Bret Peter Elison

Arvind Kumar Sinha

Karl Stathakis

Chelsie M Peterson

Kevin O'Connell

David Peter Gaio

William K Hogan

Howard Victor Mahaney, Jr

Cary Huettner

Scott Michael Branch

Michael Francis Hanley

Evan G Colgan

Shurong Tian

Scott Alan Shurson

Christopher Michael Marroquin

James Dorance Gerken

Arden Lot Moore

Brenda Berg

Alex Matos

Jason T Wertz

Brandon M Kobilka

Kirk David Peterson

Robert K Mullady

Eric Alan Eckberg

Tamas Visegrady

Vincenzo V Di Luoffo

Sarah K Czaplewski-Campbell

Todd Jon Rosedahl

Howard V Mahaney, Jr

Robert R Genest

Jason R Eagle

Michael D O'Connell

Scott Raymond LaPree

Eric Jason Fluhr

Maurice Francis Holahan

David R Motschman

Khaalid P McMillan

Cody J Erie

Gregory Scott Vande Corput

Eric D Marz

Alexander Matos

Greg Abrami

A heat pipe system, method, and heat sink system to enhance heat transfer from a heat-generating component. The method includes generating heat with the heat-generating component. The method also includes transferring at least a portion of the heat to at least a portion of a volatile fluid within one or more heat pipes. The method further includes modifying, dynamically, an active heat transfer region of the one or more heat pipes, thereby dynamically modulating heat transfer from the heat-generating component through the one or more heat pipes.

Dynamically enhancing heat transfer through heat pipes

A heat sink to selectively dissipate heat from a plurality of heat-generating components. The heat sink includes a plurality of heat pipes, and a base plate configured to locate at least one of the plurality of heat pipes proximate each of the plurality of heat-generating components. The heat sink also includes a plurality of sets of fins operable to dissipate heat generated by the heat-generating components, and a plurality of sets of louvers, wherein each of the plurality of sets of louvers is associated with one of the plurality of sets of fins and is operable to open to selectively allow airflow from outside the heat sink to dissipate heat from one of the plurality of sets of fins.

Configurable multi-chip module heatsink for selective dissipation of heat

Provided is a chocking device, including a frame, a plate, and a stop. The frame has an uppermost surface and a lowermost surface opposite the uppermost surface. The plate has a contact surface and is movable between a first position, wherein a portion of the contact surface is substantially coextensive with the uppermost surface of the frame, and a second position, wherein the portion of the contact surface is between the uppermost and lowermost surface of the frame. The stop is coupled to the frame and arranged in direct contact with the plate. The stop is rotatable such that movement of the plate from the first position to the second position rotates the stop from a first to a second stop position. The plate is movable such that the contact surface is substantially parallel when the plate is in the first and second positions.

Low profile wheel chock

Provided is a chocking device, including a frame, a plate, and a stop. The frame has an uppermost surface and a lowermost surface. The plate has a substantially planar contact surface and includes an operating region. The plate is movable between a first position, wherein the contact surface is arranged substantially coextensively with the uppermost surface, and a second position, wherein the contact surface is arranged between the uppermost and lowermost surfaces. The stop is coupled to the frame and has an operating portion arranged in direct contact with the operating region. The stop is rotatable such that movement of the plate from the first position to the second position rotates the stop from a first stop position to a second stop position. The operating region is arranged nearer to the uppermost surface than is the operating portion when the stop is in the first and the second stop positions.

Thermal control of a multi-chip module in an operating environment is facilitated by predetermining separate thermal control points for multiple chips of the multi-chip module, with a first chip and a second chip having different predetermined thermal control points, and saving the predetermined thermal control points for reference by a thermal control of the multi-chip module in an operating environment. The thermal control monitors an operating temperature of the first chip, and compares the operating temperature of the first chip to the predetermined thermal control point of that chip. The thermal control further initiates a control action to control temperature of the first chip based on comparing the operating temperature of the first chip to the predetermined thermal control point of the first chip.

Predetermining separate thermal control points for chips of a multi-chip module

Methods and structures are provided for implementing selective airflow modification. An airflow control member holder receives and retains an airflow control member having compliance characteristics allowing easy removal and changing of the airflow control member. The airflow control member holder includes retention features to facilitate mounting and removal from the system, such as mounting and removal from a printed circuit board (PCB). The airflow control member holder provides a protective function for a component, such as a depopulated component, a central processing unit (CPU) or other device.

Implementing modular baffling mechanism for selectively redirecting and impeding airflow

Methods and structures are provided for implementing electronic enclosure cooling containment for concurrent maintenance actions with a top cover of the electronic enclosure removed. The structure includes a moveable airflow baffle being attached to the associated electronic enclosure. During concurrent maintenance actions, the moveable airflow baffle is moved to an open position over at least a partial length of a replaceable component, without being detached or removed from the associated electronic enclosure. During normal operations, the moveable airflow baffle hangs down over at least a partial length of a replaceable component.

Implementing electronic enclosure cooling containment for concurrent maintenance actions

A frame having a perimeter defines a planar opening. A set of louvers may span from a first edge of the opening to a second edge of the opening. Each louver may be capable of rotating between a closed position and an open position. A set of physical obstructions may prevent the louvers from rotating beyond the open position. Each louver may be offset from the planar opening by a first acute angle when in a closed position, and by a second, larger, acute angle when in the open position. A flow of air in a first direction through the opening may rotate the set of louvers to the closed position. A flow air in the opposite direction through the opening may rotate the set of louvers to the open position such that the flow of air in the opposite direction moves freely through the opening.

Normally open anti-recirculation system

A method and a system for non-destructively detecting defects within and/or on plated-through holes are provided. The method includes sealing a plated-through hole on a printed circuit board to detect for possible defects along the sidewall of the plated-through hole. The method further includes applying an airflow through the plated-through hole and measuring the airflow entering the plated-through hole at the gasket to determine the initial airflow calculation. The method also includes measuring the airflow again as it exits the plated-through hole to determine an exit airflow calculation. A determination of the quality of the plated-through hole is made by the method by analyzing the initial airflow calculation and the exit airflow calculation.

Non-destructive testing for plating defects

A heat pipe includes one or more reservoirs of liquid that are closed at lower temperatures and open at higher temperatures. The opening of the reservoirs at higher temperatures caused by higher power levels dynamically increases the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. As the heat pipe cools, the liquid condenses and flows back into the reservoirs. As the heat pipe continues to cool, the reservoirs close. The result is a heat pipe that is more efficient at lower power levels and still maintains high efficiency at higher power levels due to the demand-based charging of the liquid based on temperature.

Demand-based charging of a heat pipe

Method and system for providing cooling to an electronics enclosure that includes redundant cooling in the event of a failure of a cooling fan. The system includes an enclosure configured to support electrical components and a fan chassis. The system also includes a plurality of cooling fans coupled to the fan chassis. Each of the plurality of cooling fans is rotatable relative to the fan chassis between a first orientation in which the fans are operable to direct air into the enclosure and a second orientation. Spacing between adjacent cooling fans is less when the second cooling fan is in the second orientation than when the second cooling fan is in the first orientation. A third one of the plurality of cooling fans automatically rotates from the second orientation to the first orientation upon the second cooling fan moving to the second orientation.

Cooling system for an electronics enclosure

A microfluidic control apparatus, such as a relief valve, includes a pressure containing housing to contain a fluid within an interior of the pressure containing housing, and a nanotube in fluid communication between the interior of the pressure containing housing and an exterior of the pressure containing housing. The nanotube is used to contain water therein such that, below a predetermined temperature, the water within the nanotube prevents pressure relief through the nanotube from the interior to the exterior of the pressure containing housing, and above the predetermined temperature, the water within the nanotube enables pressure relief through the nanotube from the interior to the exterior of the pressure containing housing.

Microfluidic relief valve

An airflow sensor for a heat sink has a substantially flat base portion and a deformable upper portion electrically coupled to the base portion that contacts a conductive strip. As airflow increases, the deformable upper portion deforms and moves away from the source of airflow, which moves the point of contact between the deformable upper portion and the conductive strip farther away from the source of the airflow. The difference in the point of contact is measured, and is used to characterize the airflow sensor for different airflows. Data from the airflow sensor can then be logged during system operation. When needed, the data from the airflow sensor can be read from the log and converted to airflow using the airflow sensor characterization data. In this manner the airflow through a heat sink may be dynamically measured, allowing analysis and correlation between system events and airflow through the heat sink.

Airflow sensor for a heat sink

A system which provides redundant cooling of heat generating components within an electronic system with a single row of fans out the use of counter-rotational fans or multiple rows of fan by displacing failed fans in orthogonal directions. The system includes a fan track that has an orthogonal portion and at least one parallel portion. A failed or failing fan is moved from the orthogonal portion of the fan track to the parallel portion of the fan track. A bank of fans are each upon the orthogonal portion of the track. Each fan in the bank of fans acts upon air to produce an airflow. The bank of fans includes a moved fan at least partially filling a void upon the orthogonal portion of the fan track that is created when the failed or failing fan was moved from the orthogonal portion of the fan track to the parallel portion of the fan track.

Fan reconfiguration and displacement due to a failed or failing fan

A cooling system that includes two or more fans that each have a chassis. The chassis includes a first face, a second face, and a sidewall. The fans then can be attached to each other by attaching a sidewall of a first fan chassis to a sidewall of a second fan chassis. An adjustable vane is attached perpendicularly and approximately equidistant between the fans, with an angular control element that is attached to the first fan chassis. The vane can be oriented such that the vane divides the airflow distributed to the fans. The vane then can be adjusted radially by the angular control element, which is attached to the fan chassis. If an impeller of a fan chassis fails the vane can be adjusted radially using an angular control element to distribute more airflow to the failed fan superimposing the non-failed fan chassis.

Growing community of inventors

Rochester, MN, United States of America

William James Anderl