Motorola Corporation

Motorola Solutions, Inc.

William J Wingfield

Leng H Ooi

Mark A Crandall

Antonio Faraone

Wayne W Ballantyne

Brian Bucknor

Atif A Meraj

John Ballen

A communication system () provides a body wearable garment () having a single transmission line () for interfacing a main control device () to a variety of supplemental devices (). The single transmission line () provides a series of couplers () integrated along the line to wirelessly couple the plurality of supplemental devices () with the main control device (). The plurality of supplemental devices () are insertable and removable to pouches () within the garment, the pouches providing alignment of each supplemental device with a corresponding coupler of the single transmission line (). Near field wireless power transfer coupling and/or RF signaling are provided. A wide variety of devices can be optimally located along the single transmission line () within the garment allowing for considerable improvement of in hands-free portability.

Apparatus for managing a plurality of devices in a portable communication system

A device () includes an AM generating circuit () which couples interference () into another part of the device (). A second AM signal () is generated, having inverse modulation relative to the first AM signal, and is coupled to the affected part of the device to counteract the interference by reducing the effective harmonic content of the first AM signal.

Method and apparatus for reducing intra-device interference

A crystal reference (,) comprises a crystal element (,) integrally housed with a memory device (,), and is coupled to the memory device through an anti-resonant network (,). The network is designed such that it presents a high impedance at the natural frequency of the crystal element. Temperature performance information for the particular crystal element is stored in the memory device, and is accessed via terminal (,) using a single wire interface protocol.

Crystal reference and oscillator circuit using same

A microstrip assembly (100), includes a first substrate such as a multilayer substrate (102, 106 and 112) having pockets or cavity areas (104). A second substrate (110) includes transmission lines (108) on its first surface, and a ground plane on its second surface which help form a microstrip resonator. The first and second substrates are attached with the transmission lines (108) resting inside of the areas defined by cavity areas (104). By providing an air gap on top of transmission lines (108), the microstrip assembly (100) can exhibit enhanced characteristics, while still maintaining the high Q characteristics of a microstrip.

Microstrip assembly

A shielded microstrip assembly (100)includes a substrate 102 having a first ground plane surface (106) and a second surface (206) which includes a transmission line (216). A plurality of solder balls (104) provide electrical interconnection for the ground plane and for the terminals (210) and (212) of transmission line (216). The microstrip assembly (100) is then inverted and attached using solder balls (104) to a carrier (302). The inverted microstrip assembly (100) of the present invention provides for improved shielding, while maintaining the high Q and other advantages associated with a microstrip.

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Plantation, FL, United States of America

William J Wingfield