Mcgean-rohco, Inc.

R. O. Hull & Company, Inc.

Other

Rohco, Inc.

William J Willis

George S Bokisa

William E Eckles

Valerie M Canaris

Richard K Lowery

Wilfred J Ferguson

Vince Opaskar

It has now been found that one or more metals selected from the group consisting of tin, lead, bismuth, indium, gallium and germanium may be deposited onto a metal surface utilizing an aqueous electroless plating bath which comprises

Aqueous immersion plating bath and method for plating

It has now been found that one or more metals selected from the group consisting of tin, lead, bismuth, indium, gallium and germanium may be deposited onto a metal surface utilizing an aqueous electroless plating solution which comprises

Aqueous electroless plating solutions

A bed which is articulated in two places capable of placing the occupant in an infinite number of positions including the standing position. The bed has a head portion and an intermediate portion both of which rotate about a shaft. A foot portion of the bed rotates about a second shaft. The bed pivots about a third shaft supported by the frame. Two power drives are provided, one for the head portion and the other for the foot and intermediate portions. A pantograph arrangement connected to the second power drive rotates the foot portion. The occupant is raised to a standing position by having the foot end of the bed touch the floor and raise the foot end of the frame off the floor.

EZ access bed

Compositions are described which are useful particularly in improving the electrodeposition of zinc from aqueous alkaline plating baths. In one embodiment, the new composition comprises a polymeric composition prepared by the process which comprises the steps of

Polymer compositions and alkaline zinc electroplating baths

An aqueous acidic plating bath for electrodeposition of tin, lead or tin-lead alloys on a substrate is described. The plating baths are free of fluoborate and comprise (a) at least one bath-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, or a mixture of stannous and lead salts, (b) at least one alkane sulfonic acid or alkanolsulfonic acid, (c) at least one nonionic, cationic or amphoteric surfactant, (d) an effective amount of at least one primary brightening agent selected from the group consisting of aromatic aldehydes, acetophenones, and carbonyl compounds having the general formula

Plating bath and method for electroplating tin and/or lead

A therapeutic bed useful in the home and institutions for the application of traction to a patient having a stationary frame and a moveable frame. Traction is applied by supporting the patient either at a point below the chin or at the feet and tilting the moveable frame so that the weight of the patient produces the traction.

Therapeutic bed with traction assembly

Aqueous acidic copper plating baths and processes for electrodepositing bright and level copper coatings are described. In addition to containing one or more bath-soluble copper salts, free acid and chloride ions, the copper plating baths of the invention contain a brightening compound and a heterocyclic nitrogen or sulfur-nitrogen compound. The brightener compounds are prepared by reacting a mixture of

Electrodeposition of copper, acidic copper electroplating baths and

A composition is described which provides an improvement in the electrodeposition of zinc from aqueous alkaline plating baths and particularly from alkaline plating baths containing little or no cyanide. The new composition comprises the reaction product of one or more piperazines, at least one additional nitrogen-containing compound selected from the group consisting of ammonia or aliphatic acyclic compounds containing at least one primary amine group, formaldehyde, and an epihalohydrin or a glycerol halohydrin or mixtures thereof. Aqueous, alkaline zinc plating baths containing the additive compositions of the invention deposit a bright zinc coating over a wide range of current densities.

Alkaline zinc electroplating baths and additive compositions therefor

An aqueous acidic plating bath for the electrodeposition of a bright zinc deposit on a substrate is disclosed and comprises zinc ions and an amount, sufficient to provide a level and bright deposit, of at least one bath-soluble composition obtained by the reaction of a nitrogen-containing heterocyclic compound with formaldehyde, an epihalohydrin or glycerol halohydrin and at least one amino compound selected from the group consisting of (i) ammonia, (ii) an aliphatic amine, or (iii) an amidine. Additionally, the plating baths of the invention may contain a nitrogen-containing compound obtained by the reaction of ammonia, an aliphatic amine containing at least one primary amine group, or mixtures thereof with one or more epihalohydrins, glycerol halohydrins or mixtures thereof. Thioureas and anionic aromatic sulfonic acids or salts thereof also are contemplated as being useful in the plating baths of the invention. Methods for depositing a bright zinc coating over a wide range of current densities also are described.

Acid zinc plating baths, compositions useful therein, and methods for

A composition as described which is useful particularly in improving the electrodeposition of bright zinc from aqueous acidic plating baths. The new composition comprises a reaction product obtained by the process of preparing an intermediate composition by reacting formaldehyde in water with sulfamic acid and at least one aliphatic acyclic amine containing at least one primary amine group, and thereafter reacting said intermediate compound with at least one epihalohydrin or glycerol halohydrin or mixtures thereof. Aqueous acidic zinc plating baths containing the additive compositions of the invention and methods for depositing a bright zinc coating over a wide range of current densities also are described.

Additive compositions, baths, and methods for electrodepositing bright

A composition is described which is useful particularly in improving the electrodeposition of tin, lead or tin-lead from an aqueous acidic plating bath. The new composition comprises a reaction product of an unsaturated nitrogen-containing heterocyclic compound with a mixture comprising formaldehyde and an unsaturated aliphatic aldehyde containing up to about six carbon atoms. Aqueous acidic plating baths containing the additive compositions of the invention, and methods for depositing tin, lead or tin-lead alloys from such baths as well as additive compositions for forming the baths also are described.

Composition, plating bath, and method for electroplating tin and/or lead

An aqueous acid plating bath for electrodeposition of tin, lead or tin-lead alloys on a substrate is described and comprises at least one metal salt selected from the group consisting of a stannous salt, a lead salt or a mixture of stannous and lead salts, and as a brightener agent, an effective amount of at least one alkoxylated amine of the formula ##STR1## wherein R is a fatty acid alkyl group containing from about 8 to about 22 carbon atoms,

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North Royalton, OH, United States of America

William J Willis