Honeywell G.m.b.h.

Lockheed Martin Corporation

William J White

Robert V Lorenze, Jr

James M Ortolf

Susan J Resnick

Christopher G Paine

Mark N Gurnee

David M Comey

Miriam F Young

Brian W Denley

William R Gordon

Donald E Marshall

Jeffrey C Gelpey

Apparatus and method for fabricating a backside illuminated photodiode array is described which does not use epoxy, and therefore has better transmission characteristics. The method uses indium or other coldweldable metal to fasten the detectors to the transmissive substrate. Because the indium is opaque in the waveband of detector sensitivity, it also forms an optical mask for each detector element.

Glue-free backside illuminated photodiode apparatus and fabrication process

A cold shield for an array of detectors of predetermined shape comprising a first cover of radiation blocking material formed with parallel rows of apertures and lying a first distance away from the detectors and a second cover of radiation blocking material formed with a plurality of apertures of generally the predetermined shape therethrough and lying a second distance, smaller than the first distance, away from the detectors so as to minimize background radiation from reaching the detectors while permitting desired radiation approaching the array from any of a plurality of angles to reach the detectors.

Tilted array with parallel cold shield

A high density optical detector mosaic array assembly having a plurality of interconnect locations comprised of IC readout pads in a pattern suitable for interconnecting a plurality of integrated circuit devices. The assembly comprises a substrate, a plurality of thin film metallization layers alternating with a plurality of thick film dielectric layers wherein the first of the thin film layers is deposited directly on the substrate and is delineated to form a plurality of interconnect lines disposed in a pattern suitable to form a first row of the dectector mosaic at a first edge of the assembly and terminating at an interconnect location. Terminal pads are applied to each such interconnect line and the first thick film dielectric layer is deposited over the thin film interconnect line such that only the terminal pads are left exposed. Each alternating layer of thick film and thin film layers are similarly disposed to form a complete interconnect pattern suitable for interconnecting with the integrated circuit devices and a plurality of detector rows forming the detector mosaic interconnect lines. Bonding pads are applied to the detector mosaic such that the fill factor for detectors is about 100% for bonding pads on centers in the range of about 25 micrometers.

High density small element optical mosaic detector

A backside contacted mosaic detector array which provides close detector packing in one or more directions by eliminating over the edge contacts typically used. The array uses indium or other cold-weldable metal, both as a means for fastening the array from the backside to its circuit board and as a means for providing electrical contact with each detector.

Backside mosaic photoconductive infrared detector array

Apparatus and method for electrically interconnecting two integrated circuit boards, which includes spring finger contact pads positioned on one board which are matched to raised contact pads on a second board in a manner such that the assembly is easily disassembled and reconnectable and such that it provides for exact height registration between boards. Accurate height registration is required when, for example, an electro-optical device referenced with respect to an optical system is mounted on one of the circuit boards.

Spring finger interconnect for IC chip carrier

An integrated circuit chip carrier having miniaturized electrical input/output interconnectors, such that the area of the chip carrier may be matched or minimized with respect to the area of the integrated circuit. Such input/output interconnectors are reusable, such that the chip carrier may be easily removed and reconnected to a mother board assembly. Input/output interconnections as provided which when used allow an electro-optical integrated circuit to become in focus.

Integrated circuit chip carrier

A shield for limiting the radiation received by individual detectors within a detector array of an electromagnetic radiation detection system to the radiation provided to the detectors by the optics of the system. The shield comprises a member of etchable glass having apertures formed therein, the position of the aperture edges being in predetermined relation to the edges of the detectors for shielding the detectors from electromagnetic radiation generated outside the field of view of the optics.

Method of fabricating a cold shield

An apparatus and method for fabricating a backside contacted mosaic detector array which provides close detector packing in one or more directions by eliminating over the edge contacts typically used. The method uses indium or other coldweldable metal, both as a means for fastening the array from the backside to its circuit board and as a means for providing electrical contact with each detector.

Apparatus and method for fabricating backside mosaic of photoconductive

Etchable glass cold shield for background limited detectors

A mounting means for apparatus useful for processing infrared signals including a pyroelectric detector array with a plurality of detector elements, a plurality of electrically conductive epoxy polymer mounting means having two ends and attached at one end to the detector array to provide individual electrical contact for each of the detector elements. The apparatus further includes circuit means attached to the other end of the mounting means for processing electrical signals from the array.

Mounting for pyroelectric detecctor arrays

A hybrid mosaic IR/CCD focal plane structure has high detector element packing densities which may be achieved using cost effective planar processing technology. The focal plane structure preferably includes an insulator layer over a silicon substrate which contains integrated circuit CCD signal processing circuitry. A mosaic photovoltaic (Hg,Cd)Te detector array is fabricated on the insulator layer. The photosignals from the detector array are coupled to the CCD circuitry by thin film electrical interconnects together with contact pads which extend through the insulator layer and are exposed at the surface of the insulator layer.

Hybrid mosaic IR/CCD focal plane

A hybrid mosaic IR/CCD focal plane structure is fabricated using planar thin film interconnects. Rows of detectors are formed on an integrated circuit substrate so that the rows of detectors are adjacent to rows of electrical contacts on the integrated circuit. Contact pads are plated onto the rows of contacts and the regions between adjacent rows of detectors are backfilled with an insulating material. The insulating material is then lapped to expose the contact pads and to form an essentially coplanar surface with the detectors. Thin film interconnects are formed over the coplanar surface between the exposed contact pads and detectors in the adjacent row.

Thin film interconnect for multicolor IR/CCD

A double-sided mosaic focal plane for infrared detection includes a semiconductor substrate having first and second opposing surfaces. Infrared detectors are mounted on the first surface and solid state signal processing circuitry is formed in the semiconductor substrate proximate the second surface. Interconnect means extend through the semiconductor substrate to interconnect the infrared detectors with the solid state signal processing circuitry.

Growing community of inventors

Chelmsford, MA, United States of America

William J White