Koninklijke Philips Corporation N.V.

Philips Image Guided Therapy Corporation

Hewlett-packard Company

Other

Agilent Technologies, Inc.

William J Ossmann

Bernard Joseph Savord

Wojtek Sudol

Stephen Charles Davies

Mckee Dunn Poland

Mike Lavy

Anjali Saini

Larry Pendergrass

Michael P Anthony

George Anthony Brock-Fisher

Matthew Mooney

Olivier Gerard

Rodney J Solomon

Thomas P Stephens

Martin K Mason

Benjamin M Herrick

Richard Allen Snyder

Xiang-Ning Li

Stephen Michael Grenon

Heather Knowles

Martha Wilson

Jie Chen

Michael Scarsella

Turuvekere R Gururaja

Robert H Banta, Jr

An imaging catheter assembly is provided. The imaging catheter assembly includes an interposer including a multi-layered substrate structure, wherein the multi-layered substrate structure includes a first plurality of conductive contact pads coupled to a second plurality of conductive contact pads via a plurality of conductive lines; an imaging component coupled to the interposer via the first plurality of conductive contact pads; and an electrical cable coupled to the interposer via the second plurality of conductive contact pads and in communication with the imaging component.

Intra-cardiac echocardiography interposer

A device for imaging within a body of a patient is provided. In one embodiment, the device includes a flexible elongate member that can be inserted into the body of the patient. The device also has an imaging assembly that is disposed at and extending a length of a distal portion of the flexible elongate member. The imaging assembly may include an array of imaging elements that may have an outward surface and an inward surface. The imaging assembly may further include an integrated circuit adjacent to the inward surface of the array of imaging elements. The device may further include a conductive plate adjacent to and extending at least a portion of a length of the imaging assembly. The conductive plate may receive heat generated by at least one of the array of imaging elements or the integrated circuit.

Ultrasound imaging device with thermally conductive plate

An imaging assembly for an intraluminal imaging device is provided. In one embodiment, the imaging assembly includes an imaging array positioned at a distal portion of the intraluminal imaging device. The imaging array may have a plurality of imaging elements arranged into subarrays. The imaging assembly also may include a micro-beam-former integrated circuit (IC) coupled to the imaging array at the distal portion of the intraluminal imaging device. The micro-beam-former IC includes a plurality of microchannels that may separately beam-form signals received from imaging elements of at least two subarrays. The imaging assembly further includes two or more signal lines that may couple to the micro beam-former IC. Each signal line may correspond to a specific subarray and may receive the beam-formed signals specific to corresponding subarray.

Intraluminal imaging devices with a reduced number of signal channels

A device for imaging within a body of a patient is provided. In one embodiment, the device includes a flexible elongate member that can be inserted into the body of the patient. The device also has an imaging assembly that is disposed at and extending a length of a distal portion of the flexible elongate member. The imaging assembly may include an array () of imaging elements that may have an outward surface and an inward surface. The imaging assembly may further include an integrated circuit () adjacent to the inward surface of the array of imaging elements. The device may further include a conductive plate () adjacent to and extending at least a portion of a length of the imaging assembly. The conductive plate may receive heat generated by at least one of the array of imaging elements or the integrated circuit.

An acoustic probe includes a plurality of acoustic array components separated and spaced apart from each other. Each of the acoustic array components includes: an array of acoustic element circuits disposed contiguous to each other at a first pitch; a plurality of pads each corresponding to one of the acoustic element circuits and formed within a circuitry area of the corresponding acoustic element circuit, the pads being disposed at a second pitch; a plurality of interconnection bumps each corresponding to one of the pads and being disposed in electrical connection with the corresponding pad, wherein the interconnection bumps are disposed at a third pitch; and a plurality of acoustic transducer elements on the interconnection bumps. The acoustic transducer elements are disposed at a fourth pitch. At least two of the first, second, third, and fourth pitches are different than each other.

Acoustic probe with components of acoustic elements having different pitches than each other

A third matching layer () affording wide bandwidth for an ultrasound matrix probe is made of polyethylene, and may extend downwardly to surround the array (S) and attach to the housing to seal the array (S).

Wide bandwidth matrix transducer with polyethylene third matching layer

Ultrasonic transducer including a multi-layer transformer arranged between a backing block and piezoelectric layer on each of which at least one matching layer is arranged. The transformer includes a substrate having an electronic circuit, one or more acoustically active layers and an interconnect layer interposed between the piezoelectric layer and the substrate. The properties of the substrate, each acoustically active layer and the interconnect layer are selected and then the acoustic impedance of the transformer at a side of the piezoelectric layer adjacent the transformer is determined. The properties are then varied, e.g., using a computer simulation, until values for these properties are obtained which provide a desired acoustic performance characteristic at the side of the piezoelectric layer adjacent the transformer. The electronic circuit is thus considered in the determination of the acoustic impedance of the transformer.

Method for designing ultrasonic transducers with acoustically active integrated electronics

Acoustic imaging systems are provided. A preferred system includes a protective cover configured to mate with a transducer body. The transducer includes a two-dimensional transducer element matrix array formed by a plurality of individually controllable transducer elements. The protective cover is superposed above the two-dimensional matrix array and is transparent to incident acoustic energy. Preferably, the protective cover is shaped to reduce patient discomfort and repetitive motion injuries to sonographers. Alternative embodiments comprise a shaped two-dimensional transducer element matrix array. Methods for improved ultrasound imaging are also provided.

Ultrasound transducer

A method for anatomical imaging includes acquiring image data representative of three-dimensional volume segments of an image volume of interest in a subject. The image data are acquired in synchronism with corresponding physiological cycles of the subject. Each volume segment contains image data distributed in three dimensions. Acquiring image data includes selecting a sequence of scan lines for each respective volume segment configured to minimize an occurrence of motion artifacts throughout the image volume. The image data representative of the volume segments is combined to produce a representation of a three-dimensional anatomical image of the image volume.

Artifact elimination in time-gated anatomical imaging

Acoustic imaging systems are provided. A representative acoustic imaging system includes a transducer that incorporates a backing and an acoustic element extending from the backing. The acoustic element includes a piezoelectric element and a de-matching layer. The de-matching layer is arranged between the backing and the piezoelectric element and exhibits an acoustic impedance greater than that of the piezoelectric element. The piezoelectric element exhibits a thickness that is less than one-half of a wavelength to be generated by the piezoelectric element. Methods also are provided.

Acoustic imaging systems adaptable for use with low drive voltages

Variable multi-dimensional apodization control for an ultrasonic transducer array is disclosed. The variable multi-dimensional apodization control is applicable to both piezoelectric based transducers and to MUT based transducers and allows control of the apodization profile of an ultrasonic transducer array having elements arranged in more than one dimension.

Variable multi-dimensional apodization control for ultrasonic transducers

A micro-machined ultrasonic transducer (MUT) having aperture, elevation and apodization controlled by apparatus located on the same substrate as the transducer, or by bias voltage control applied to MUT elements, allows for an efficient and compact ultrasonic probe. The control apparatus may take the form of field effect transistors (FET's), micro-machined relays, or doped regions on the substrate, or any other apparatus that may be located on the same substrate as that of the transducer, or by bias voltage sources connected to the MUT elements.

Aperture control and apodization in a micro-machined ultrasonic transducer

A plurality of applications for a micro-machined ultrasonic transducer (MUT) including an improved MUT array containing optimized transmit MUT elements and optimized receive MUT elements, a MUT array in which staggered MUT elements increase the sensitivity of the array, and a MUT array for multiple plane scanning.

Growing community of inventors

Acton, MA, United States of America

William J Ossmann