Motorola Corporation

William J Knutson

Bernard V Gasparaitis

Daniel M Smith

A combined keypad and speaker portion (10) is provided wherein a membrane keypad (26) having a plurality of keys (28) has a plurality of speaker sound perforations (38) interposed between the plurality of keys (28).

Combined keypad and speaker porting

A lighting panel (100) comprises a mat (106) of transparent optical fiber stands (202) woven together and encapsulated in a transparent panel element (104).

Lighting panel for liquid crystal display

A conductor provided on an insulating support has a portion which forms an inductor. Various components are connected to the conductor, as by soldering, to provide an electronic circuit suitable for a particular application. The conductor portion which forms the inductor has parallel branches and the value of the inductance can be changed by selectively open circuiting the branches. This can be accomplished after the components are connected and the complete circuit is tested to determine whether a change in the inductance value is required. The branches can be selectively open circuited by removing a portion of the cnductor by a laser beam which does not substantially heat the structure, with the heat which is produced being highly localized. Accordingly, this does not soften the solder connections of the components and there is no damaging effect on the circuit. The inductor portion as described can be connected in series with a coil, and the total inductance value of the coil and the conductor can be adjusted by cutting sections from the parallel branches to thereby provide the total inductance value required in a particular circuit application.

Microelectronic variable inductor

A radio frequency power amplifier includes a flat ceramic substrate having a conductive coating on one side and a plurality of conductors on the other side arranged in a predetermined pattern. At least one conductor is connected through the substrate to the conductive coating which is grounded. A plurality of components are connected to the conductors on the substrate including a transistor die, chip capacitors, air wound coils, a chip inductor and resistors. Conductors on the substrate are of a configuration to provide spiral inductors, some of which are connected in series with the air wound coils, which have tuning segments adapted to be severed to control the inductance after assembly of the components. Conducting bridges are also provided to join conductors which are spaced from, and insulated from, an intermediate conductor. The substrate is provided in an electrical and heat conducting housing having a base to which the conducting coating is electrically and mechanically secured, and three conducting side walls about the substrate. The fourth side includes terminals connected to a plurality of conductors for applying input signals and operating potential to the amplifier, and for deriving output signals therefrom. A conducting plate closes the top of the housing to completely enclose and shield the substrate and components thereon.

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Coral Springs, FL, United States of America

William J Knutson