Pace, Incorporated

Gtco Corporation

William J Kautter

Louis A Abbagnaro

William J Siegel

Robert G Brown

Robert S Quasney, Sr

Donald A Ice

Mark D Wecht

Joseph F Perret, Jr

An illumination apparatus for a digitizer tablet includes a support structure and a solid sheet optical light guide supported by the support structure and having first and second opposing surfaces and a plurality of edges. Light sources are carried by the support structure and positioned to direct light into light-receiving edges of the light guide. Reflecting structure is disposed adjacent the first surface of the light guide. A predetermined pattern is disposed on the first surface of the light guide structured and arranged in accordance with distance from the light sources.

Illumination apparatus for a digitizer tablet with improved light panel

Apparatus for soldering and desoldering an electronic component to or from a printed circuit board includes an alignment station and a soldering/desoldering station. The printed circuit board is mounted upon an adjusable X-Y table which can be indexed between the alignment station and the soldering/desoldering station. To align an electronic component with respect to th PCB, a vacuum pickup device is operated at the alignment station to pickup and support the component within an optical field of view above the PCB and the X-Y table is adjusted in X, Y and .theta. directions with respect to the component. Upon alignment of the component, the pickup device is lowered to temporarily adhere the component to the PCB by an adhesive flux. Thereafter, the X-Y table is indexed to a preset position below a hot air soldering nozzle and the component soldered in a known manner. A rotary device for shearing a defective electronic device from a PCB is also attached to the bottom of the soldering/desoldering nozzle.

Apparatus for removal and installing electronic components with respect

A probe for use with circuitry for monitoring signals emanating from a heated electrical appliance, the probe including a planar member having three layers, the first layer including at least a first electrically conductive portion adapted to support a piece of solder, the second layer being an electrically insulating layer disposed between the first layer and a third layer, the third layer being electrically conductive. A novel method and circuit using the above probe are also disclosed wherein a heated soldering iron or solder extractor tip or the like melts the piece of solder to establish good electrical connection for the signals from the tip to the monitor circuit through the molten solder and the first portion of the first layer.

Probe for use with circuitry for monitoring signals emanating from

This invention relates to a method and apparatus for removing and installing surface mounted devices (SMD's) with respect to a substrate such as a printed circuit board (PCB).

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Columbia, MD, United States of America

William J Kautter