International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

William J Grady

Jason E Minyard

Aaron Roger Cox

Jason Aaron Matteson

Michael Raymond Miller

Vinod Kamath

Jeffrey John Smith

A memory module cooling system includes a liquid cooled manifold assembly and a heat spreader assembly rotateably attached to the liquid cooled manifold assembly about an axis perpendicular to the memory module. The liquid cooled manifold assembly includes a manifold, an liquid inlet, and a liquid outlet. The heat spreader assembly includes a base in thermal contact with a heat pipe, and a heat spreader in thermal contact with the heat pipe, the heat spreader configured to thermally engage the memory module. In certain embodiments, thermal bonds are maintained between a plurality of neighboring memory modules when a particular heat spreader assembly is rotated away from an associated memory module.

Orthogonally hinged individualized memory module cooling

A system includes a support rack and a component housing. The support rack includes a pair of vertically-extending panels, and each panel of the pair of vertically-extending panels has one or more first mating members of a water coupler pair extending outwardly from the support rack. The component housing is slidably disposed between the pair of vertically-extending panels and has a front panel, a pair of sidewalls extending rearwardly from the front panel, a component water line, and two second mating members of the water coupler pair connected to each other by the component water line.

System for mounting and cooling a computer component

An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.

Cooling system for electronics

A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.

A mounting system, in one embodiment, includes two support ears, each support ear adapted for securing an electronic component to a rack. Each support ear includes a planar portion which includes at least one hole for receiving one or more fasteners for coupling to a side of the electronic component and a portion extending perpendicular to the planar portion having a frontal area. The perpendicular portion includes at least one pin positioned on a side opposite the frontal area for engaging with at least one hole in the rack, the at least one pin extending normal to the perpendicular portion in a direction about parallel to a plane of the planar portion, and a first fastener positioned on the side opposite the frontal area for coupling to the rack, the first fastener extending normal to the perpendicular portion in the direction about parallel to the plane of the planar portion.

Growing community of inventors

Cary, NC, United States of America

William J Grady