Hewlett-packard Development Company, L.p.

Other

William J Edwards

Timothy R Emery

Donald W Schulte

Naoto A Kawamura

David M Hagen

Jeremy Harlan Donaldson

Daniel A Kearl

Donald J Milligan

Martha A Truninger

Sadiq Bengali

Jeffery S Hess

Jeffrey Scott Obert

Steven David Leith

Diane Lai

Norman L Johnson

J Daniel Smith

James M Dewey

Zachary T McCourt

James A Dewey

Zachary Mccourt

A fluid container that includes body that provides a fluid reservoir. Additionally, the fluid container can also include an outlet structure. The outlet structure can include a conduit that extends from an outlet of the fluid container to the fluid reservoir. Moreover, the fluid container can include an outlet barrier and an interior barrier. The outlet barrier can be positioned within the conduit of the outlet structure in proximity to the outlet of the fluid container. Additionally, the outlet barrier can be structured to receive an inlet extension of a container device. The interior barrier can be positioned within the conduit of the outlet structure in proximity to the fluid reservoir. Additionally, the interior barrier can be displaceable relative to the outlet structure by the inlet extension.

Output mechanism for a fluid container

An electrical device includes an interconnect and a pair substrates at least one of which includes an integrated circuit, the pair of substrates being bonded together by a bond that includes a structure having multiple widths and a composition that is selected from the group consisting of a graded material and a first material upon a second material.

Printheads and printhead cartridges using a printhead

Bonding structure and method of making

In one embodiment, a fluid ejection device comprises a substrate having a fluid slot defined from a first surface through to a second opposite surface; an ejection element formed over the first surface and that ejects fluid therefrom; and a filter having feed holes positioned over the fluid slot near the first surface. Fluid moves from the second surface through the feed holes to the ejection element. In a particular embodiment, the filter is formed of a first material that is surrounded by a second material. In another particular embodiment, the filter is formed from the back side and is formed of the same material as the substrate.

Particle tolerant architecture for feed holes and method of manufacturing

A through-substrate etching process is monitored by providing a sacrificial electrode in proximity to a desired etch window on the substrate. An etch process is performed on the substrate. The etch process is monitored by measuring an electrical property of either the substrate or the sacrificial electrode or both.

Monitoring and test structures for silicon etching

Growing community of inventors

Albany, OR, United States of America

William J Edwards