Macdermid, Incorporated

Macdermid Enthone Gmbh

William J Decesare

Donald R Ferrier

Gary B Larson

John L Cordani

Richard A Bellemare

Edward T Donlon

Donald P Cullen

Ron Blake

Carmichael Gugliotti

Raymond A Letize

Ernest Long

James Watkowski

Lucia Justice

Richard L Kremer

Donald Desalvo

A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and blind micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to. receive copper electroplating thereon; (2) forming at least one of one or more through-holes and/or one or more blind micro-vias in the electronic substrate: and (3) electroplating copper in the at one or more through-holes and/or one or more blind micro-vias by contacting the electronic substrate with an acid copper electrolyte. The acid copper electrolyte is used to plate the one or more through-holes and/or the one or more blind micro-vias using a complex waveform including pulse reverse plating, DC plating and/or synchronous pulse plating. The complex waveforms can be used for filling through-holes and blind microvias with copper without defects.

Complex waveform for electrolytic plating

A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive copper electroplating thereon; (2) forming at least one of one or more through-holes and/or one or more micro-vias in the electronic substrate; and (3) electroplating copper in the at one or more through-holes and/or one or more micro-vias by contacting the electronic substrate with an acid copper electroplating solution. The acid copper plating solution comprises a source of copper ions; sulfuric acid; a source of chloride ions; a brightener; a wetter; and a leveler. The acid copper electroplating solution plates the one or more through-holes and/or the one or more micro-vias until metallization is complete.

Single step electrolytic method of filling through holes in printed circuit boards and other substrates

An alkaline solution for the microetching of copper in the course of printed circuit manufacture is provided by combining components which are a source of cupric ion, ammonium hydroxide and/or a source of ammonium ion, and a compound, other than ammonia, which is a chelator for cupric ion in the alkaline environment of the solution. The microetchant composition is stable, brings about a desired microroughening of the copper surface with minimal removal of copper, is easily regenerated, and does not promote pink ring. When an organosilane through-hole conditioning agent is included in the composition, the composition can be used as a means for effecting in one step the microetching and conditioning steps of a printed circuit through-hole metallization process.

Microetchant for copper surfaces and processes for using same

For attaining adhesion between copper circuitry innerlayers and pre-preg layers in a multilayer printed circuit, a conversion coating of copper oxide is provided on the metallic copper surfaces in a manner which develops an altered topography of the underlying metallic copper surfaces. Thereafter, a controlled dissolution and removal of a substantial amount of the copper oxide is effected, in a manner which does not adversely affect the already-developed topography of the underlying metallic copper, and such that the innerlayer, at the time of assembly with the pre-preg layers, has copper surfaces consisting of the topographically altered metallic copper and a relatively small amount of copper oxide thereon. Excellent bonding strengths are achieved with decreased incidence of pink ring formation as compared to conventional processes utilizing copper oxide for adhesion promotion.

Process for fabricating multilayer printed circuits

For attaining adhesion between copper circuitry innerlayers and pre-preg layers in a multilayer printed circuit, a conversion coating of copper oxide is provided on the metallic copper surfaces in a manner which develops an altered topography of the underlying metallic copper surfaces. Thereafter, a controlled dissolution and removal of a substantial amount of the copper oxide is effected, in a manner which does not adversely affect the already-developed topography of the underlying metallic copper, and such that the innerlayer, at the time of assembly with the pre-preg layers, has copper surfaces consisting of the topographically altered metallic copper and a relatively small amount of copper oxide thereon. Excellent bonding strengths are achieved with decreased incidence of pink ring formation as compared to conventional processes utilizing copper oxide for adhesion promotion. In addition, the copper ion containing solutions resulting from the controlled dissolution and removal of copper oxide can be economically utilized in formulating electroless copper plating baths.

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Wolcott, CT, United States of America

William J Decesare