Bell + Howell Company

Trans Technology Corp.

William H Spencer

Dwight G Westover

Raymond M McManaman

Andrew J Scherer

Thomas E Anderberg

Roy A Teves

Bayani E Roldan

Methods and apparatus for stacking predetermined sheets of various intermixed sizes in a stacking location by advancement of stacking devices into that location, selectively guide further sheets past the stacking location. That guiding of further sheets past the stacking location is mechanically slaved to the advancement of the stacking devices into the stacking location. Where the stacking devices are withdrawn from the stacking location preparatory to each stacking of a predetermined sheet, the guiding of that predetermined sheet into the stacking location is mechanically slaved to such withdrawal of the stacking devices. Where the sheets are stacked against a movable wall, an unobstructed space for receiving each sheet guided to the stacking location is permanently preserved between the movable wall and the withdrawn stacking devices.

Stacking methods and apparatus

A bus system architecture and method provides on a substrate a bus line system for first and second circuit boards designed to extend across the substrate. Individually dedicated first, second and third bus lines for the first circuit boards are provided in a first bus line array at one side of the substrate. Individually dedicated fourth, fifth and sixth bus lines for the second circuit boards corresponding, respectively, to the first, second and third bus lines, are provided in a second bus line array representing a mirror image of the first bus line array at an opposite side of the substrate. An area of the substrate between the first and second bus line arrays may be subdivided into sequential first and second regions adjacent the first bus line array, and sequential third and forth regions adjacent the second bus line array. A third bus line array is located in the first region for the first circuit board, and a fourth bus line array in the fourth region for the second circuit boards. Individual connectors may be provided in the second and third regions for the second and first circuit boards, respectively. A microprocessor system that may be combined with the bus system architecture has a first microprocessor controlling a second microprocessor and various peripherals, such as via one of the above mentioned bus line arrays, and has the second microprocessor control further peripherals, such as via another bus line array.

Bus system architecture and microprocessor system

Methods of a human operator processing first and second interrelated documents in pairs relative to a processing station provide a first document entry station for receiving a first document from the human operator, and a second document entry station for receiving a second document from the human operator. The human operator separates the interrelated first and second documents from each other and deposits the first document in the first document entry station while depositing the second document in the second document entry station. The deposited first document is transported from the first document entry station relative to the processing station, and the second document is transferred from the second to the first document entry station, for subsequent transport from such first station relative to the processing station.

Document processing systems

An apparatus for automatically connecting and disconnecting a battery backup supply senses when the potential of a main d.c. power supply drops below a first predetermined value, and in response thereto connects the battery backup supply to an electrical load. The apparatus also senses when the potential of the battery backup supply drops below a second predetermined value and in response thereto disconnects the battery backup supply from the electrical load.

Battery backup supply control means and method

A temperature compensation circuit for sensors of physical variables, such as temperature and pressure, employs an effective constant current source that is sensitive to ambient temperature and which has an adjustable thermal slope and an adjustable output at discrete temperatures. The effective constant current source may be connected across the input terminals of a sensor such as a pressure transducer employing strain gages or it may be connected in series with the excitation current of such a transducer. Additionally, the effective constant current source may be connected in the output of a sensor such as a thermocouple that is responsive to temperature changes. When connected to the input of a sensor, the temperature compensation circuit controls the excitation current through the sensor as a function of the ambient temperature of the sensor and compensation circuit. When connected in the output of the sensor, the temperature compensation circuit provides a voltage that is a function of the ambient temperature, which voltage is added to the output of the sensor to compensate for voltage variations due to changes in ambient temperature.

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Monrovia, CA, United States of America

William H Spencer