Lsi Logic Corporation

William H Harmon

Steven L Haehn

A backside failure analysis capable integrated circuit package having a removable plug for exposing the backside of the die or a cavity on the backside of the package for exposing the backside of the die. The package uses either a standard lead frame which must be removed prior to conducting a backside failure analysis or a non-standard lead frame which provides for access to the back side of the die.

Growing community of inventors

Manitou Springs, CO, United States of America

William H Harmon