International Rectifier Corporation

Siliconix Technology C. V.

William Grant

Sergio Fissore

Joshua Polack

Alan Frederik Golightly

A power module for low voltage applications, which does not include an insulated metal substrate is disclosed. The module includes a power shell and a plurality of lead frames each lead frame including a conductive pad on which one or more MOSFETs may be electrically mounted. The MOSFETs are electrically connected via wire bonds.

Low cost power semiconductor module without substrate

A power module that includes a lead frame having conductive pads molded in at the base thereof and a heatsink in thermal contact with the conductive pads through a thermally conductive adhesive.

Module for solid state relay for engine cooling fan control

A power module that houses components of a circuit for driving a three-phase motor. The power module includes a molded shell. A number of leads are embedded within the body of the power shell and extend from its exterior where they make electrical connection to exterior devices to a chamber within the molded shell where they are connected to respective components of the circuit. The power module includes capacitor leads, which are embedded in the molded shell, for making direct connection to respective bus capacitors, thereby allowing the capacitors to be directly assembled onto the power shell and become part of the power module. The leads embedded within the molded shell are arranged so that they pass over one another within the body of the molded shell. At least one of the leads has a portion within the chamber which acts as bridge to allow the passage of conductors.

Power module

A power module that includes a molded shell having a lead frame molded in a mold body, and a plurality of power semiconductor devices disposed directly on the die pads of the lead frame.

Power module having a heat sink

A dual output power module housing a dual output power circuit for providing variable power to two parallel connected fan motors is shown. The power module includes a pad which has disposed thereon two power switching devices, two intelligent power switches, and a power circuit board on which circuits for controlling the intelligent power switches are disposed. The module includes a power shell that surrounds the dual output power circuit, and a resilient, flexible enclosure which encapsulates the power shell and the circuit components within the power shell.

Fan control circuit and package

A power module for a motor in which the module is arranged to house both the high power devices needed to drive the phase windings of the motor and the control electronics needed to control the operation of the high power devices. The components are arranged such that the thermal energy generated by the high power devices is directed away from the control electronics for subsequent dissipation. An insulated metal substrate is used as the base of the module for directing the thermal energy. Further, the module components can be easily assembled through the use of solderless resilient connections from the control electronics to the other components in the module. The module employs a base, a power shell coupled to the base, and a circuit board positioned within the internal chamber of the power shell. The power shell has a plurality of walls forming an internal chamber and at least one conductive region. At least one electronic device is mounted to the conductive region.

Power module housing

An electronic module is provided using one or more field effect transistors (FETs) arranged on a conductive plate such that the module is capable of switching very high currents while remaining compact and still providing excellent thermal management properties. A plurality of conductive plates are bonded with an insulating material, the insulating material also forms a housing. One or more FETs are arranged inside the housing on one of the plates such that an electrical connection is made between a first region of the FET and the plate. A second FET region is electrically connected to another conductive plate. A circuit board is contained within the housing in which an electrical connection is made between the second region and the circuit board, and between a third FET region and the circuit board.

Electronic single switch module

A metal oxide semiconductor (MOSFET) half bridge module for use in a 42 volt internal combustion engine starter/alternator circuit. The module is a compact, high power handling device which has an extremely low inductance. This low inductance module supports the current and current slew rates necessary to properly operate in an internal combustion engine starter/alternator circuit across a wide temperature range. The module has a thermally conductive base. A plurality of lower circuit boards are adjacently positioned within the base along the same plane. At least one semiconductor device has a first surface, the first surface of the semiconductor device is mounted to one of the plurality of circuit boards. A common terminal has planar portion which is coupled to each of the plurality of lower circuit boards. An upper circuit board is in electrical contact with the plurality of lower circuit boards and includes a connector providing external access for drive signals for the semiconductor device.

Growing community of inventors

Fountain Valley, CA, United States of America

William Grant