Silverbrook Research Pty Ltd

Zamtec Limited

William Granger

Jan Waszczuk

Jason Mark Thelander

Eric Patrick O'Donnell

Stephen Richard O'Farrell

Stephen John Sleijpen

Craig Donald Strudwicke

David Bernardi

Joseph Tharion

David Oliver Burke

Peter John Morley Sobey

Desmond Bruce Boyton

Mark Janos

Toby Desmond Oste

James Andrew

Ralph Lewis Ranger

Graeme Kenneth Bowyer

The invention provides for a placement head for a die placing assembly of an assembler for assembling dice on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The placement head includes a first translation stage mounted on the die placement assembly, said first stage operatively displaceable along a first axis relative to the die placement assembly. The placement head also includes a second translation stage mounted on the first stage, the second stage displaceable perpendicular to the first stage. The placement head further includes a third translation stage mounted on the second stage, the third stage displaceable orthogonally to the first and second stages, as well as a die placer head mounted to the third stage, the placer head shaped and dimensioned to operatively receive a die from the dice conveyance mechanism and to place the dice onto the carrier.

Placement head for a die placing assembly

A pressure-based tester for testing an integrity of a printhead integrated circuit (IC) carrier includes a housing assembly; a cradle assembly coupled to the housing assembly and adapted to receive the printhead IC carrier, the cradle assembly further defining spouts adapted to engage with the printhead IC carrier; a regulated gas supply arranged in the housing assembly; a first gas supply line in fluid communication with the regulated gas supply; a pneumatic retaining mechanism in fluid communication with the gas supply via the first gas supply line, the pneumatic retaining mechanism for retaining the carrier in fluid communication with the spouts during testing of the platform assembly; a second gas supply line in fluid communication with the regulated gas supply, the second gas supply line being separated from the first gas supply line by a pressure regulator, the second gas supply line for supplying gas to the spouts; a pressure sensor for measuring a gas pressure at each spout and generating a signal indicative of the measured gas pressure; and a control system for controlling the regulated gas supply and the pneumatic retaining mechanism. The control system is further configured to receive the signal generated by the pressure sensor to determine the presence of any decay in the gas pressure at each spout.

Pressure tester for printhead integrated circuit carrier

The present invention relates to a fastening apparatus for fastening a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The fastening apparatus includes a support assembly. An authentication system is arranged on the support assembly and is configured to authenticate the printhead assembly. At least one bonding assembly is configured to bond the PCB to the printhead assembly. A controller is configured to control the bonding assembly to bond the PCB to the printhead assembly subsequent to the authentication of the printhead assembly.

Fastening apparatus with authentication system

The invention provides an assembler for constructing a pagewidth inkjet printhead by assembling inkjet ICs on a carrier having tortuous ink supply paths to each IC. The assembler supports and positions a diced wafer having the inkjet ICs, and picks and conveys a predetermined plurality of the ICs from the wafer to be sequentially placed across the carrier thereby constructing the pagewidth printhead. A die placement assembly of the assembler receives a clamp assembly's elongate body which has a pair or elongate retaining plates, an insert below the plates, and a diaphragm which receives the carrier and is pneumatically displaceable to urge the insert against the plates. A base/plate of the assembler's wafer positioning assembly has stages, one of which rotatably mounts a support plate which receives the wafer and has a motor which rotates the support plate underneath the assembler's die picker under control of the assembler's controller.

Wafer positioning system

This invention relates to a dice placement assembly for placing dice on a carrier. The assembly includes a support platform with a clamp mechanism configured to clamp the carrier onto said platform, and at least one camera operatively directed at the platform to detect alignment fiducials on the carrier. The assembly also includes a placement device having a vacuum mechanism to retrieve the dice from a supply mechanism, said placement device having actuators to align the dice with the carrier and to place the dice thereon once aligned, and a heater to heat the dice prior to placement on the test bed. Further included is a controller operatively controlling the clamp mechanism, the camera and the placement device, to facilitate accurate placement of the dice on the carrier.

Integrated circuit placement system

The present invention relates to a bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The bonding device includes a support structure assembly and a first heater assembly arranged on the support structure assembly to be movable along a first path and configured to bond the flexible PCB to the printhead. A bending mechanism is arranged on the support structure and is configured to bend the bonded PCB. A second heater assembly is arranged on the support structure assembly to be movable along a second path and is configured to bond the bent PCB to the printhead carrier. A control system controls operation of the heater assemblies and the bending mechanism.

Printed circuit board bonding device

A cradle assembly for a pressure decay leak tester is provided. The assembly operatively receives a printhead integrated circuit carrier having a plurality of printing fluid paths defined therein, respective fluid inlets in fluid communication with respective fluid paths and a locating formation to facilitate correct location of the carrier on the tester. The assembly includes at least one complementary locating formation for engaging the locating formation of the carrier, and at least one fluid outlet for charging the carrier with fluid via a respective fluid inlet of the carrier. Also included is a clamping device for clamping the carrier to the fluid outlet, so that the integrity of the fluid paths is observable via pressure decay testing, and a control system operatively connected to the clamping device for controlling operation of the clamping device.

Cradle assembly for a pressure decay leak tester

A pneumatic assembly for a pressure decay tester of printhead integrated circuits includes a pressurized air supply. A pneumatic clamping arrangement is in fluid communication with the pressurized air supply for clamping a carrier for the printhead integrated circuits such that the carrier is in fluid communication with the printhead integrated circuits. A valve arrangement applies a predetermined pressure to the carrier. A sensing arrangement senses a static pressure in the carrier. A control system is in communication with the clamping, valve and sensing arrangements to control operation thereof and to generate a discernible signal representing said static pressure such that a decay in said static pressure can be determined.

Pneumatic assembly for a pressure decay tester

The invention provides for a pressure-based tester for testing integrity of a platform assembly. The platform assembly includes a pair of assembled platform components fastened together and a fluid path extending into both components, the platform assembly suitable for supporting printhead integrated circuits to be tested. The tester includes a housing assembly, a regulated gas supply arranged in the housing assembly, and a retaining mechanism in fluid communication with the gas supply and configured to retain the platform assembly in fluid communication with the gas supply during testing of the platform assembly. The tester also includes a pressure measuring apparatus operatively connected to the gas supply and configured to generate a signal corresponding to a pressure value applied to the retaining mechanism, and a control system configured to control operation of the regulated gas supply, the retaining mechanism and configured to receive the signal from the pressure measuring apparatus and to detect decay in the pressure value.

Pressure-based tester for a platform assembly

The invention provides for a clamp assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The clamp assembly includes an elongate clamp body, the body shaped and configured to be received by the die placement assembly, and a pair of elongate retaining plates mounted on top of the body. The clamp also includes an insert shaped and dimensioned to be received in the body below the plates, the insert operatively receiving said carrier, as well as a diaphragm positioned in the body, the diaphragm pneumatically displaceable to operatively urge the insert against the retaining plates.

Clamp assembly for an assembler of integrated circuitry on a carrier

Provided is a leak tester for a carrier for printhead integrated circuits. The carrier has at least one fluid inlet in fluid communication with a plurality of fluid outlets via discrete fluid paths. The tester includes a support assembly that includes at least one receptacle shaped and configured to receive at least one respective carrier, and a pressurized fluid supply arranged on the support assembly and configured to supply pressurized fluid to the fluid inlets, the pressurized fluid supply incorporating a sealing mechanism configured to engage the fluid inlets in a sealing manner. The tester also includes a pressure measurement arrangement operatively arranged with respect to the pressurized fluid supply to measure pressure applied at the fluid inlets, and a controller operatively connected to the pressure measurement arrangement and pressurized fluid supply, the controller being configured to control the fluid supply to charge the carrier with pressurized fluid until a predetermined pressure is reached, and to monitor the pressure for a predetermined period of time.

Leak tester for a carrier for printhead integrated circuitry

The invention relates to an adhesive application apparatus for use with an assembling machine for assembling operatively upper and lower components for carrying printhead integrated circuits. The application apparatus includes a plate and a dispensing mechanism which includes an adhesive reservoir, said mechanism being operatively engaged with said plate in a sealing and sliding manner, the mechanism configured to dispense adhesive onto the plate when sliding along the plate. The apparatus also includes a displacement mechanism to slide the dispensing mechanism along the plate, and a control system to control operation of the dispensing and displacement mechanisms.

Adhesive application apparatus for use with an assembling machine

The invention provides for an imaging apparatus for imaging integrated circuits and a respective integrated circuit carrier. This enables positional analysis to be carried out on the integrated circuits and respective carrier. The imaging apparatus includes a support structure, and a bed mounted on the support structure and displaceable along an operatively horizontal axis, the bed being configured to support a nest assembly that operatively retains the integrated circuit carrier and respective integrated circuits. Also included is a support assembly operatively mountable with respect to a bed on which the integrated circuit carrier and integrated circuits are supported, in use. The apparatus further includes an image recordal device mounted on the support assembly and configured to record an image representing the integrated circuit carrier and integrated circuits, the support assembly including an adjustment mechanism to enable adjustment of a position of the image recordal device relative to the bed.

Imaging apparatus for imaging integrated circuits on an integrated circuit carrier

The invention relates to a measuring apparatus. The apparatus includes a housing assembly that defines an enclosure, a control system mounted in the housing assembly, and an operator interface mounted on the housing assembly and connected to the control system to allow an operator to control the measuring apparatus. The apparatus also includes a measuring table assembly mounted in the housing assembly and configured to receive a nest assembly supporting an integrated circuit carrier carrying a number of integrated circuits, and a camera assembly mounted in the housing assembly and configured to generate image data representing the integrated circuit carrier and the integrated circuits. The camera assembly is connected to the control system which is configured to carry out a positional analysis on the integrated circuit carrier and the integrated circuits to determine at least one of positions of the integrated circuits on the carrier and relative positions of consecutive integrated circuits.

Measuring apparatus for performing positional analysis on an integrated circuit carrier

A method for connecting a flexible printed circuit board (PCB) to a printhead assembly that includes a printhead carrier and an ink ejection printhead carried by the carrier. The method includes the steps of: adhering the PCB to a first surface of the printhead; receiving the printhead and PCB in a mechanical nest, and actuating the nest into a position below a heated platen assembly; heating the heated platen assembly and actuating the heated platen assembly rectilinearly towards the nest, the heated platen assembly thereby compressing the PCB and the printhead; actuating a forming bar assembly, provided adjacent the heated platen assembly, rectilinearly towards the nest, the forming bar assembly thereby bending a portion of the PCB extending beyond the printhead towards the printhead assembly; and heating a heater cartridge and actuating the heater cartridge rectilinearly towards the print head printhead in a direction substantially perpendicular to the direction in which the forming bar assembly is actuated, whereby the PCB is connected to the printhead and bonded to the printhead carrier.

Growing community of inventors

Balmain, Australia

William Granger