Agilent Technologies, Inc.

Hewlett-Packard Company

William Gong

Richard Paul Tella

Charles C Morehouse

Heinz Breu

John R Birk

Sidney Liebes, Jr

Brian Elliot Lemoff

George M Clifford, Jr

Tirumala R Ranganath

Glenn Hoch Rankin

Richatd P Tella

The present invention involves the use of coupling fixtures that permit optical elements to be aligned with planar waveguides of planar lightwave circuits. In particular, alignment of the coupling fixtures typically does not require powering of the optical element yet provides a degree of alignment that is comparable to that obtained by active alignment techniques. The alignment process is accompanied by an assembly process that may be performed at relatively high temperatures. This typically makes it possible to use solder for attaching the optical element to the planar lightwave circuit while retaining alignment accuracy. This is advantageous since soldering typically is the preferred choice for assembling components, such as single-mode devices, that require a relatively high degree of alignment precision together with good mechanical rigidity.

Optical systems and methods using coupling fixtures for aligning optical elements with planar waveguides

The invention provides a system and method for reliably and accurately measuring the gap between two materials when the depth of gap is less than the smallest distance that an optical thickness gauge (OTG) is able to measure. The invention is practiced by forming a suitable slot (or a groove, channel, hole or other suitable deformation) having a precisely known depth in at least one material. The sum of the distance of the gap and the depth of the slot is at least equal to the smallest distance that the OTG can measure. The slot is positioned over the materials and under the OTG probe head such that a cavity is formed. The depth of the cavity is measured. Since the distance of the slot is known, the depth of the gap is determined by subtracting the known depth of the slot from the measured depth of the cavity.

Optical measurement for measuring a small space through a transparent surface

Planar optical waveguide apparatus and methods for fabricating planar optical waveguide apparatus. The apparatus has a core layer and a cladding layer, the core layer having at least one optical waveguide, and an alignment structure spaced from and positioned with respect to the at least one optical waveguide to facilitate measuring a position of the at least one optical waveguide. The alignment structure has a first alignment structure, such as a reflecting member, to facilitate measuring a height of the at least one optical waveguide; and a second alignment structure, such as alignment marks, to facilitate measuring positions of the at least one optical waveguide in a plane of the at least one optical waveguide. The method includes forming both the optical waveguide and at least a portion of the alignment structure simultaneously in a single processing step to ensure that the optical waveguide and the alignment structure are in perfect registration.

Planar optical waveguide with alignment structure

A solder reflow system is disclosed that includes a substrate, a solder pad disposed upon the substrate, an optical component disposed upon the solder pad, and a laser positioned above the substrate with laser output focused sufficiently close to the solder pad to reflow the solder when the laser is powered. Also disclosed is a method for reflowing a solder joint, including: providing an optical component assembly including a substrate, a solder pad disposed upon the substrate, solder disposed upon the solder pad, and an optical component disposed upon the solder pad; providing a laser; positioning the laser above the substrate with laser output focused sufficiently close to the solder pad, instead of directly over the solder pad; and powering the laser, thereby transferring energy through the substrate into the solder pad, and reflowing the solder.

Reflowing of solder joints

The split-beam optical thickness gauge (OTG) measures the height difference of two adjacent surfaces. Low-coherence light is generated by the low-coherence light source. The split-beam probe head receives the low-coherence light and splits the incoming low-coherence light into a primary beam and walk-off beam. The primary beam shines upon a first surface and is reflected back up into the split-beam probe head. The walk-off beam shines upon a second surface and is reflected back up into the split-beam probe head. Spatial separation between the primary beam and the walk-off beam ensures that each beam shines substantially on only one of the surfaces. An incorporated polarizer assures that the primary and walk-off beams interfere. The reflected light returns to the autocorrelator and is detected so that distance measurements can be determined based upon a change in the path difference between the reflected primary beam and the walk-off beam.

Optical measurement system and method for determining height differential between two surfaces

An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic components so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded in then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips. A telecentric lens system is used in the optical sensing of the position of the lead tips so that measurement of the distances between leads is unaffected by variations in the separation between the lead tips and the sensing device.

System for sensing and forming objects such as leads of electronic

An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic components so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded is then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips. A telecentric lens system is used in the optical sensing of the position of the lead tips so that measurement of the distances between leads is unaffected by variations in the separation between the lead tips and the sensing device.

An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic compnents so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded is then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips. A telecentric lens system is used in the optical sensing of the position of the lead tips so that measurement of the distances between leads is unaffected by variations in the separation between the lead tips and the sensing device.

Growing community of inventors

Sunnyvale, CA, United States of America

William Gong