Skyworks Solutions, Inc.

Sige Semiconductor, Inc.

William Gerard Vaillancourt

Lui Ray Lam

James Henry Ross

Bryan J Roll

Andrew Raymond Chen

Chun-Wen Paul Huang

Kenneth Michael Searle

Jose Harrison

Nicholas Nunns

Configuration devices in a module. In some embodiments a radio-frequency module includes a serial bus including a first serial data line and a second serial data line. The radio-frequency module also includes a control component coupled to the serial bus and the first switch, the control component configured to determine whether first data is detected on the first serial data line, determine whether second data is detected on the second serial data line, and decode a command based on the first data and second data when the first data is detected on the first serial data line and when the second data is detected on the second serial data line.

Systems and methods related to configuring devices in a module

Configuration devices in a module. In some embodiments, a radio frequency module includes a serial bus including a first serial data line and a second serial data line. The radio-frequency module also includes a first switch coupled to a first device and a third line. The radio-frequency module further includes a module coupled to the serial bus and the first switch, the module configured to determine whether first data is detected on a first serial data line, determine whether second data is detected on a second serial data line, adjust a configuration of the first switch when the first data is detected on the first serial data line and the second data is detected on the second serial data line.

Coupling and decoupling devices in a module

Configuring devices in a module

Systems and methods are disclosed for a multi-mode radiofrequency (RF) module comprising a semiconductor die and a power amplifier residing on the die. The power amplifier is configured to operate in a first RF mode corresponding to a first RF wireless technology standard and a second RF mode corresponding to a second RF wireless technology standard. A first set of circuitry within the power amplifier is active in the first RF mode and a second set of circuitry within the power amplifier is active in the second RF mode.

Multi-mode integrated front end module

Disclosed herein are apparatus and methods for antenna sharing in a mobile device. In certain configurations, a mobile device includes a switching circuit that controls access of a plurality of transceivers to a plurality of antennas. The switching circuit includes a multi-pole multi-throw switch and a single-pole multi-throw switch, and has a first mode in which the switching circuit electrically connects a WiFi transceiver to a first antenna via a first transmit signal pathway through the multi-pole multi-throw switch. The switching circuit also has a second mode in which the switching circuit electrically connects the WiFi transceiver to a second antenna via a second transmit signal pathway through both the multi-pole multi-throw switch and the single-pole multi-throw switch. The multi-pole multi-throw switch includes an insertion loss component along the first transmit signal pathway to substantially match a total insertion loss of the first and second transmit signal pathways.

Apparatus and methods for antenna sharing in a mobile device

Disclosed are switching circuits and methods that enable a device to switch between two wireless protocols with antenna sharing. In some implementations, the device may use two different wireless protocols concurrently and with high isolation. In some implementations, the device can be provided with insertion loss matched transmission diversity for one of the wireless protocols. In some embodiments, various signal paths and related switches that allow such functionalities can be implemented on a single die such as a silicon-on-insulator (SOI) die.

Low-loss high-isolation switching architecture

In order to achieve electromagnetic and/or thermal isolation between components in close proximity to each other on a common module substrate, an alternate package and method for manufacturing the package is provided. Inventive methods utilize a grounded, metal-coated overmold for a IC module package that can provide an alternate thermal path to heat sink high power components generating excess heat energy and/or provide general electromagnetic shielding and isolation between two integrated circuits in very close proximity that are susceptible to electromagnetic interference. A dielectric layer conformably covers semiconductor dies mounted on a substrate. On some semiconductor dies, a portion of the dielectric layer is removed from the back surface of the semiconductor dies to allow direct contact between the exposed back surface of the dies and a metallization layer forming part of the overmold. This direct contact allows heat energy to be drawn away from the dies. The metallization layer also acts to shield the dies from disruptive electromagnetic energy radiated from other dies in close proximity.

Methods for integrated circuit module packaging and integrated circuit module packages

Systems and methods are provided for a stacked die configuration of a high isolation switch and a rejection filter where transmit and receive signals are desired to have a high out-of-band rejection and a low loss band-pass region. In some aspects of the invention the high isolation switch is a double pole double throw switch modified to operate as a high isolation single pole double throw (SPDT) switch. In some aspects of the invention the high isolation switch is a conventional high isolation SPDT switch. The switch is mounted on a low profile rejection filter having metallization on a portion of an outer surface of the rejection filter. The metallization on the outer surface of the rejection filter provides an AC ground layer in close proximity to the switch that provides a short coupling path between the switch and the AC ground. The resulting switch-filter component also results in a smaller footprint than if the two devices were mounted individually and/or adjacently. The switch-filter component has applications in devices requiring high isolation between transmit and receive paths, for example use within a front-end module (FEM) of a single antenna, multi-radio device.

Growing community of inventors

Methuen, MA, United States of America

William Gerard Vaillancourt