Raytheon Company

Ol Security Limited Liability Company

Raytheon Ti Systems, Inc.

Tally Loch Investments LLC

William Gerald Wyatt

Richard Martin Weber

Gary J Schwartz

James A Pruett

James L Haws

Kerrin A Rummel

James F Kviatkofsky

Kirk A Miller

Byron Elliott Short, Jr

Donald C Price

Christopher T Moshenrose

Timothy E Adams

Albert P Payton

Brandon H Allen

Richard Daniel DeLaMatyr

Larry G Taunton

Daniel J Weissmann

Morris E Finneburgh

David B Denniston

Jeffrey A Gilstrap

James A Prueti

Card Libby

A cooling structure includes a first plate, a second plate separated from the first plate, and an inlet adapted to receive a cooling fluid. The cooling structure also includes a first cooling portion coupled to the first plate and adapted to maintain a first temperature. The cooling structure further includes a second cooling portion coupled to the second plate and adapted to maintain a second temperature different from the first temperature.

Multi mode thermal management system and methods

According to one embodiment, a cooling system for heat-generating structures comprises a cooling loop and a heat exchanger. The cooling loop directs a flow of a fluid coolant to both an active heat-generating structure and an inactive heat-generating structure. The fluid coolant receiving thermal energy from the active heat-generating structure and transfers thermal energy to the inactive heat-generating structure when a temperature of the fluid coolant is greater than an ambient temperature of an environment surrounding the heat-generating structures. The active heat-generating structure is operable to switch to an inactive state and the inactive heat-generating structure is operable to switch to an active state. The heat exchanger is in thermal communication with the first and second heat-generating structures and is operable to receive the fluid coolant at a first temperature and dispense of the fluid coolant out of the heat exchanger at a second temperature.

System and method for cooling structures having both an active state and an inactive state

An apparatus, system and method for multi-orientation single or two phase coldplate with positive flow characteristics is disclosed. In representative embodiments and applications, the present invention generally provides improved methods and systems for cooling through fluid cooled coldplates.

Multi-orientation single or two phase coldplate with positive flow characteristics

An apparatus includes a thermally conductive section with a side facing approximately parallel to an axis and adapted to be thermally coupled to a circuit component, and includes a fluid supply section which directs a fluid flow along the axis toward an opposite side of the thermally conductive section. The thermally conductive section splits the fluid flow into a plurality of flow portions which each flow through the thermally conductive section in a direction approximately parallel to a plane perpendicular to the axis, the flow portions exiting the thermally conductive section at a plurality of respective locations disposed along a substantial portion of the periphery of the thermally conductive section.

Method and apparatus for cooling a circuit component

A cooling system for a heat-generating structure includes a heating device, a cooling loop, and one or more reservoirs. The heating device is configured to heat fluid coolant comprising a mixture of water and antifreeze and vaporize a portion of the water into vapor while leaving a portion of the antifreeze as liquid in the fluid coolant. The cooling loop has a portion that splits the fluid coolant received from the heating device into a first path configured to receive at least some of the portion of the water as vapor and a second path configured to receive at least some of the portion of the antifreeze as liquid. The one or more reservoirs are configured to receive one of the at least some of the portion of the water as vapor from the first path or the at least some of the portion of the antifreeze as liquid from the second path.

System and method for separating components of a fluid coolant for cooling a structure

According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.

Method and apparatus for cooling electronics with a coolant at a subambient pressure

A method for cooling a structure includes flowing a saturated refrigerant through one or more passageways in the structure while maintaining the refrigerant at a substantially constant pressure. The method also includes evaporating at least a portion of the refrigerant at a substantially constant temperature throughout the passageways in the structure.

Method and system for cooling

In certain embodiments, estimating air in a cooling system includes measuring a property that can be used to estimate the air to yield a plurality of measurements. The measurements are performed for different heat loads and for different concentrations of non-condensable gas in the cooling system. The measurements are stored a data set.

Sensing and estimating in-leakage air in a subambient cooling system

According to one embodiment of the disclosure, a cooling system for a heat-generating structure comprises a heat exchanger, a first structure, a condenser heat exchanger, and a second condenser. The heat exchanger is in thermal communication with a heat-generating structure. The heat exchanger has an inlet and an outlet. The inlet is operable to receive fluid coolant substantially in the form of a liquid into the heat exchanger, and the outlet is operable to dispense fluid coolant at least partially in the form of a vapor out of the heat exchanger. The first structure directs a flow of the fluid coolant substantially in the form of a liquid to the heat exchanger. Thermal energy communicated from the heat-generating structure to the fluid coolant causes the fluid coolant substantially in the form of a liquid to boil and vaporize in the heat exchanger. The condenser heat exchanger receives a flow of the fluid coolant at least partially in the form of a vapor from the heat exchanger and transfers at least a portion of the thermal energy within the fluid coolant to a heat sink. The second condenser assists the condenser heat exchanger in transferring at least a portion of the thermal energy within the fluid coolant away from the fluid coolant. The second condenser is selectively activated when the heat sink reaches an undesirable temperature.

Topping cycle for a sub-ambient cooling system

According to one embodiment, a heat removal system for a computer room includes a heat pipe having two ends. One of the ends is thermally coupled to one or more of a number of components forming a portion of a computing system. The other end is thermally coupled to a heat dissipation mechanism. The heat pipe is operable to move heat from the components of the computing system to the heat dissipation mechanism.

Heat removal system for computer rooms

According to one embodiment, a system for cooling computing components includes a computing rack housing a plurality of computing components of a computing system. A heat absorbing plate is disposed in and removable from the computing rack. The heat absorbing plate is thermally coupled to an outer surface of a computing component and comprises a plurality of walls defining a cavity containing a two-phase coolant. The cavity has a continuous volume allowing the two-phase coolant to absorb heat from the computing component and to transfer the heat to a heat transfer mechanism. The computing rack has a sidewall that is thermally coupled to the heat absorbing plate and comprises the heat transfer mechanism, which is operable to receive the heat transferred from the heat absorbing plate.

Systems and methods for cooling a computing component in a computing rack

According to one embodiment, a method for improving heat transfer between a cold finger of a cryogenic cooler and a Dewar includes forming an annulus between the cold finger of the cryogenic cooler and the Dewar by inserting the cold finger into the Dewar. The cold finger has a first end and a second end. The method also includes inhibiting the formation of convective currents within the annulus in a direction between the first end and the second end. According to another embodiment of the invention, the cooling system includes a cryogenic cooler that includes a cooling section operable to generate cooling fluid and a cold finger operable to receive the cooling fluid. The cooling system also includes a Dewar formed with a void region coupled to an infrared detector. The cold finger is positioned within the void region of the Dewar creating an annulus. The cooling system also includes at least one obstruction disposed within the annulus and operable to inhibit the formation of convective currents in a direction along a length of the cold finger.

Method and system for cryogenic cooling

According to one embodiment, an apparatus includes a fluid coolant and structure which reduces a pressure of the fluid coolant through a subambient pressure at which the coolant has a cooling temperature less than a temperature of the heat-generating structure. The apparatus also includes structure that directs a flow of the fluid coolant in the form of a liquid at a subambient pressure in a manner causing the liquid coolant to be brought into thermal communication with the heat-generating structure. The heat from the heat-generating structure causes the liquid coolant to boil and vaporize so that the coolant absorbs heat from the heat-generating structure as the coolant changes state. The structure is configured to circulate the fluid coolant through a flow loop while maintaining the pressure of the fluid coolant within a range having an upper bound less than ambient pressure. The apparatus also includes a first heat exchanger for exchanging heat between the fluid coolant flowing through the loop and a second coolant in an intermediary loop so as to condense the fluid coolant flowing through the loop to a liquid. The apparatus also includes a second heat exchanger for exchanging heat between the second coolant in the intermediary cooling loop and a body of water on which the ship is disposed.

Method and apparatus for cooling with coolant at a subambient pressure

A heat exchanger extracts heat from a two-phase fluid coolant so that the coolant changes from a vapor state to a liquid state. Two valves have respective inlets which communicate with the coolant in the heat exchanger, and which are physically spaced from each other. Valve control structure responds to the presence of liquid at the inlet to either valve by opening that valve, so that the liquid coolant flows through the valve to a discharge section. A different feature involves a housing with a heat exchanger therein, the heat exchanger having a plurality of coolant conduits that are axially spaced. A flow of air travels axially within the housing, then flows transversely past the conduits to the other side thereof, and then resumes flowing axially on the other side of the conduits.

Growing community of inventors

Plano, TX, United States of America

William Gerald Wyatt