Motorola Corporation

William G Skoda

Marlin Luff

Thomas A Knecht

Robert S Witte

Ross A Miesem

Joyce K Yamamoto

John E Mattson

Paul F Fenlon

William Kiscellus

Piyush Chaudhari

Douglas B Munz

Martin Luff

R Victor Thompson

A method of producing a glass/metal package where a glass portion of the package is built up around a provided leadframe (10) using applications of solderable and glass pastes (20) which are subsequently fired (30). The glass paste and leadframe are chosen to have similar coefficients of expansion and the leadframe is pretreated to degasify and control oxidation of the metal to promote glass adhesion to the leadframe and prevent microcracking at a glass/metal interface. A seal ring is applied to the glass paste (40) and a lid is attached to the seal ring (50). The package is used to provide an sealed inert internal environment for sensitive electronic components such as a piezoelectric element. The package may be configured for leaded or surface mounting (60).

Glass/Metal package and method for producing the same

A surface mount crystal package (10) receptacle mounting adapted to canti-leverably receive a piezoelectric element. The surface mount crystal package (10) is configured to hermetically enclose a crystal resonator (19) or crystal filter mounted in a proximal base (12) in a cantilever fashion. This package (10) is hermetically sealed in the proximal base 12, a distal cap (14) and sleeve (16). The package (10) is adapted to improve and faciliate surface mounting, provide a low cost and automatable assembly, and provide a low-stress mounting of a piezoelectric element in a simplified and portable design.

Surface mount crystal package with receptacle mounting

An ultra thin piezoelectric quartz crystal package can be realized by using adhesive dollops to compliantly mount a piezoelectric device within a thin package. The adhesive dollops maintain spacing between the upper and lower surfaces of the piezoelectric device (18) and the surfaces (13 and 15) of the housing that is comprised of upper and lower substrates (12 and 14).

Ultra-thin surface mount crystal package

A universal crystal holder is provided which is capable of supporting piezoelectric crystals having virtually any size and shape. The crystal holder includes two support structures, each having a downwardly sloping surface for accepting a side of the crystal to be supported. Since crystals placed in the universal crystal holder of the invention are self-aligned, the placement of a crystal in the holder is easily automated.

Universal piezoelectric crystal holder

A crystal holder is provided which is capable of supporting any one of a plurality of piezoelectric crystals having different preselected diameters. The crystal holder includes two side portions, each portion having a stair step-like structure, the stair steps of one side portion leading upwardly and away from the stair steps of the remaining side portion. Each step of one side portion is respectively horizontally aligned with a corresponding step of the remaining side portion such that each step pair thus formed has a different distance therebetween and is thus capable of accepting for mounting one of a plurality of piezoelectric crystals having preselected diameters corresponding to the distances between the steps of the step pairs.

Crystal holder for different sizes of crystal

An electrically conductive terminal having a connecting end and a mating end is affixed to a terminal assembly, the resultant subassembly placed within a housing containing a circuit board. The subassembly is located to effect electrical connection between the connecting end of the terminal and a pad on the circuit board, and to position the mating end externally to the volume to be potted. Connection between the terminal and the pad is reinforced by a solder flow technique. A potting material fills the housing encapsulating the circuit board and terminal assembly.

Growing community of inventors

Oak Park, IL, United States of America

William G Skoda