Gore Enterprise Holdings, Inc.

3m Innovative Properties Company

William G Petefish

Mark F Sylvester

Paul J Fischer

Donald R Banks

Ronald G Pofahl

David A Hanson

An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated circuit chip to a printed wiring board via solder ball connections, while providing reduced power distribution impedance of less than or equal to approximately 0.60 ohms at operating frequencies in excess of 1.0 gigahertz.

Interconnect module with reduced power distribution impedance

The present invention generally relates to the field of integrated circuit chip packaging. More particularly, the present invention relates to methods of manufacturing integrated circuit chip packages, and methods for electrically connecting and bonding or attaching semiconductor devices to an integrated circuit chip.

Method for assembling an integrated circuit chip package having an

Method for assembling an integrated circuit chip package having at least

Growing community of inventors

Chippewa Falls, WI, United States of America

William G Petefish