Xerox Corporation

Other

William G Hawkins

Donald J Drake

Cathie J Burke

Thomas A Tellier

James F O'Neill

Michael Robert Campanelli

Thomas E Watrobski

Gary Alan Kneezel

Roger Guy Markham

Dale R Ims

Sophie V Vandebroek

Diane Atkinson

Yonglin Xie

Stephen F Pond

Ivan Rezanka

Richard V LaDonna

Alan D Raisanen

Michael P O'Horo

Scott Charles Warner

Roberto E Proano

Pamela J Hartman

Olaf Muller

Scott N Seabridge

John Richard Andrews

Steven Robert Moore

Gary Daniel Redding

Juan J Becerra

Almon P Fisher

Brian S Hilton

Joseph F Stephany

Joseph J Wysocki

Herman A Hermanson

Christopher R Morton

Mildred Calistri-Yeh

Peter J John

Raymond E Bailey

Eduardo Mariano Freire

Michael C Ferringer

Yungran Choi

Daniel O Roll

Biay-Cheng Hseih

Igal E Klein

C Glenn Prince

Roy A Trowbridge, Jr

Jerry G Black

Narayan V Desphande

A fluid ejector includes a fluid channel having a resistive heater and terminating in a nozzle, a common bus formed transverse to the fluid channel and between the resistive heater and the nozzle, a connection line laterally adjacent to the fluid channel, and a connection structure for electrically connecting the common bus with the resistive heater and the connection line, the connection structure including a first set of one or more layers for electrical connection and a second set of one or more layers for covering the common bus and connection line. The first set of one or more layers includes a doped polysilicon layer on or overlaid by an optional tantalum-silicide layer. The second set of one or more layers includes a nitride layer on or overlaid by a tantalum layer.

Polysilicon feed-through fluid drop ejector

A method and Apparatus for protection of semiconductor micromechanical devices that use circuits with dynamic logic addressing is disclosed. In one exemplary embodiment of the invention, a fail-safe circuit is provided for an ink jet print head integrated circuit which prevents a catastrophic consequence of the dynamic logic addressed integrated circuit losing its charge.

Fail-safe circuit for dynamic smartpower integrated circuits

Printing systems and methods that reduce inter-color bleeding between dark and light colored inks without losing productivity of a color ink jet printer by distributing the printing of a total amount of black ink required in a single swath over multiple passes while each of the color inks required for the same swath is printed in a single pass. For example, the print method may print a single swath by printing portions of the slow dry black ink in three passes while printing each of the fast dry color inks in single passes.

System and method for reducing inter-color bleeding in liquid ink jet printing

The new heater element design has a pit layer which protects the overglaze passivation layer, PSG step region, portions of the Ta layer and dielectric isolation layer and junctions or regions susceptible to the cavitational pressures. Further, the inner walls of the pit layer define the effective heater area and the dopant lines define the actual heater area. In alternative embodiments, the dopant lines define the actual and effective heater areas, and an inner wall and a dopant line define the actual and effective heater areas. Further, when the new heater element designs are incorporated into printheads having full pit channel geometry and open pit channel geometry, the operating lifetime of the printhead is extended because the added protection of the pit layer prevents: 1) passivation damage and cavitational damages of the heater elements; and 2) degradation of heater robustness, hot spot formations and heater failures well into the 10,pulse range. The printhead incorporating the new heater element design can be incorporated into drop-on-demand printing systems of a carriage type or a full width type.

Thermal ink jet heater design

The systems and methods of this invention allows for an electrical contact structure of the drop ejecting transducer in an inkjet printhead to be designed in such a way that the relatively thick electrical contact lines are not in the ink drop ejection path between the drop ejector transducer and the corresponding nozzle. Such a design thereby minimizes any visible defects due to misdirected satellite drops.

Low topography thermal inkjet drop ejector structure

A process for precision patterning or cutting of a sheet stock, such as an adhesive tape, includes the step of irradiating a surface of a sheet stock with an irradiation source to pattern or cut a part in the sheet stock. The method is particularly useful for precision cutting adhesive members, such as adhesive fluid seals, for an inkjet print cartridge.

Precision laser cutting of adhesive members

A drive transistor for a high resolution ink jet printhead having a pocket implant in the gate region of the device. The pocket implant enables a reduced source to drain spacing without loss of breakdown voltage. Accordingly, the size of the transistor may be reduced. Alternatively, this device is suitable for addressing 1200 spi resolution printheads. In one embodiment, the pocket implant extends about 1 .mu.m beyond the gate region towards the drain region. Both embodiments produce a graded drift region.

Drive transistor for an ink jet printhead

A high voltage MOS transistor, for use in a thermal ink jet printhead, is fabricated with a single, uniformly thick layer of polysilicon that serves as a field plate over the drift region and a gate over the channel region. The fabrication of the drift region and associated drift oxide is performed in a sequence independent of the device channel stop and field oxide fabrication, allowing the drift region to be optimized by varying the thickness of the drift oxide. Using a field plate to increase the breakdown voltage of the device by reducing the concentration of the electric field, the device transconductance is increased by increasing the doping of the drift region without an attendant decrease in breakdown voltage.

Thermal ink jet printheads with power MOS driver devices having enhanced

An ink jet printhead is disclosed which has improved printhead cooling thereby improving operating efficiency. The printhead is constructed so that the manifold bringing ink from an ink reservoir into an ink inlet to the printer directly contacts the thermally conductive surface of the substrate in which the heater elements are formed- The cooler ink removes some of the accumulated heat from the heater substrate and is subsequently ejected. In one embodiment the printhead comprises an upper channel substrate which is bonded to a lower heater substrate which is formed with a ledge which extends past the rear face of the channel substrate. The channel substrate has an ink inlet formed into its rear face and adjacent to an extended portion of the heater silicon surface. An ink reservoir brings ink to the printhead via an ink manifold which is sealed against the exposed silicon surface and against the side of the ink inlet. In a second embodiment, the formation of an ink inlet at the rear face enables the construction of a compact multicolor sideshooting printhead with 2 rows of nozzles.

Ink jet printhead with improved operation

A method for electrical tailoring of thermal ink jet heater elements. The resistance of ink-jet heater elements formed of polysilicon is changed by applying energy through the resistor element of varying amounts at varying pulse widths. The application of pulsed current for up to 1 second total pulse width at voltages of up to 50 volts decreases the resistance by as much as thirty percent or more of the as fabricated values.

Method for electrical tailoring drop ejector thresholds of thermal ink

An ink-jet printhead fabrication technique enables capillary channels for liquid ink to be formed with square or rectangular cross-sections. A sacrificial layer is placed over the main surface of a silicon chip, the sacrificial layer being patterned in the form of the void formed by the desired ink channels. A permanent layer, comprising permanent material, is applied over the sacrificial layer, and, after polishing the two layers to form a uniform surface, the sacrificial layer is removed. Preferred materials for the sacrificial layer include polyimide while preferred materials for the permanent layer include polyarylene ether, although a variety of material combinations are possible.

Method and materials for fabricating an ink-jet printhead

An ink jet printer is configured in a hybrid architecture wherein a full width printbar is combined with a partial width color scanning assembly to provide the capability of selectively printing in black only or, alternately, of producing color prints by operating the color scan assembly exclusively. The cost of the hybrid system, when compared to a full width color system using four full width printbars, is greatly reduced. Throughput time is reduced by providing the control circuitry for distinguishing between black only and color operation and selectively controlling the printer mode of operation. The hybrid architecture is particularly useful in a LAN system since it provides a mechanism for balancing the relative color versus black page decomposition speed limitations. Also, the hybrid architecture enables a relatively simple implementation of a checkerboarding technique to suppress banding in output prints.

Hybrid ink jet printer

An improved microelectromechanical device, such as a thermal ink jet die or printhead, is formed by the alignment of two planar substrates bonded together by an intermediate thick film layer of patterned polymeric material, such as polyimide. The improved device has a fully cured, patterned thick film layer which is planarized by chemical-mechanical polishing-to improve the bonding strength between the substrates. The planarization removes topographical formations generated during the deposition of the thick film layer and/or during the patterning of the recesses therein.

Micro-electromechanical die module with planarized thick film layer

An ink jet module that can be accurately positioned on a carrier includes a channel die and a heater die. The channel die is rectangular and has a top surface, a bottom surface, a first pair of sides, and a second pair of sides. The bottom surface has a number of spaced parallel channels disposed within it. The channels are parallel to the first pair of sides and extend through one of the second pair of sides. The top surface of the heater die is attached to and aligned with the bottom surface of the channel die. At least one pair of alignment features is disposed within and adjacent a side of the bottom surface of the channel die. The alignment features are recessed areas disposed on opposite sides from each other. The alignment features are dimensioned to receive a retainer that secures the ink jet module to a carrier.

Self-aligned features for accurate etched silicon transducer placement

An electrostatic discharge protection device for a connector associated with an integrated circuit chip, particularly one associated with a thermal ink-jet printhead. AMOS field effect device extends along at least one edge of the connector on the chip. A bipolar transistor, parasitic to the field effect device, conducts current from the connector to ground in response to a voltage between the connector and ground in excess of a predetermined threshold. A zone of a predetermined electrical resistance is operatively disposed between the bipolar transistor and ground. The zone may substantially encircle the bonding pad of the connector to evenly distribute local incidences of high voltage. The invention enables integrated circuits to pass ESD requirements of office products, which is 15 kV by Human Body Model testing.

Office environment level electrostatic discharge protection

Growing community of inventors

Webster, NY, United States of America

William G Hawkins