Olin Corporation

William G Bridges

Thomas A Armer

Kin-Shiung Chang

Craig A Foster

A hydrated calcium hypochlorite agglomerated particle is provided that is produced in a turbine agglomerator and has a plurality of connecting links of recrystallized material bridging the small particles forming the agglomerate which has therein a plurality of pores created by the substantial evaporation of the layer of surface liquid. The surface tension and adhesion forces of the layer of surface liquid at least partially holds the agglomerated particle together prior to drying.

Turbine agglomerated calcium hypochlorite particle and process for the

A pin grid array package is provided. An array of terminal pins pass through apertures formed in an interconnect tape. The terminal pins are electrically connected to circuit traces formed on interconnect tape. The electrically conductive bond between the terminal pins and circuit traces is either by a mechanical cinch by soldering. In one embodiment, at least a portion of the interconnect tape, terminal pins and a heat sink are embedded in a molding polymer resin.

Process for manufacturing plastic pin grid arrays and the product

A hydrated calcium hypochlorite agglomerated particle is provided that is produced in a turbine agglomerator and has a plurality of connecting links of recrystallized material bridging the small particles forming the agglomerate which has therein a plurlaity of pores created by the substantial evaporation of the layer of surface liquid. The surface tension and adhesion forces of the layer of surface liquid at least partially holds the agglomerated particle together prior to drying.

A process for forming an integrated circuit pin grid array package comprising a flexible metal tape adapted for use in tape automated bonding with a plurality of holes. Terminal pins are inserted in the holes and the tapes and pins are disposed within a mold so that a cavity is formed about the pins and tape. The cavity is filled with a polymer resin so as to at least partially surround and support the pins and tape and thereby form the plastic encapsulated pin grid array.

Polymer/copper laminates and a method for their manufacture employing smooth, untreated, wrought-copper and characterized by cohesive and adhesive strength in the resulting laminates.

Polymer/copper laminate and method for fabrication thereof

A process for forming an integral circuit pin grid array package comprising a flexible metal tape adapted for use in tape automated bonding with a plurality of holes. Terminal pins are inserted in the holes and the tape and pins are disposed within a mold so that a cavity is formed about the pins and tape. The cavity is filled with a polymer resin so as to at least partially surround and support the pins and tape and thereby form the plastic encapsulated pin grid array.

In a rotary drum spray grainer there is provided a solid product material exit at the same end as the inlet hot air so that air classification of the solid product material according to size is achieved while the solid product material passes counter-current to the inlet hot air as the solid product material exits the drum.

Air classification in a spray grainer

In a rotary drum spray grainer there is provided a deflector plate overlying the spraying nozzles in the spraying zone to provide a drying zone where spray grained particles fall in a substantially uninterrupted downward path through the drying gas.

Spray grainer

In a rotary drum spray grainer there are provided adjustable spraying nozzles in the spraying zone to achieve optimum spray pattern dispersion on the spray grained particles as the particles fall through the spraying zone.

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San Jose, CA, United States of America

William G Bridges