Apple Inc.

Other

Essential Products, Inc.

William Francis Leggett

Ron Alan Hopkinson

Brett W Degner

Bartley K Andre

Charles A Schwalbach

Mikael M Silvanto

Bradley Joseph Hamel

Gavin J Reid

Christiaan A Ligtenberg

Michelle Rae Goldberg

Matthew Phillip Casebolt

Timothy S Hibbard

Zheng Gao

Laura M DeForest

Joss Nathan Giddings

John Raff

Jay S Nigen

Chris A Ligtenberg

Patrick Kessler

Simon Regis Louis Lancaster-Larocque

Richard H Tan

Jeremy D Bataillou

Houtan R Farahani

John C Difonzo

Kathleen A Bergeron

Brandon S Smith

Gary S Thomason

David M Rockford

Adam T Garelli

John B Morrell

Kevin Scott Fetterman

Frank Faqiu Liang

Derek Yap

Peter M Arnold

Zachary Joseph Zeliff

Chung-Tse Huang

Dinesh C Mathew

Keith J Hendren

Daniel D Sunshine

David John Evans, V

John M Brock

Jason Sean Gagne-Keats

Peteris K Augenbergs

Justin Derry Crosby

Nicholas Alan Rundle

Matthew Theobald

Jesse T Dybenko

Eric Andrew Knopf

Ari P Miller

Cina Hazegh

Paul Joseph Hack

Matthew C Waldon

Sarah J Montplaisir

Ming Kun Shi

Christopher Bruni

Steven J Osborne

Thomas R Tate

Timothy Roger Milberger

Laura Deforest

Eric T Corriveau

Tyler J Ewing

Tom Tate

Christopher J Stringer

Andrew E Rubin

Mahmoud R Amini

David H Narajowski

Jiang Ai

George Tziviskos

John C DiFonzo

Joseph Anthony Tate

Edward J Cooper

Andrew P Bright

Nathan Alan Johanningsmeier

Rebecca Schultz Zavin

Matthew A Donarski

Adithya Gajulapally

Changsoo Jang

Anton Talalayev

Paulina Mustafa

Nikola Cargonja

James Jong-sik Kim

Ari Parsons Miller

A configurable, force-sensitive input structure for an electronic device is disclosed. The input structure has a metal contact layer, a sense layer positioned below the metal contact layer, and a drive layer capacitively coupled to the sense layer. The input structure may also have a compliant layer positioned between and coupled to the sense layer and the drive layer, a rigid base layer positioned below the drive layer, and a set of supports positioned between the metal contact layer and the rigid base layer.

Configurable force-sensitive input structure for electronic devices

A dynamic input surface for an electronic device and a method of reconfiguring the same is disclosed. The input surface has a partially-flexible metal contact portion defining an input area, and a group of indicators. The indicators may be group of holes extending through the contact portion. The group of holes may be selectively illuminated based on a gesture performed on the contact portion. A size of the input area may be dynamically varied based on the gesture. Additionally, the group of indicators indicates a boundary of the input area.

Dynamic input surface for electronic devices

Methods for modifying contours of substrate surfaces are disclosed. Methods include depositing filler material on a critical mating surface of a substrate so as to render the mating surface more mateable with a matching substrate. The filler material can be deposited within or around features or defects on the mating surface such that a final desired surface contour is achieved. In some cases, the final surface contour of the mating surface is planar. This can prevent gaps associated with the features or defects from forming between the substrate and the matching substrate when they are joined together. The final surface contour of the mating surface can be determined by comparing dimensions of the mating surface to dimensions of a reference surface. In some cases, ink jet printing techniques are used to deposit the filler material accurately in prescribed locations and with precise thickness control.

Method for smoothing substrate surface

Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

Techniques for joining one or more structures of an electronic device

A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structured such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.

Adaptive processes for improving integrity of surfaces

Disclosed here are systems and methods which enable high-bandwidth communication between a mobile device and an accessory. The high-bandwidth communication uses electromagnetic waves in the extremely high frequency range between 30 GHz and 300 GHz inclusive, also known as millimeter waves. The millimeter waves travel through at least the chassis of the accessory and the chassis of the mobile device without significant scattering and attenuation. The properties of the materials through which the millimeter waves travel determine the attenuation of the millimeter waves. Disclosed here are various materials, and their thicknesses, which form a transmission stack through which the millimeter waves can travel unimpeded. In effect, the transmission stack acts as a dielectric member which facilitates the transmission of the millimeter waves, while attenuating transmission of waves outside of the extremely high frequency range.

Transmission stack for extremely high frequency wireless communication

Various embodiments include a device that implements a high bandwidth wireless data interface for communication between the device and a device accessory. The device can include an external shell and a display (e.g., a touchscreen). In some embodiments, the external shell and the display together hermetically seal various other components of the device. In various embodiments, the device includes an attachment mechanism, an alignment mechanism (e.g., for magnetic alignment between a device and a device accessory), a wireless data transceiver, and a wired or wireless energy source (e.g., for sharing power between the device and the device accessory). The wireless data transceiver can transmit data at extremely high electromagnetic frequencies between the device in the device accessory.

Communication between devices and device accessories

The present application describes various embodiments of systems and methods for providing internal components for portable computing devices having a thin profile. More particularly, the present application describes internal components configured to fit within a relatively thin outer enclosure.

Internal components of a portable computing device

A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structure such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.

A multipart computer housing is described. The multipart computer housing includes at least a structural support layer and a body. The body includes at least an outer layer formed of lightweight flexible material and an inner layer attached to the outer layer. The inner layer is connected to the support layer forming a load path between the inner layer and the structural support layer. A load applied to the multipart computer housing is transferred by way of the load path to the support layer without substantially affecting the outer layer.

Computer housing

Growing community of inventors

San Francisco, CA, United States of America

William Francis Leggett