Micron Technology Incorporated

William F Jones

Jeffrey P Wright

Wen Qian Li

Victor Wong

Jacob Robert Anderson

Timothy B Cowles

Mark R Thomann

Daniel R Loughmiller

Seth A Eichmeyer

Dean D Gans

Donald M Morgan

Sujeet V Ayyapureddi

Jongtae Kwak

Simon J Lovett

Mark K Hadrick

Apparatuses and methods for targeted row refreshes are disclosed herein. In an example apparatus, a predecoder receives a target row address and determines whether a target row of memory associated with the target row address is a primary or a redundant row of memory. The predecoder is further configured to cause one or more rows of memory physically adjacent the primary row of memory to be refreshed if the primary row is the target row or one or more rows of memory physically adjacent the redundant row of memory to be refreshed if the redundant row of memory is the target row of memory.

Apparatuses and methods for targeted refreshing of memory

Apparatuses and methods for implementing masked write commands are disclosed herein. An example apparatus may include a memory bank, a local buffer circuit, and an address control circuit. The local buffer circuit may be associated with the memory bank. The address control circuit may be coupled to the memory bank and configured to receive a command and an address associated with the command. The address control circuit may include a global buffer circuit configured to store the address. The address control circuit may further be configured to delay the command using one of a plurality of command paths based, at least in part, on a write latency and to provide the address stored in the global buffer circuit to the local buffer circuit to be stored therein.

Apparatuses and methods for implementing masked write commands

Memories, systems, and methods for refreshing are provided, such as a memory with an array of memory cells divided into sections. Memories include replacement elements having a digit line, and detecting circuitry coupled to a digit line of at least one section of the memory cell array and coupled to the digit line of the replacement element. Memories include control logic configured to selectively refresh the replacement element at an occurrence when a non-neighboring section of the memory cell array relative to the replacement element is refreshed. Other memories, systems, and methods are provided.

Systems, memories, and methods for operating memory arrays

Signals are routed to and from identical stacked integrated circuit dies by selectively coupling first and second bonding pads on each of the dies to respective circuits fabricated on the dies through respective transistors. The transistors connected to the first bonding pads of an upper die are made conductive while the transistors connected to the second bonding pads of the upper die are made non-conductive. The transistors connected to the second bonding pads of a lower die are made conductive while the transistors connected to the first bonding pads of the lower die are made non-conductive. The second bonding pads of the upper die are connected to the second bonding pads of the lower die through wafer interconnects extending through the upper die. Signals are routed to and from the circuits on the first and second dies through the first and second bonding pads, respectively.

Circuit and method for interconnecting stacked integrated circuit dies

Systems, memories, and methods for refreshing memory arrays

A method of controlling a delay locked loop (DLL) in a memory device is provided. The DLL generates an internal clock signal based on an external clock signal. The DLL constantly responds to variations in operating condition of the memory device to keep the external and internal clock synchronized. The method involves preventing the DLL from responding to a change in operating condition such as a change in the supply voltage of the memory device during an operational mode of the memory device such as an active mode, a read mode, or a refresh mode.

Controller for delay locked loop circuits

A method of monitoring the characteristics of a delay locked loop (DLL) in a memory device during a test mode is provided. The DLL generates an internal clock signal based on an external clock signal. The external and internal clock signals are normally synchronized. DLL constantly responds to variations in operating condition of the memory device to keep the external and internal clock synchronized. The method involves preventing the DLL from responding to a change in operating condition such as a change in the supply voltage of the memory device during a test mode.

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Boise, ID, United States of America

William F Jones