Google Inc.

Cisco Technology, Inc.

Other

The United States of America As Represented by the United States

William F Edwards

Madhusudan K Iyengar

Robert Gregory Twiss

Jorge Padilla

Houle Gan

Yuan Hang Li

Teckgyu Kang

Woon-Seong Kwon

George Edward Curtis

Keith Frank Tharp

Sandeep Arvindkumar Patel

Chenhao Nan

Earl J Devenport

Ki Yuen Chau

Erick Tuttle

Billie Alton Hudson

Robin Carol Johnson

Ilyas Mohammed

Norman Paul Jouppi

Hong Liu

Ryohei Urata

Frederick Roland Schindler

Yu Liu

Yujeong Shim

Gurushankar Rajamani

Melanie Beauchemin

Woon Seong Kwon

Zuowei Shen

Richard Roy

Sundar Rajan

Xu Zuo

Bradley D Erickson

Yuan Li

Samir Vasavda

Shinnosuke Yamamoto

Michael Kornprobst

Horia Alexandru Toma

Curt Von Badinski

Gilbert E Cruz

Madhusudan Krishnan Iyengar

Eric Tuttle

A method includes forming a module aperture in a printed circuit board assembly ('PCBA'), forming an electronic communication interface extending around the module aperture, and plugging a pluggable processor module into the module aperture, the pluggable processor module comprising a micro-processor package, a voltage regulator, and a contact. An electronic communication interface of the pluggable processor module is placed in contact with the electronic communication interface of the PCBA.

Method of plugging a pluggable processor into a PCBA

The disclosure provides for high bandwidth processing through the sharing of memory dies over a plurality of computing dies via an optical interchange. The optical interchange may be configured so as to operate as both an optical switch and optical demultiplexer. The optical switch configuration for the optical interchange allows for data to be written from any computing die to one of a plurality of memory dies via an optical connection. The optical demultiplexer configuration allows for data to be broadcast from a memory die to a plurality of the computing dies.

Systems for high-speed computing using an optical interchange

An assembly includes a printed circuit board ('PCB'). An aperture extends through the PCB. The assembly also includes an array of pins and a processor package. The array of pins extends around a perimeter of the aperture, and the processor package extends over the aperture. The processor package is pressed against the array of pins by a compressive force couple.

Structure for optimal XPU socket compression

A pluggable processor module includes a microprocessor package, a voltage regulator including a capacitor board, and contacts that each include a first side in contact with the microprocessor package and a second side in contact with the capacitor board. An assembly includes the pluggable processor module and a printed circuit board assembly ('PCBA') including a module aperture that is large enough to receive the power board and narrower than the capacitor board.

Pluggable CPU modules with vertical power

A data center cooling system includes a server rack sub-assembly that includes a motherboard mounted on a support member and a heat generating electronic devices mounted on the a motherboard; a cold plate positioned in thermal communication with at least a portion of the heat generating electronic devices, the cold plate configured to receive a flow of a cooling liquid circulated through a supply conduit fluidly coupled to a liquid inlet of the cold plate, through the cold plate, and through a return conduit fluidly coupled to a liquid outlet of the cold plate; and a modulating control valve attached to either of the motherboard or the support member and positioned in either of the supply conduit or the return conduit, the modulating control valve configured to adjust a rate of the flow of the cooling liquid based on an operating condition of at least one of the heat generating electronic devices.

Cooling electronic devices in a data center

The subject disclosure relates to improved integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved integrated connector module transformer (ICMt), including a wafer configured to hold a plurality of toroid elements, wherein the wafer is comprised of two or more mechanically coupled wafer portions. The ICMt can include one or more Electro Magnetic Interference (EMI) fingers that are configured to contact a ground pad of a printed circuit board (PCB) in order to provide a low-inductance connection between the ICMt and the ground pad of the PCB.

Integrated connector module for automation optimization

The subject matter of this specification generally relates to electronic packages. In some implementations, a lidless electronic package includes a substrate having a surface and a die disposed on the surface of the substrate. The die has an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface. The electronic package includes a stiffener disposed on the surface of the substrate. The stiffener includes a first surface that is a first distance from the surface of the substrate and a second surface disposed between the die and the first surface. The first distance is greater than a distance between the surface of the substrate and the top surface of the die. The second surface is a second distance from the surface of the substrate that is less than the distance between the surface of the substrate and the top surface of the die.

Package stiffener for protecting semiconductor die

The subject disclosure relates improved common mode choke (CMC) and integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved CMC component, including an upper chassis element having a first plurality of comb structures vertically protruding from an edge of the upper chassis element, and a lower chassis element comprising a second plurality of comb structures vertically protruding from an edge of the lower chassis element, the second plurality of comb structures configured to interlock with the first plurality of comb structures to form an enclosure when the upper chassis element is mechanically coupled with the lower chassis element.

Common mode choke and integrated connector module automation optimization

An electrical connector comprises a housing configured to house an interconnect mechanism, which defines an on-axis plane that is coplanar with the long axis of the interconnect mechanism. The housing includes at least two receptacles for accepting coupling mechanisms for interconnecting the connector to an electronic component. The centerline axis of at least one of the receptacles is parallel to the on-axis plane and offset from the on-axis plane. In one embodiment, the housing further comprises a first lip having a long axis that is parallel with the on-axis plane, such that when the connector is interconnected to an electronic component, the first lip applies an off-axis force to the component. The off-axis force is applied to the component along a first off-axis that is different than the on-axis. Consequently, resistance to deflection of the connector is provided, as is a more reliable contact engagement between the connector and the interconnected electronic component.

Electrical connector having enhanced strain relief for signal-sensitive electronic equipment

A frame or similar structure is used for positioning two stacked GBIC connectors within a 1 RU form factor height of a router or similar network device. In one aspect, the frame can be constructed, assembled and/or mounted in the absence of a need for screws or similar connectors and/or tools. Hooks, latches, engaging teeth and the like can engage sections of a chassis base plate, to position the GBIC connectors preferably within a cutout formed in a motherboard. Use of a flex circuit for connecting the GBIC connectors to a motherboard avoids the requirement for high-precision placement for positioning.

Holder for closely-positioned multiple GBIC connectors

An adaptor is provided for effectively converting an opening in the chassis or box of a router (or similar device) from an opening which accommodate a power entry component for a first power type to accommodate a power entry component for a second power type. In one aspect, an adaptor fits in a panel opening which is sized and shaped to receive an IEC-compliant AC power entry component. The adaptor has a window or opening which accommodates, e.g. a four-wire DC power entry component. In one aspect, an adaptor couples to screw holes, such as on either side of an RPS coupler and also receives a standard ground wire log, preferably forming a conductive path from the lug to the screw holes.

AC/DC power accommodation method and apparatus for networking/telecommunications devices

GBIC frames are mounted with respect to one or another or with respect to the printed circuit board so as to facilitate space sufficiency, e.g. of a front or other panel. In one aspect two GBIC frames are mounted in back-to-back fashion on opposite surfaces of a mounting plate of preferably minimal thickness. Plate cut-outs are positioned to accommodate frame feet or other mounting structures in a fashion off-set, on opposite faces, to avoid interference between frame legs. In one aspect, portions of GBICs and frames are received in cut-out or other edges of a PCB so that GBICs in frames straddle a major surface of a PCB to reduce height for accommodating 1RU or other form factors while increasing space efficiency.

Closely-positioned multiple GBIC connectors

A portable water purification and collection system includes a cabinet member having an interior chamber defined by a plurality of side walls, one of which has a vent thereon. Received within the interior chamber and adjacent the vent is a fan for inducing air flow from the atmosphere to the cabinet interior. Between the fan and the vent is an electrostatic air filter for removing particulates from the air as well as a condenser for producing condensate therefrom. The resulting condensate drips into a collection reservoir and then to an ultraviolet light unit that destroys microorganisms within the condensate. From the ultraviolet light unit, the condensate flows to a main reservoir from which it may be dispensed to an external container via a spigot mounted to a cabinet side wall.

Water collection and purification system

A vacuum-to-air interface (10) is provided for a high-powered, pulsed particle beam accelerator. The interface comprises a pneumatic high speed gate valve (18), from which extends a vacuum-tight duct (26), that termintes in an aperture (28). Means (32, 34, 36, 38, 40, 42, 44, 46, 48) are provided for periodically advancing a foil strip (30) across the aperture (28) at the repetition rate of the particle pulses. A pneumatically operated hollow sealing band (62) urges foil strip (30), when stationary, against and into the aperture (28). Gas pressure means (68, 70) periodically lift off and separate foil strip (30) from aperture (28), so that it may be readily advanced.

Pulsed particle beam vacuum-to-air interface

Growing community of inventors

Livermore, CA, United States of America

William F Edwards