Honeywell International Inc.

William F Eaton

Aaron J Meyers

Nigel Victor Spurr

Curtis B Johnson

Michael James Shelley

Kenneth V Bechtold

Ajaykumar Vaidhyanathan

Scott E Michelhaugh

Alex Crawford

Hugh D Gibson

Scott A Vorwald

Abannl B Maxwell

Duncan S Murchie

Daniel D Kilker

Abanni B Maxwell

Patrick H Shannon

Richard T Hayes

Gillian J Madden

A small sensor assembly is produced by encapsulating an inner package within an outer package. The inner assembly can have electrical components and sensors attached to a lead frame. The electrical components can be protected within inner packages that have alignment indentations. The alignment indentations are positioned over the outside edges of the lead frame and, preferably, no electrical components directly underlie the alignment indentations. The inner assembly is held in alignment by movable pins within a mold into which plastic is flowed. The mold is configured to cause some of the plastic to set earlier than the rest of the plastic and to hold the inner assembly in alignment within the mold. The movable pins can be retracted once enough plastic has set to hold the inner assembly. Unset plastic can then flow into the alignment indentations. A sealed sensor assembly is formed once all the plastic has set.

Package design of small diameter sensor

A sensor is associated with a mounting surface. An O-ring is then positioned between the sensor and the mounting surface, such that the O-ring is compressible when the sensor is fixed to the mounting surface. A fixing mechanism is generally provided for permanently fixing the sensor to the mounting surface, such that the O-ring located between the sensor and the mounting surface provides a proper tension thereof which prevents the sensor from being adversely affected by vibration resulting from a harsh vibration environment in which the sensor operates. The fixing mechanism can be implemented as a fixing joint between the sensor and the mounting surface. Additionally, the O-ring and the sensor are configured with respect to one another and the mounting surface to maintain tension in the fixing joint.

Methods and systems for mounting sensors for use in a harsh vibration environment

Latch control methods and systems are disclosed, including a latch that receives power from a motor associated with a latch. A sensor can be provided for monitoring the current consumption of the motor. A microcontroller can control the latch and/or the motor, based on the current consumption data received from the sensor concerning the current consumption of the motor. Monitoring of the current waveform of the motor therefore provides speed and direction feedback data for control of the latch. Additionally, a microprocessor can process instructions for controlling the interaction of the motor, the latch, the sensor and/or the microcontroller. Such a current monitoring control system is made possible by variation in current consumption of the motor during rotation as a result of commutation, which can be interrogated by measuring the voltage drop across the motor or a shunt resistor, or through the use of other current sensors, such as, for example, a Hall-effect type current sensor.

Automotive door latch control by motor current monitoring

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Pearl City, IL, United States of America

William F Eaton