Harris Corporation

Other

William Edward Clark

Joey D Sartin

Gilbert Reeves Perkins

James Joseph Rawnick

Douglas E Heckaman

Walter M Whybrew

Robert C Taylor

Ying-Ming Lee

George C Harrison

Brett A Pigon

Robert J Cavalleri

Brinnan C Riley

Edward J Bajgrowicz

Jay D Warshowsky

Randy Eugene Boozer

Vincent G Karasack

Charles W Kulisan

Robert J Guinn, Jr

Steven R Sprinkle

Interconnect feed devices () are provided for electrically connecting first and second electrical components (). The interconnect feed devices () can include a dielectric shell () with an electrically-conductive coating (), and leads () positioned within individual conduits () of the shell. Each lead () and its associated conduit () can act as a coaxial cable for transmitting radio frequency (RF) energy between the first and second electrical components (). The shell () can be manufactured using a process, such as stereolithography, that allows the shell to be formed with relatively complicated geometries, which in turn can facilitate relatively complicated cable routing.

Interconnect feed devices for electrical components, and processes for manufacturing same

A coaxial connector () which includes first and second contact pins (), an outer contact member () and an inner alignment member (). The inner alignment member can be electrically conductive and coaxially positioned within the outer contact member. The inner alignment member can include at least one substantially tubular portion () with opposing first and second end portions (). Each of the contact pins can include a first end portion () contained within the substantially tubular portion, and a second end portion () which extends beyond a respective end portion () of the inner alignment member. A spring () can be disposed between the first end portions of the respective contact pins to resiliently bias the contact pins in opposing directions.

Coaxial connector

A durable coaxial connector () for providing a reliable signal connection to a printed circuit board (PCB) () while isolating the PCB from mechanical loads that are applied to the connector, and an electrical system incorporating the same. The connector can include a connector body () having a connector interface member (), at least one flange (), and a ground interface member () having a first portion () configured to be fixedly attached to the PCB and a second portion () configured to slideably mate to a ground interface receptacle defined in the connector body. A connector interface can be defined on an inner surface () of the connector interface member. A fastener () can couple the connector body to a heat sink (). A thermally conductive boss () can be provided to mount the connector body () and transfer thermal energy from the connector body to the heat sink.

Coaxial connector for circuit boards

An interconnect structure interconnects electronic modules and includes a backplane assembly formed from a substantially rigid backplane plate that carries RF connectors and a digital motherboard having digital connectors for mating with digital connectors of electronic modules. A controlled impedance interconnect circuit is positioned on the rear surface of the backplane plate and interconnects the RF connectors carried by the backplane plate and digital connectors of the digital motherboard. A rack receives the backplane assembly and supports a plurality of electronic modules that are interconnected to each other via the backplane assembly.

Interconnect structure for interconnecting electronic modules

An antenna includes a substrate including a ground plane and a dielectric layer adjacent thereto and at least one antenna unit carried by the substrate. The at least one antenna unit may include a plurality of adjacent antenna elements arranged in spaced apart relation from one another about a central feed position on the dielectric layer opposite the ground plane. The at least one antenna unit may also include an antenna feed structure including a respective coaxial feed line for each antenna element and a feed line organizer body having passageways therein for receiving respective coaxial feed lines.

Patch dipole array antenna including a feed line organizer body and related methods

An interconnect device for connecting components of high frequency communication systems, including RF and phased array applications. The device is capable of carrying RF and microwave signals between pairs of components and includes an outer conducting tube and an insulated conducting wire disposed within the tube. The outside diameter of the insulated wire is less than the inside diameter of the tube allowing movement of the wire relative to the tube. As a result of this movement, the longitudinal axis of the wire may vary from the longitudinal axis of the tube resulting in a &ldquo;sloppy coax&rdquo; interconnect. The ability of the wire to move within the tube facilitates installation and replacement of the wire when required.

Sloppy coax interconnect for low cost RF and phased array applications

A cast core process is used to fabricate a very small, precision wound helical antenna having readily repeatable configuration parameters for use in a high GHz multi-element (e.g., phased array) antenna. A dielectric core member is formed by shaping a solid mandrel having a precision helical groove. After a mold is formed around the mandrel and cured, the mandrel is extracted, so that it may be used to make additional identical molds. A dielectric mixture is injected into the mold's cavity, and cured. The mold is then removed, and antenna wire is tightly wound and bonded into the dielectric core's helical groove. The antenna wire-wrapped core is then mechanically and electrically attached to a baseplate laminate structure, that includes a tuning circuit, so that the antenna may be physically mounted to a support member and connected to an associated transmit&mdash;receive module.

Cast core fabrication of helically wound antenna

A one-piece, substantially flat and very thin heat exchanger core in accordance with this invention has two flat and parallel surfaces, with each of said surfaces being suitable as a mounting surface for a number of heat producing electronic chips. These surfaces are closely spaced and separated by a single cavity for conveying a fluid coolant, and the cavity contains a plurality of closely spaced pins extending the full distance between the parallel surfaces. The pins are formed and permanently joined to both of the parallel surfaces, and quite significantly, this is accomplished with creation of a seam. Each pin is capable of having a hole installed through for its entire length, from one of the flat surfaces to the other, without breaching the fluid cavity and without creating a path for fluid to leak from the fluid cavity to the ambient. Also significant is the novel method by which this heat exchanger is constructed.

Liquid-cooled, flat plate heat exchanger

A low frictional loss, rotary vane gas compressor utilizing a housing having a generally elliptical cavity therein, and a rotor disposed in the cavity, with the axis of rotation of the rotor being offset from the central axis of the cavity. The housing has an inlet passage and a discharge passage, each in contact with the cavity, with the rotor having a plurality of radial slots in equally spaced relation about its periphery. A slidable vane is disposed in each of these slots, with the outer tip of each vane being in close proximity to an inner stator wall that defines the outer boundary of the cavity. The vanes serve to define a plurality of chambers in the cavity, which chambers undergo significant volume changes as they move about the cavity during rotation of the rotor, the vanes thus cooperating with the inner stator wall to compress gas entering the inlet passage, such that as it leaves through the discharge passage, it is at a higher pressure. Means provide a film of lubricant on the inner stator wall, with the outer tips of the vanes each possessing a compound contour that interacts with the film of lubricant to effect a good seal with the inner stator wall, while minimizing friction.

Growing community of inventors

Palm Bay, FL, United States of America

William Edward Clark