Robotic Vision Systems, Inc.

William E Yonescu

Howard K Stern

Alex Mauro

Pat V Costa

Steven J Bilodeau

Sullivan Chen

Joseph Vaiana

Donald Fritz

Daniel A Briceno

A method and apparatus are provided for efficiently using 3-D vision systems to measure selected structural features of objects that have a uniform geometric arrangement. The method and apparatus are particularly well suited for optimizing the 3-D measurement of a multiple lead frame, leads of integrated circuit devices mounted on the multiple lead frame, and ball grid array integrated circuit devices on a wafer. For obtaining the three-dimensional data, corresponding sides of the multiple lead frames or devices are scanned sequentially in a row or column with at least one three dimensional sensor. This scanning procedure is repeated for all rows and columns containing structural features of the devices for which data are to be obtained. The acquired three-dimensional device geometry data are compared with the intended predetermined geometry to produce a signal indicative of a deviation of an actual device geometry from the intended predetermined geometry that exceeds a specified tolerance.

Apparatus and method for obtaining three-dimensional data from objects

Methods and arrangements are provided to efficiently use 3-D vision systems to measure selected features, of objects that are semi-constrained in compartmented trays having a uniform geometric arrangement. The methods are particularly well suited for optimizing the 3-D measurement of leads on integrated circuit devices which are packaged in trays. For obtaining the three-dimensional data, a multi-pocketed tray can be provided with tray pockets arranged in rows and columns, and corresponding sides of the multiple parts or devices in a row or column are scanned sequentially with at least one three dimensional sensor. This scanning procedure is repeated for all rows and columns containing sides of the devices from which data is to be obtained. The devices can be first aligned by applying directional vibration to the tray to drive all the parts or devices to the same corner or side of the respective pockets. The collected device geometry data is fed back to the manufacturing operation to control the parameters thereof.

Method for obtaining three-dimensional data from semiconductor devices

A position sensing detector in which each of a plurality of sensing channels is provided with ends and an output current lead at each end of each channel. A light spot is imaged along the length of the channel. The channels are electrically isolated from each other. The channels may be proportional to a selected keystone pattern, and the channels may be rectangular-shaped and accommodate keystoning effects of an imaged beam.

Multichannel position sensing detector

Apparatus for obtaining three-dimensional data from multiple parts or

A scanning system inspects elements, such as ICs, continuously by positioning a second tray containing elements to be inspected adjacent a scan bed in which the elements in a first tray are being scanned. Immediately upon completion of scanning of elements in the first tray, scanning begins on elements in the second tray. During scanning of the second tray, the first tray is off loaded, and a third tray replaces the first tray. The cycle is repeated continuously. Since transport and scanning operations take place simultaneously, transport delay is reduced substantially, as compared to the serial system of the prior art. When the transport, positioning, and off loading operations consume substantially less time than the scanning operation, a fresh tray of elements always awaits scanning upon completion of scanning of elements in a tray. In one embodiment, first and second scan beds are elevated above a conveyor, thereby permitting incoming and outgoing trays to pass on the conveyor below the scan beds without interference with the trays elevated in the scan beds. A replace operation, either on-line or off-line, replaces defective elements detected in the scanned trays with known-good elements, whereby the output of the apparatus is 100 percent known-good elements. An embodiment in which transport and positioning takes longer than the scanning operation, thereby requiring a delay in scanning, is disclosed. This latter embodiment, although it does not provide continuous scanning, nevertheless reduces cycle time by virtue of parallel operation of scanning and transport functions.

Dual-bed scanner with reduced transport time

A scanning system inspects elements, such as ICs, continuously by positioning a second tray containing elements to be inspected adjacent a scan bed in which the elements in a first tray are being scanned. Immediately upon completion of scanning of elements in the first tray, scanning begins on elements in the second tray. During scanning of the second tray, the first tray is off loaded, and a third tray replaces the first tray. The cycle is repealed continuously. Since transport and scanning operations take place simultaneously, transport delay is reduced substantially, as compared to the serial system of the prior art. When the transport, positioning, and off loading operations consume substantially less time than the scanning operation, a fresh tray of elements always awaits scanning upon completion of scanning of elements in a tray. In one embodiment, first and second scan beds are elevated above a conveyor, thereby permitting incoming and outgoing trays to pass on the conveyor below the scan beds without interference with the trays elevated in the scan beds. A replace operation, either on-line or off-line, replaces defective elements detected in the scanned trays with known-good elements, whereby the output of the apparatus is 100 percent known-good elements. An embodiment in which transport and positioning takes longer than the scanning operation, thereby requiring a delay in scanning, is disclosed. This latter embodiment, although it does not provide continuous scanning, nevertheless reduces cycle time by virtue of parallel operation of scanning and transport functions.

An arrangement for inspecting straightness of an array of pins in which the array is illuminated by a thin beam of light. Images of surfaces of the array of pins that are illuminated are projected on a photo-sensitive device. The array of pins is movable relative to the beam of light and the imaging device. The imaging device and photo-sensitive device are also movable relative to the array of pins.

System for inspecting pin grid arrays

Segmented position sensing detector for reducing non-uniformly

Methods and arrangements are provided to efficiently use 3-D vision systems to measure selected features of objects that are semi-constrained in compartmented trays having a uniform geometric arrangement. The methods are particularly well suited for optimizing the 3-D measurement of leads on integrated circuit devices which are packaged in trays. For obtaining the three-dimensional data, a multi-pocketed tray is provided with tray pockets arranged in rows and columns. Corresponding sides of the multiple parts or devices in a row or column are scanned sequentially with at least one three-dimensional sensor. This scanning procedure is repeated for all rows and columns containing sides of the devices from which data is to be obtained. The devices can be first aligned by applying directional vibration to the tray to drive all the parts or devices to the same corner or side of the respective pockets.

Method for obtaining three-dimensional data from multiple parts or

Methods and arrangements are provided to efficiently use 3-D vision systems to measure selected features of objects that are semi-constrained in compartmented trays having a uniform geometric arrangement. The methods are particularly well suited for optimizing the 3-D measurement of leads on integrated circuit devices which are packaged in trays.

An inspection system for irregular objects such as solder joints wherein the system utilizes first and second sensors adapted to be pivotable about a common pivot axis and such that the projection axes of the sensors and the pivot axes are able to intersect at a common.

System for 3-D inspection of objects

A practice for developing data for use in the three-dimensional location of the points on an object surface wherein first and second sensor means are used to cause first and second electromagnetic radiation to be directed at the object surface at first and second directions which are in a common plane.

Method and apparatus for three dimensional object surface determination

A system for object surface determination in which the projector/detector sensor of the system is controlled by a control detector which is responsive to a plurality of different parts of a portion of the reflected radiation being sensed by the projector/detector sensor.

Three dimensional object surface determination with automatic sensor

A method and apparatus is provided for calibrating distance measuring instruments, in particular, optical three dimensional measurement sensors. The method is not restricted to aligning the motion of the calibrating surface to be parallel to the sensor centerline. Accordingly more than one sensor can be present during the calibration procedure. This leads to the practicality of aligning multiple sensor systems using a common translation stage for all sensors or using translation stages that are a part of the system. The joint calibration of sensors embedded in a system guarantees proper registration without additional steps. A method for calibrating optical sensors to accuracies approaching the wavelength of light is given.

Growing community of inventors

Smithtown, NY, United States of America

William E Yonescu