Trw Limited

William E McMullen

Ryan S Berkely

William D Bjorndahl

Mary C Massey

Steven F VanLiew

Kenneth C Selk

Cindy S Fietze

Alexander Krayner

Rene R Martinez

M David Saferstein

A multilayer wiring board comprises a substrate having a plurality of layers of reinforced resin material &prime;, a patterned conductive layer &prime; provided on at least one major surface of the substrate, a plurality of via holes provided at least partly through the substrate, and a plurality of signal carrying wires &prime;. The signal carrying wires &prime; are provided between at least two of the layers of reinforced resin material &prime;. The signal carrying wires &prime; can be embedded in a resin layer &prime;, and the resin layer &prime; sandwiched between a pair of the layers of reinforced resin material. The reinforced resin material is preferably a fiber reinforced resin material, such as a glass fiber reinforced epoxy or polyimide material. In some applications, a constrained core &prime;, e.g., a copper/ molybdenum/copper laminate, can be provided between a major surface of the substrate and the pair of reinforced resin layers sandwiching the signal carrying wires &prime;. The board can be used in a multilayer wiring package wherein a plurality of integrated circuit chips are mounted on a major surface of the board . Applications include digital, high-speed digital and RF interconnects.

Multilayer wiring board and multilayer wiring package

A multi-chip module or other electronic semiconductor component (1) contains a multi-layer substrate (9) whose bottom surface, the bottom of the bottom layer (15) of that substrate, serves as the bonding surface for bonding the multi-chip module or component to a printed wiring board (8) using a thermally sensitive adhesive, such as a thermally sensitive adhesive or solder. The bottom layer (15) of that multi-layer substrate integrally includes a plurality of electrical heaters (16-28), arranged side by side. When energized with appropriate current, the heater generates sufficient heat to weaken the adhesive bond, allowing the MCM to be pulled away from the printed wiring board and removed, without weakening the bonding of the multiple layers of the laminate substrate or weakening the MCM component's bond to that substrate.

Integral heater for reworking MCMS and other semiconductor components

Growing community of inventors

Redondo Beach, CA, United States of America

William E McMullen