Blackberry Corporation

Wemtec Inc.

E-tenna Corporation

Paratek Microwave Incorporated

Research in Motion Corporation

Actiontec Electronics, Inc.

Other

Atlantic Aerospace Electronics Corporation

Freescale Semiconductor,inc.

Nxp Usa, Inc.

E. I. Du Pont Nemours and Co.

Kaga Electronics Co., Ltd.

Titan Systems Corporation/aerospace Electronic Division

Titan Aerospace Electronics Division

Titan Aerospace Electronic Division

William E McKinzie, Iii

Heinz Bachmann

Rodolfo Enrique Diaz

Gregory Mendolia

Greg Mendolia

James H Martin

James D Lilly

Greg S Mendolia

Cornelis Frederik Du Toit

Deirdre A Ryan

Izz Khayo

Keith Ronald Manssen

Shawn D Rogers

Victor C Sanchez

Andrew Humen, Jr

Gregory S Mendolia

James MacDonald

James Oakes

Walter Parmon

Lawrence Rubin

David T Auckland

John Dutton

Steven L Garrett

Edward Horne

Shelby K Starks

Deepukumar M Nair

Edward Provo Wallis Horne

Michael Arnett Smith

James M Parisi

James T Aberle

Elizabeth D Hughes

Trent M Jackson

Eric Caswell

James Y Scott

Jeramy M Marsh

Yizhen Lin

Mark Reed

James Martin

A system that incorporates teachings of the present disclosure can include, for example, an apparatus having a matching network adapted to reduce a magnitude of a signal reflection at a port of the matching network. The matching network can have one or more controllable variable reactive elements. A controller can be adapted to determine reflection coefficient information from incident and reflected waves sampled at the port of the matching network, and follow at least one cycle of a coarse tune process for generating one or more control signals to tune one or more reactances of the one or more controllable variable reactive elements. Additional embodiments are disclosed.

Adaptive matching network

A system that incorporates teachings of the present disclosure may include, for example, a first solid electrode, a second electrode separated into subsections, and a dielectric medium separating the subsections from the first solid electrode, where the subsections of the second electrode include a first group of subsections and a second group of subsections, where the first group of subsections are connectable with a first terminal for receiving an input signal, and where the second group of subsections is connectable with a second terminal for providing an output signal. Other embodiments are disclosed.

Thin films capacitors

A system that incorporates teachings of the present disclosure may include, for example, an adaptive impedance matching network having an RF matching network coupled to at least one RF input port and at least one RF output port and comprising one or more controllable variable reactive elements. The RF matching network can be adapted to reduce a level of reflected power transferred from said at least one input port by varying signals applied to said controllable variable reactive elements. The one or more controllable variable reactive elements can be coupled to a circuit adapted to map one or more control signals that are output from a controller to a signal range that is compatible with said one or more controllable variable reactive elements. Additional embodiments are disclosed.

Method and apparatus for adaptive impedance matching

An embodiment of the present invention provides an apparatus, comprising' an RF matching network connected to at least one RF input port and at least one RF output port and 5 including one or more voltage or current controlled variable reactive elements; a voltage detector connected to the at least one RF output port via a variable voltage divider to determine the voltage at the at least one RF output port and provide voltage information to a controller that controls a bias driving circuit which provides voltage or current bias to the RF matching network; a variable voltage divider connected to the voltage detector and implemented using a 10 multi-pole RF switch to select one of a plurality of different resistance ratios to improve the dynamic range of the apparatus; and wherein the RF matching network is adapted to maximize RF power transferred from the at least one RF input port to the at least one RF output port by varying the voltage or current to the voltage or current controlled variable reactive elements to maximize the RF voltage at the at least one RF output port.

Adaptive impedance matching apparatus, system and method with improved dynamic range

An embodiment of the present disclosure provides a circuit including an antenna having a tunable component. The tunable component can be operable to receive a variable signal to cause the tunable component to change a reactance of the antenna. The tunable component can include a first conductor coupled to the antenna, a second conductor, and a tunable material positioned between the first conductor and the second conductor, where at least one of the first conductor or the second conductor, or both are adapted to receive the variable signal to cause the change in the reactance of the antenna. Additional embodiments are disclosed.

Tunable microwave devices with auto-adjusting matching circuit

An embodiment of the present disclosure provides an impedance matching circuit including a matching network. The matching network includes a first port and a second port, and one or more variable reactance components. The one or more variable reactance components are operable to receive one or more variable voltage signals to cause the one or more variable reactance components to change an impedance of the matching network. At least one of the one or more variable reactance components includes a first conductor coupled to one of the first port or the second port of the matching network, a second conductor, and a tunable material positioned between the first conductor and the second conductor. Additionally, at least one of the first conductor and the second conductor are adapted to receive the one or more variable voltage signals to cause the change in the impedance of the matching network. Additional embodiments are disclosed.

Substrates and methods to fabricate and use millimeter wave Sievenpiper EBG structures such that the conductive portions are internal to an LTCC package.

Method of fabricating electromagnetic bandgap (EBG) structures for microwave/millimeterwave applications using laser processing of unfired low temperature co-fired ceramic (LTCC) tape

An integrated antenna package includes an interposer, an integrated circuit die, and a cap that forms a cavity within the integrated antenna package. A lossy EBG structure resides at the cap overlying the integrated circuit device. A lossless EBG structure resides at the cap overlying a microstrip feedline. A radar module includes a plurality of receive portions, each receive portion including a parabolic structure having a reflective surface, an absorber structure, a lens, and an antenna.

Radar module

Electromagnetic slow wave structures (SWS) comprised of arrays of conductive obstacles are formed inside conductive parallel-plate waveguides These SWS may be formed using, for example, MEMS manufacturing processes at the wafer level on substrates including ceramic and silicon. An effective relative permittivity in the range of 15 to 40 may be obtained at millimeterwave frequencies. The SWS can be made absorptive by incorporating resistive losses in a plate of the PPW. Applications of these slow wave structures include delay lines and bootlace lens beamformers for microwave and millimeterwave antenna systems.

Absorptive electromagnetic slow wave structures

An antenna system is described which is comprised of an artificial magnetic conductor (AMC), an antenna element, and a feed network comprised of shielded feedlines whose outer conductor, or shield, is routed through the substrate of the AMC. The feedline outer conductor is connected to both the substantially continuous conductive surface and the array of capacitive patches forming the AMC. The shielded feedline suppresses the excitation of undesired TM modes within the AMC substrate, results in a stable return loss over a frequency range associated with the AMC's high surface impedance and surface wave bandgap.

Artificial magnetic conductor antennas with shielded feedlines

Thin film capacitors

Growing community of inventors

Fulton, MD, United States of America

William E McKinzie, Iii