Tektronix, Inc.

William E Berg

Andrew E Finkbeiner

Jonathan C Lueker

John L Addis

An inductor and carrier suitable for mounting on a mounting substrate includes an etched sheet of a bonded copper layer and polyimide film to form a film carrier. The periphery of the film carrier is patterned with a plurality of windows and a plurality of conductors, each conductor having a bent-up tab and and end portion terminating at the periphery within the respective window. A microminiature inductor core having a plurality of insulated windings is soldered to the respective bent-up tab of each conductor and the end portion of each conductor is then welded to bonding pads on the mounting substrate.

Inductor and carrier suitable for attaching to a hybrid substrate or the

A switch device comprises a resilient contact member and a support member carrying the contact member. The support member is movable between a first position in which the contact member is in electrically-conductive contact with two conductor elements that are stationary relative to each other and a second position in which the contact member is spaced from at least one of the conductor elements. A resilient member urges the support member in the direction from the second position towards the first position.

Switch device

An edge connector for connecting a conductor run on an edge region of a first circuit board to a conductor run of a second circuit board comprises a plate of dielectric material. The plate has a generally U-shaped portion, with the two limbs of the U defining a slot therebetween. The plate of dielectric material may be attached to the second circuit board in a position such that an edge region of the first circuit board may be received in the slot. A signal conductor is adhered to one main face of the plate of dielectric material and has two end portions. One end portion of the signal conductor projects from one of the limbs of the U into the slot for engaging a conductor run on the edge region of the first board, and the other end portion projects from the plate at a location remote from the slot for contacting a conductor run of the second board.

Electrical connector for circuit boards

A substrate structure having contact pads is mounted to a circuit board which has pads of conductive material exposed at one main face of the board and has registration features which are in predetermined positions relative to the contact pads of the circuit board. The substrate structure is provided with leads which are electrically connected to the contact pads of the substrate structure and project from the substrate structure in cantilever fashion. A registration element has a plate portion and also has registration features which are distributed about the plate portion and are engageable with the registration features of the circuit board, and when so engaged, maintain the registration element against movement parallel to the general plane of the circuit board. The substrate structure is attached to the plate portion of the registration element so that the leads are in predetermined position relative to the registration features of the registration element. The registration features of the registration element are brought into engagement with the registration features of the circuit board, and in this position of the registration element the leads of the substrate structure overlie the contact pads of the circuit board. A clamp member maintains the leads in electrically conductive pressure contact with the contact pads of the circuit board.

Method of mounting a substrate structure to a circuit board

A contact device comprises a resiliently deformable member having two opposite surface regions, and strips of conductive material bonded to the deformable member at one of its two opposite surface regions. The strips of conductive material are of substantially uniform width, substantially parallel to each other and substantially uniformly spaced from each other. The width and spacing of the strips are less than the width and spacing of the terminal areas of the conductor runs that are to be connected by means of the contact device, so that each terminal area contacts at least two strips of the contact device.

Contact device

An integrated circuit is mounted on the front face of a substrate of dielectric material and the substrate is fitted in an aperture that extends through a circuit board. The substrate has contact elements distributed about the periphery of its front face, and the circuit board has corresponding contact elements on its front face distributed about the periphery of the aperture. A first clamping member is positioned at the back face of the circuit board so as to extend over the aperture in the circuit board. The first clamping member is made of thermally-conductive material and is in thermally-conductive contact with the back face of the substrate. A second clamping member is positioned at the front face of the circuit board and extends at least partially over the peripheral area of the front face of the substrate. A resilient member is effective between the second clamping member and both the substrate and the circuit board. Fastening elements are used to draw the clamping members together and thereby press the resilient member into firm contact with the substrate and the circuit board. The resilient member has portions of conductive material that connect the contact elements of the substrate to the corresponding contact elements of the circuit board.

Connection apparatus for integrated circuit

A unitary electronic circuit element has an interconnect surface at which it is provided with contact pads and is mounted on a circuit board using a flexible, sheet-form interconnect member that comprises dielectric material and runs of electrically conductive material. Each conductor run extends between a contact pad that is exposed at a first main face of the interconnect member and a termination point that is exposed at a second main face of the interconnect member. The interconnect surface of the electronic circuit element and the second main face of the interconnect member are placed in mutually confronting relationship, and the circuit element is attached to the second main face of the interconnect member by way of its interconnect surface, whereby electrically conductive contact is established between the contact pads of the circuit element and the corresponding termination points of the interconnect member. The circuit element is attached by way of its back face to a thermally conductive plate that has, at one main face, pressure pads that at least partially surround a circuit element receiving area of the plate. The first main face of the interconnect member and the main face of the circuit board are placed in mutually confronting relationship, with the contact pads of the interconnect member touching corresponding contact pads of the circuit board. The plate and the circuit board are clamped together, whereby the pressure pads supply contact force to maintain the contact pads of the interconnect member in electrically conductive pressure contact with the corresponding contact pads of the circuit board.

Mounting a hybrid circuit to a circuit board

An integrated circuit chip is mounted to an etched circuit board using a flexible, sheet-form interconnect member that comprises dielectric material and runs of electrically conductive material each run extending between a contact pad that is exposed at a first main face of the interconnect member and a termination point that is exposed at a second main face of the interconnect member. The interconnect face of the chip and the second main face of the interconnect member are placed in mutually confronting relationship, and the chip is attached to the second main face of the interconnect member by way of its interconnect face, whereby electrically conductive contact is established between the contact pads of the chip and corresponding termination points of the interconnect member. The chip is attached by way of its back face to a thermally conductive plate that has, at one main face, pressure pads that at least partially surround a chip receiving area of the plate. The first main face of the interconnect member and the main face of the circuit board are placed in mutually confronting relationship, with the contact pads of the interconnect member in registration with corresponding contact pads of the circuit board. The plate and the circuit board are clamped together, whereby the pressure pads supply contact force to maintain the contact pads of the interconnect member in electrically conductive pressure contact with the corresponding contact pads of the circuit board.

Mounting an integrated circuit chip to an etched circuit board

This disclosure describes an electrical connector for joining microcircuit or microcircuit modules, such as leadless integrated or hybrid circuit carriers to utilization means, such as printed or etched circuit boards or similar means. The electrical contacts through which the microcircuit and utilization means are connected are formed and etched in place on an elastomeric material, precisely located; the material acting as a restoring force to maintain connection. The connector when used in a system maintains transmission line mediums in a single environment.

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Portland, OR, United States of America

William E Berg