Mitsubishi Materials Corporation

Ontrak Systems, Inc.

Ebara Corporation

William Dyson, Jr

Scott Chin

Tanlin K Dickey

John J Geraghty

Alan John Jensen

Lynn S Ryle

Gerard S Maloney

Norman A Mertke

Patrick Paino

Huey-Ming Wang

Gerard S Moloney

The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms. The invention also provides a retaining ring having a special edge profile that assists in smoothing an pre-compressing the polisihng pad to increase polisihng uniformity. A method for polisihing and a semiconductor manufacture is also provided.

Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring

The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms. In another embodiment, the invention includes a single-or multiple-chambered wafer carrier or subcarrier capable of modifying a differential polishing pressure across the surface of the wafer or other substrate. The chambered-subcarrier permits customization of polishing pressure across the surface of the wafer to achieve greater material removal uniformity. The invention also provides a retaining ring having a special edge profile that assists in smoothing an pre-compressing the polishing pad to increase polishing uniformity. A method for polishing and a semiconductor manufacture is also provided by embodiments of the invention.

Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control

A method for rotating wafers in a double sided scrubber where a rotating roller imparts rotary motion to a semiconductor wafer during a double sided cleaning process. The rotating roller and wafer contact at their outer edges and the friction between their outer edges causes the wafer to rotate. The roller has an outer edge with a groove in which the wafer edge is pinched. Treads or grooves extending from the groove channel liquids away from the groove to prevent wafer slippage when rotating and cleaning solutions are applied to the wafer.

Method for processing a substrate using a system having a roller with

A method and apparatus for rotating wafers in a double sided scrubber where a rotating roller imparts rotary motion to a semiconductor wafer during a double sided cleaning process. The rotating roller and wafer contact at their outer edges and the friction between their outer edges causes the wafer to rotate. The roller has an outer edge with a groove in which the wafer edge is pinched. Treads or grooves extending from the groove channel liquids away from the groove to prevent wafer slippage when rotating and cleaning solutions are applied to the wafer.

Roller with treading and system including the same

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San Jose, CA, United States of America

William Dyson, Jr