Mesatronic

William Daniau

Vincent Reynaud

Andre Belmont

The invention relates to a process for manufacturing a card with multiple tips, designed in particular for testing semiconductor chips or integrated circuits before encapsulation thereof and comprising an oxidised silicon substrate,on the two opposite surfaces, one of the surfaces being provided with conducting strips connected to contacts in the form of tips,. A thin metal layer,is deposited by vapour deposition in a vacuum or by cathode sputtering on one of the insulated surfaces of the monolithic substrate,, and the conducting strips are obtained by means of a UV photolithography operation making use of a photosensitive resin, followed by etching of the thin metal layer,according to the location and shape of the tips,. Another UV photolithography operation is then performed consisting in depositing a thick layer,of photosensitive resin on the thin etched layer, the resin then being revealed with the drawing,of the tips. The tips,are finally obtained by electroforming by means of a bath containing metal ions enabling electroformed pads corresponding to the shape of the drawings,to be achieved.

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Besancon, France

William Daniau