Hewlett-packard Development Company, L.p.

William Dale Youngman

Brandon Rubenstein

Kin Shing Tam

Interconnect validation instruments and methods are provided. In one embodiment, an interconnect validation instrument has a shell with an opening at first end thereof and a second end opposite the first end. The second end has a plurality of holes. Each of the plurality of holes is adapted to receive a respective one of a plurality of pins therein. Each of the plurality of holes is further adapted to align the respective one of the plurality of pins when received therein when the respective one of the plurality of pins is not aligned.

Interconnect validation instruments

An interconnect system is described herein. The interconnect system includes a module having a signal device and a ground substantially surrounding the signal device; a cable having a cable shielding to electrically couple with the ground, and a cable signal line disposed within the cable shielding to electrically couple with the signal device; and a housing assembly interposed between the module and the cable. The housing assembly includes: (a) an inner housing signal line that electrically couples the cable signal line of the cable with the signal device; and (b) a conductive housing that electrically couples the cable shielding with the ground. The conductive housing substantially surrounds and electrically shields the inner housing signal line. The signal device includes a plurality of signal pins, and the plurality of signal pins electrically couple with a pin receptor of the inner housing signal line of the housing assembly.

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Rocklin, CA, United States of America

William Dale Youngman