International Business Machines Corporation

William D McClafferty

Roger R Schmidt

Gary Franklin Goth

John J Loparco

Daniel J Kearney

Donald W Porter

David J Delia

Randall G Kemink

Jody A Hickey

Peter W Kelly

Willard S Harris

An integrated cooling unit configured to effect the removal of heat via a circulating liquid coolant includes a reservoir to contain the liquid coolant, a tubing arrangement disposed at an outer surface of the reservoir, a pump disposed within the reservoir, and a fan configured to provide a flow of air across the tubing arrangement to remove the heat. The tubing arrangement is fluidly communicable with a heat exchanging device, and the pump is configured to circulate the liquid coolant through the tubing arrangement to the heat exchanging device.

Evaporator with air cooling backup

A constant impedance air baffle assembly having two spaced apart generally parallel plates, each having a plurality of through holes for placing in line with a plurality of circuit cards to be cooled. The circuit cards are mounted on one side of a printed circuit board, and arranged in varying numbers and placements, depending on the number of cards desired. The air baffles provide a constant impedance to the air flow over the cards such that air does not bypass other components that need to be cooled when the circuit cards are removed. Further, the baffle plates include hanger tabs which may be hung over the edge of a printed circuit board to hold the parallel plates in place. The hanger tabs further include spacing slots for holding a pair of side-by-side printed circuit boards apart such that the printed circuit boards upon which said air baffle is hung cannot flex and short the pins on the backs thereof together.

Constant impedance air baffle for cooling of electronic card assemblies

Heat pipes are employed in conjunction with flexible flap thermal conductors to provide a mechanism for cooling high-powered electronic circuit chip modules which cannot otherwise be cooled by conventional means because of their non-coplanarity and their inaccessibility. More particularly, the present invention provides a mechanism for cooling electronic circuit chip modules which are disposed on circuit boards which are in close proximity to one another which fact precludes air cooling of heat sink structures and/or the imposition of a liquid-cooled cold plate due to the non-coplanarity and/or due to the inaccessibility.

Cooling device for hard to access non-coplanar circuit chips

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New Paltz, NY, United States of America

William D McClafferty